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1. 发明申请

WO2014200515A1 PLASTIC CARDS WITH HIGH DENSITY PARTICLES 审中-公开
标题翻译：具有高密度颗粒的塑料卡
公开(公告)号：WO2014200515A1
公开(公告)日：2014-12-18
申请号：PCT/US2013/054227
申请日：2013-08-08
申请人： COMPOSECURE, LLC
发明人： HERSLOW, John , PAULSON, Bradley, A. , FINN, David
IPC分类号： B29K305/00
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/36 , B32B2274/00 , B32B2425/00 , B42D25/23 , B42D25/36 , B42D25/373 , G06K19/02
摘要： High density metal or mineral particles, sized to be less than 10 microns, are compounded into a base plastic layer to form a compounded composite layer used to form the core layer of the card, any layer of the card or the entire card. The amount of high density particles compounded into the plastic layer is controlled so the card: (a) is at least twice as heavy as any standard PVC card; (b) can be manufactured using standard current plastic card equipment and tooling, (c) is not brittle; and (d) is electrically non-conductive whereby it is not subject to electrostatic discharge properties. The card can include RFID functionality integrated into the card body. The compounded composite layer does not interfere with the integrity of the data communication between an RFID chip packaged in an antenna module and coupled with an embedded booster antenna, and a contactless reader or terminal.
摘要翻译：尺寸小于10微米的高密度金属或矿物颗粒被复合到基础塑料层中以形成用于形成卡的芯层，卡的任何层或整个卡的复合复合层。混合到塑料层中的高密度颗粒的量被控制，使得卡（a）至少是任何标准PVC卡的两倍; （b）可以使用标准的当前塑料卡设备和工具制造，（c）不易碎; 和（d）不导电，由此不受静电放电性能的影响。该卡可以包括集成到卡体内的RFID功能。复合复合层不会干扰封装在天线模块中的RFID芯片与嵌入式增强天线耦合的数字通信的完整性以及非接触读取器或终端。

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