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1. 发明申请

WO2011104640A1 AQUEOUS POLISHING AGENT AND GRAFT COPOLYMERS AND THEIR USE IN PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES 审中-公开
标题翻译：水性抛光剂和共聚物及其在抛光图案和非结构化金属表面处理中的应用
公开(公告)号：WO2011104640A1
公开(公告)日：2011-09-01
申请号：PCT/IB2011/050237
申请日：2011-01-19
申请人： BASF SE , RAMAN, Vijay, Immanuel , GUBAYDULLIN, Ilshat , BRANDS, Mario , LI, Yuzhuo , PERETOLCHIN, Maxim , BASF (CHINA) COMPANY LIMITED
发明人： RAMAN, Vijay, Immanuel , GUBAYDULLIN, Ilshat , BRANDS, Mario , LI, Yuzhuo , PERETOLCHIN, Maxim
IPC分类号： C09G1/02 , C09K3/14
CPC分类号： C09G1/02 , C08F283/00 , C09K3/1463 , C08F220/32
摘要： An aqueous polishing agent, comprising, as the abrasive, at least one kind of polymer particles (A) finely dispersed in the aqueous phase and having at their surface a plurality of at least one kind of functional groups (a1 ) capable of interacting with the metals and/or the metal oxides on top of the surfaces to be polished and forming complexes with the said metals and metal cations, the said polymer particles (A) being preparable by the emulsion or suspension polymerization of at least one monomer containing at least one radically polymerizable double bond in the presence of at least one oligomer or polymer containing a plurality of functional groups (a1 ); graft copolymers preparable by the emulsion or suspension polymerization of at least one monomer containing at least one radically polymerizable double bond in the presence of at least one oligomeric or polymeric aminotriazine-polyamine condensate; and a process for the chemical and mechanical polishing of patterned and unstructured metal surfaces making use of the said aqueous polishing agent.
摘要翻译：一种水性抛光剂，其包含作为研磨剂的至少一种聚合物颗粒（A），其细分散在水相中并且在其表面具有多种至少一种能够与其相互作用的官能团（a1）金属和/或金属氧化物在要抛光的表面上并与所述金属和金属阳离子形成复合物，所述聚合物颗粒（A）可通过至少一种含至少一种的单体的乳液或悬浮聚合制备在含有多个官能团（a1）的至少一种低聚物或聚合物的存在下，可自由基聚合的双键; 在至少一种低聚或聚合氨基三嗪 - 聚胺缩合物存在下，通过至少一种含有至少一个可自由基聚合双键的单体的乳液或悬浮聚合制备的接枝共聚物; 以及利用所述水性抛光剂对图案化和非结构化金属表面进行化学和机械抛光的方法。

2. 发明申请

WO2012046179A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES HAVING PATTERNED OR UNPATTERNED LOW-K DIELECTRIC LAYERS 审中-公开
标题翻译：水性抛光组合物和具有图形或未加工的低K介电层的化学机械抛光底材的工艺
公开(公告)号：WO2012046179A1
公开(公告)日：2012-04-12
申请号：PCT/IB2011/054344
申请日：2011-10-04
申请人： BASF SE , RAMAN, Vijay, Immanuel , RITTIG, Frank , LI, Yuzhuo , Chiu, Wei Lan William , BASF (CHINA) COMPANY LIMITED
发明人： RAMAN, Vijay, Immanuel , RITTIG, Frank , LI, Yuzhuo , Chiu, Wei Lan William
IPC分类号： C09G1/02 , H01L21/306
CPC分类号： H01L21/30625 , C09G1/02 , C09G1/04 , G09G1/02 , H01L21/31053 , H01L21/3212 , H01L21/7684
摘要： An aqueous polishing composition comprising (A) abrasive particles and (B) an amphiphilic nonionic surfactant selected from the group consisting of water-soluble or water-dispersible surfactants having (b1) hydrophobic groups selected from the group consisting of branched alkyl groups having 10 to 18 carbon atoms; and (b2) hydrophilic groups selected from the group consisting of polyoxyalkylene groups comprising (b21 ) oxyethylene monomer units and (b22) substituted oxyalkylene monomer units wherein the substituents are selected from the group consisting of alkyl, cycloalkyl, or aryl, alkyl-cycloalkyl, alkyl-aryl, cycloalkyl-aryl and alkyl-cycloalkyl-aryl groups, the said polyoxyalkylene group containing the monomer units (b21 ) and (b22) in random, alternating, gradient and/or blocklike distribution; a CMP process for substrates having patterned or unpatterned low-k or ultra-low-k dielectric layers making use of the said aqueous polishing composition; and the use of the said aqueous polishing composition for manufacturing electrical, mechanical and optical devices.
摘要翻译：一种水性抛光组合物，其包含（A）研磨颗粒和（B）选自水溶性或水分散性表面活性剂的两亲性非离子表面活性剂，所述水性或水分散性表面活性剂具有（b1）疏水基团，所述支链烷基选自具有10〜 18个碳原子; 和（b2）选自包含（b21）氧化乙烯单体单元和（b22）取代的氧化烯单体单元的聚氧化烯基的亲水基团，其中取代基选自烷基，环烷基或芳基，烷基 - 环烷基，烷基 - 芳基，环烷基 - 芳基和烷基 - 环烷基 - 芳基，所述含有单体单元（b21）和（b22）的聚氧化烯基以随机，交替，梯度和/或嵌段分布形式存在; 用于使用所述水性抛光组合物的具有图案化或未图案化的低k或超低k电介质层的衬底的CMP工艺; 以及使用所述水性抛光组合物制造电气，机械和光学装置。

3. 发明申请

WO2009071351A1 A METHOD FOR CHEMICALLY-MECHANICALLY POLISHING PATTERNED SURFACES COMPOSED OF METALLIC AND NONMETALLIC PATTERNED REGIONS 审中-公开
标题翻译：一种金属和非金属形成区域化学机械抛光图形表面的方法
公开(公告)号：WO2009071351A1
公开(公告)日：2009-06-11
申请号：PCT/EP2008/062442
申请日：2008-09-18
申请人： BASF SE , CLARKSON UNIVERSITY , DEVARAPALLI, Vamsi, Krishna , BABU, Suryadevara, V. , PARTCH, Richard, E. , RAMAN, Vijay, Immanuel
发明人： DEVARAPALLI, Vamsi, Krishna , BABU, Suryadevara, V. , PARTCH, Richard, E. , RAMAN, Vijay, Immanuel
IPC分类号： C09G1/02 , H01L21/321
CPC分类号： C09G1/02 , H01L21/3212
摘要： A method for chemically-mechanically polishing patterned surfaces composed of patterned metallic and nonmetallic regions comprising the steps of: (1) selecting an aqueous chemical mechanical polishing composition comprising, based on the total amount of the polishing composition, (A) 1 to 10% by weight of an abrasive; (B) 0.1 to 5% by weight an oxidizing agent containing a peroxide group; (C) 0.1 to 5% by weight of an organic acid selected from oxalic acid and polycarboxylic acids comprising aliphatic, cycloaliphatic or aromatic moieties; (D) 0.01 to 3% by weight of a passivating film-forming agent; (E) 0.001 to 2% by weight of a cationic surfactant selected from quaternary ammonium salts; quaternary phosphonium salts; tertiary sulfonium salts pyridinium salts; imidazolinium salts; and oxazolinium salts; and (F) a pH controlling agent to adjust the pH between 4 and 8; (2) applying the selected chemical mechanical polishing composition to the interface between a patterned surface composed of patterned metallic and nonmetallic regions and a polishing pad; and (3) bringing the polishing pad into contact with the patterned surface and moving the pad in relation to the substrate; (4) thereby reducing the surface roughness of the patterned surface to less than 1 nm as measured by optical profilometry; and a process for manufacturing integrated circuits on semiconductor wafers making use of the said method.
摘要翻译：一种用于对由图案化金属和非金属区域组成的图案化表面进行化学机械抛光的方法，包括以下步骤：（1）选择水性化学机械抛光组合物，其包含基于抛光组合物的总量，（A）1至10％的研磨剂; （B）0.1〜5重量％的含有过氧化物基团的氧化剂; （C）0.1至5重量％的选自草酸和包含脂族，脂环族或芳族部分的多元羧酸的有机酸; （D）0.01〜3重量％的钝化成膜剂; （E）0.001-2重量％的选自季铵盐的阳离子表面活性剂; 季鏻盐; 叔锍盐吡啶鎓盐; 咪唑啉盐; 和恶唑啉盐; 和（F）pH调节剂以调节pH在4和8之间; （2）将选择的化学机械抛光组合物施加到由图案化金属和非金属区域构成的图案化表面与抛光垫之间的界面处; 和（3）使抛光垫与图案化表面接触并相对于衬底移动衬垫; （4），从而通过光学轮廓测量法将图案化表面的表面粗糙度降低到小于1nm; 以及利用所述方法制造半导体晶片上的集成电路的工艺。

4. 发明申请

WO2009153162A1 VERFAHREN ZUR HERSTELLUNG EINER WÄSSRIGEN POLYMERISATDISPERSION 审中-公开
标题翻译：方法用于生产水性聚合物
公开(公告)号：WO2009153162A1
公开(公告)日：2009-12-23
申请号：PCT/EP2009/056766
申请日：2009-06-03
申请人： BASF SE , VENKATESH, Rajan , RAMAN, Vijay, Immanuel
发明人： VENKATESH, Rajan , RAMAN, Vijay, Immanuel
IPC分类号： C08F2/38 , C08F4/00 , C08F2/22 , C08F293/00 , C08F2/18
CPC分类号： C08F2/38 , C08F2/22 , C08F4/00 , C08F293/005 , C08F2438/03 , C08L53/00 , C08L2666/02 , C09D153/00 , C09J153/00
摘要： Verfahren zur Herstellung einer wässrigen Polymerisatdispersion unter Verwendung von RAFT-Verbindungen.
摘要翻译：一种用于制备使用RAFT化合物的水性聚合物分散体的过程。

5. 发明申请

WO2009010443A3 VERFAHREN ZUR HERSTELLUNG VON NANO- UND MESOFASERN DURCH ELEKTROSPINNEN VON KOLLOIDALEN DISPERSIONEN, ENTHALTEND MINDESTENS EIN IM WESENTLICHEN WASSERUNLÖSLICHES POLYMER 审中-公开
公开(公告)号：WO2009010443A3
公开(公告)日：2009-01-22
申请号：PCT/EP2008/058983
申请日：2008-07-10
申请人： BASF SE , VENKATESH, Rajan , KLIMOV, Evgueni , PEPERS, Michel , HECKMANN, Walter , GREINER, Andreas , STOILJKOVIC, Aleksandar , SCHMIDT-THÜMMES, Jürgen , RAMAN, Vijay, Immanuel
发明人： VENKATESH, Rajan , KLIMOV, Evgueni , PEPERS, Michel , HECKMANN, Walter , GREINER, Andreas , STOILJKOVIC, Aleksandar , SCHMIDT-THÜMMES, Jürgen , RAMAN, Vijay, Immanuel
IPC分类号： D01D5/00
摘要： Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung von Polymerfasern, insbesondere von Nano-und Mesofasern, wobei eine kolloidale Dispersion wenigstens eines im Wesentlichen wasserunlöslichen Polymers in einem wässrigen Medium elektroversponnen wird, sowie mit diesem Verfahren erhältliche Fasern, textile Flächengebilde enthaltend die erfindungsgemäßen Fasern, und die Verwendung der erfindungs-gemässen Fasern und der erfindungsgemässen textilen Flächengebilde.

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