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1. 发明申请

WO2017189695A1 RETICLE PROCESSING SYSTEM 审中-公开
标题翻译：加工系统
公开(公告)号：WO2017189695A1
公开(公告)日：2017-11-02
申请号：PCT/US2017/029585
申请日：2017-04-26
申请人： APPLIED MATERIALS, INC.
发明人： STRASSNER, James D. , CARLSON, Charles , VOPAT, Robert Brent , BLAHNIK, Jeffrey
IPC分类号： G03F7/20
CPC分类号： H01L21/68785 , H01L21/67259 , H01L21/67346 , H01L21/681 , H01L21/68707
摘要： Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.
摘要翻译：本文提供用于处理掩模版坯料的方法。在一种方法中，掩模版处理系统包括支撑组件，该支撑组件具有耦合到框架的板以及耦合到支撑组件的载体组件。在一种方法中，载体组件包括耦合到板的载体基座，设置在载体基座上的标线片以及设置在标线片上的载体屏蔽体，其中载体屏蔽体可以包括形成在其中的中心开口，允许放置和提取的十字线。在一种方法中，当载体组件放置在支撑组件上时，多个销从板延伸穿过载体基部中的相应开口，多个销支撑载体组件，因此载体基部，标线和载体盾每个独立支持和垂直分开。

2. 发明申请

WO2016019120A1 MULTI-SUBSTRATE THERMAL MANAGEMENT APPARATUS 审中-公开
标题翻译：多基板热管理装置
公开(公告)号：WO2016019120A1
公开(公告)日：2016-02-04
申请号：PCT/US2015/042852
申请日：2015-07-30
申请人： APPLIED MATERIALS, INC.
发明人： BERA, Kallol , VELLORE, Kim , CONSTANT, Andrew , NEWMAN, Jacob , BLAHNIK, Jeffrey , SCHALLER, Jason , WEAVER, William , VOPAT, Robert , RIORDON, Benjamin
IPC分类号： H01L21/324 , H01L21/683
CPC分类号： F28F3/12 , H01L21/67109 , H01L21/67303
摘要： Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.
摘要翻译：本发明提供了多基板热管理装置的实施例。在一些实施例中，多基板热管理装置包括彼此垂直布置的多个板; 多个通道，其延伸穿过所述多个板中的每一个; 供应歧管，其包括在第一位置处联接到所述多个板的供应通道; 以及返回歧管，其包括在第二位置处经由多个腿联接到所述多个板的返回通道，其中所述供应和返回通道流体地联接到所述多个通道以使传热流体流过所述多个板。

3. 发明申请

WO2020092198A1 PROCESSING CHAMBER WITH ANNEALING MINI-ENVIRONMENT 审中-公开
公开(公告)号：WO2020092198A1
公开(公告)日：2020-05-07
申请号：PCT/US2019/058275
申请日：2019-10-28
申请人： APPLIED MATERIALS, INC.
发明人： HONAN, Michael , BLAHNIK, David , VOPAT, Robert Brent , BLAHNIK, Jeffrey , CARLSON, Charles
IPC分类号： H01L21/67 , H01L21/324 , H01L21/673
摘要： Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.

4. 发明申请

WO2018125752A1 APPARATUS AND METHODS FOR WAFER ROTATION TO IMPROVE SPATIAL ALD PROCESS UNIFORMITY 审中-公开
公开(公告)号：WO2018125752A1
公开(公告)日：2018-07-05
申请号：PCT/US2017/067923
申请日：2017-12-21
申请人： APPLIED MATERIALS, INC.
发明人： WEAVER, William T. , YUDOVSKY, Joseph , BLAHNIK, Jeffrey
IPC分类号： H01L21/677 , H01L21/67
摘要： Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.

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