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    • 1. 发明申请
    • METHOD AND APPARATUS FOR CLEANING THE EDGE OF A THIN DISC
    • 用于清洁薄盘边缘的方法和设备
    • WO0028580A3
    • 2000-07-27
    • PCT/US9926067
    • 1999-11-04
    • APPLIED MATERIALS INC
    • FISHKIN BORISBROWN BRIAN JTANG JIANSHE
    • H01L21/00
    • H01L21/67057Y10S134/902
    • A method and apparatus for cleaning wafer edges is provided. The inventive wafer cleaner employs a transducer equal in length to the diameter of a wafer to be cleaned, and positioned to direct sonic energy in line with the wafer's edge. Supporting and rotating mechanisms are positioned along the wafer's edge, outside of the transducer's high energy field, and preferably such that approximately 50 percent of the wafer is positioned between the wafer supports and the transducer. Therefore, minimal sonic energy is blocked from reaching the wafer's surface. The transducer dimensions relative to the wafer, and the positioning of the wafer supports relative to the transducer enable the system to achieve an approximately 50 percent edge cleaning duty cycle as the wafer is rotated.
    • 提供了用于清洁晶片边缘的方法和设备。 本发明的晶片清洁器采用长度与待清洁晶片的直径相等的换能器,并且定位成引导与晶片边缘一致的声能。 支撑和旋转机构沿晶片的边缘位于换能器的高能量场之外,并且优选地使得大约50%的晶片位于晶片支撑件和换能器之间。 因此,最小的声能被阻止到达晶片表面。 相对于晶片的换能器尺寸以及晶片支架相对于换能器的定位使得系统能够在晶片旋转时实现大约50%的边缘清洁占空比。
    • 2. 发明申请
    • METHOD AND APPARATUS FOR CLEANING THE EDGE OF A THIN DISC
    • 清洁薄片边缘的方法和装置
    • WO0028579A9
    • 2000-11-02
    • PCT/US9925988
    • 1999-11-03
    • APPLIED MATERIALS INC
    • FISHKIN BORISTANG JIANSHEBROWN BRIAN J
    • H01L21/00
    • H01L21/67051H01L21/67046Y10S134/902
    • An inventive edge cleaning device is provided for cleaning the edge of a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.
    • 提供了一种创新的边缘清洁装置,用于清洁诸如半导体晶片的薄盘的边缘。 本发明的边缘清洁装置具有定位成在薄盘的边缘表面处引导液体射流的声波喷嘴。 优选地,声波喷嘴与薄盘的边缘径向间隔开,使得当由声波喷嘴清洁薄盘边缘时,可以在薄盘的主表面上同时进行洗涤,旋转漂洗或旋转清洁。 液体射流可以包括去离子水,NH 4 OH,KOH,TMAH,HF,柠檬酸,表面活性剂或其他类似的清洁溶液,并且当薄盘旋转时喷嘴可以保持静止,或者喷嘴可以扫描薄盘的圆周 以清洁薄片的整个边缘。
    • 7. 发明申请
    • METHOD AND APPARATUS FOR CLEANING THE EDGE OF A THIN DISC
    • 用于清洁薄盘边缘的方法和设备
    • WO0028579A2
    • 2000-05-18
    • PCT/US9925988
    • 1999-11-03
    • APPLIED MATERIALS INC
    • FISHKIN BORISTANG JIANSHEBROWN BRIAN J
    • H01L21/00
    • H01L21/67051H01L21/67046Y10S134/902
    • An inventive edge cleaning device is provided for cleaning the edge of a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.
    • 本发明的边缘清洁装置被设置用于清洁诸如半导体晶片的薄盘的边缘。 本发明的边缘清洁装置具有声波喷嘴,该声波喷嘴被定位成将液体射流引导至薄盘的边缘表面。 优选地,声波喷嘴与薄盘的边缘径向间隔开,使得当薄盘边缘由声波喷嘴清洁时,可以在薄盘的主表面上同时进行擦洗,旋转漂洗或旋转清洗。 液体射流可以包括去离子水,NH 4 OH,KOH,TMAH,HF,柠檬酸,表面活性剂或其他类似的清洁溶液,并且随着薄盘旋转或喷嘴可以扫描薄圆盘的圆周,喷嘴可以保持静止 清洁薄盘的整个边缘。