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    • 4. 发明申请
    • METROLOGY SYSTEM FOR SUBSTRATE DEFORMATION MEASUREMENT
    • 用于基底变形测量的计量系统
    • WO2017173129A1
    • 2017-10-05
    • PCT/US2017/025112
    • 2017-03-30
    • APPLIED MATERIALS, INC.
    • VAEZ-IRAVANI, MehdiEGAN, ToddBANNA, SamerTANTIWONG, Kyle
    • H01L21/66
    • H01L21/67288G01B11/24G01B11/306G01N21/956G01N2021/95615G06T7/001G06T2207/30148H01L22/12
    • Embodiments of the disclosure provide methods and system for inspecting and treating a substrate. In one embodiment, a method is provided including transmitting a first plurality of beams from a diffractive beam splitter to a first surface of a substrate to generate a reflection of a second plurality of beams, wherein the first plurality of beams are spaced apart from each other upon arriving at the first surface of the substrate; receiving the second plurality of beams on a recording surface of an optical device, wherein the second plurality of beams are spaced apart from each other upon arriving at the recording surface; measuring positional information of the second plurality of beams on the recording surface; comparing the positional information of the second plurality of beams to positional information stored in a memory; and storing a result of the comparison in the memory.
    • 本公开的实施例提供了用于检查和处理基板的方法和系统。 在一个实施例中,提供了一种方法,包括将第一多个光束从衍射分束器发射到衬底的第一表面以产生第二多个光束的反射,其中第一多个光束彼此间隔开 在到达衬底的第一表面时; 在光学装置的记录表面上接收所述第二多个光束,其中所述第二多个光束在到达所述记录表面时彼此间隔开; 测量记录表面上的第二多个光束的位置信息; 将第二多个光束的位置信息与存储在存储器中的位置信息进行比较; 并将比较结果存储在存储器中。
    • 8. 发明申请
    • ELECTROSTATIC CHUCK WITH CONCENTRIC COOLING BASE
    • 具有集中冷却基座的静电卡盘
    • WO2014116392A1
    • 2014-07-31
    • PCT/US2013/078244
    • 2013-12-30
    • APPLIED MATERIALS, INC.
    • LUBOMIRSKY, DmitryTANTIWONG, KyleBANNA, Samer
    • H01L21/683
    • H01L21/6831H01L21/67H01L21/67098
    • Embodiments of the present disclosure generally provide apparatus and method for cooling a substrate support in a uniform manner. One embodiment of the present disclosure provides a cooling assembly for a substrate support. The cooling assembly includes a cooling base having a first side for contacting the substrate support and providing cooling to the substrate support, a diffuser disposed on a second side of the cooling base, wherein the diffuser defines a plurality of cooling paths for delivering a cooling fluid towards the cooling base in a parallel manner, and an inlet/outlet plate disposed under the diffuser, wherein the inlet/outlet plate is provides an interface between the diffuser and an inlet and outlet of a cooling fluid.
    • 本公开的实施例通常提供用于以均匀方式冷却衬底支撑件的装置和方法。 本公开的一个实施例提供了一种用于衬底支撑件的冷却组件。 所述冷却组件包括冷却基座,所述冷却基座具有用于接触所述基板支撑件并且向所述基板支撑件提供冷却的第一侧,设置在所述冷却基座的第二侧上的扩散器,其中所述扩散器限定多个用于输送冷却流体的冷却路径 以平行方式朝向冷却基座,以及设置在扩散器下方的入口/出口板,其中入口/出口板提供扩散器与冷却流体的入口和出口之间的界面。
    • 9. 发明申请
    • ELECTROSTATIC CHUCK WITH ADVANCED RF AND TEMPERATURE UNIFORMITY
    • 具有高级射频和温度均匀性的静电卡盘
    • WO2013163220A1
    • 2013-10-31
    • PCT/US2013/037849
    • 2013-04-23
    • APPLIED MATERIALS, INC.
    • LUBOMIRSKY, DmitrySUN, JenniferMARKOVSKY, MarkMAKHRATCHEV, KonstantinBUCHBERGER, Douglas A. Jr.BANNA, Samer
    • H01L21/683H01L21/205H01L21/306C23C16/46H02N13/00
    • H02N13/00H01L21/67103
    • Electrostatic chucks (ESCs) with RF and temperature uniformity are described. For example, an ESC includes a top dielectric layer. An upper metal portion is disposed below the top dielectric layer. A second dielectric layer is disposed above a plurality of pixilated resistive heaters and surrounded in part by the upper metal portion. A third dielectric layer is disposed below the second dielectric layer, with a boundary between the third dielectric layer and the second dielectric layer. A plurality of vias is disposed in the third dielectric layer. A bus power bar distribution layer is disposed below and coupled to the plurality of vias. A fourth dielectric layer is disposed below the bus bar power distribution layer, with a boundary between the fourth dielectric layer and the third dielectric layer. A metal base is disposed below the fourth dielectric layer. The metal base includes a plurality of high power heater elements housed therein.
    • 描述了具有RF和温度均匀性的静电卡盘(ESCs)。 例如,ESC包括顶部电介质层。 上部金属部分设置在顶部电介质层的下方。 第二电介质层设置在多个像素化电阻加热器的上方,并且被上部金属部分部分地包围。 第三电介质层设置在第二电介质层的下方,第三电介质层和第二电介质层之间具有边界。 多个通孔设置在第三电介质层中。 总线功率棒分布层设置在多个通孔的下方并耦合到多个通孔。 第四电介质层设置在母线功率分配层的下方,第四电介质层和第三电介质层之间具有边界。 金属基底设置在第四电介质层的下方。 金属基座包括容纳在其中的多个高功率加热器元件。