会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • METHOD AND APPARATUS FOR CONTROLLING COATING WIDTH
    • 控制涂层宽度的方法和设备
    • WO2005070561A2
    • 2005-08-04
    • PCT/US2005/000573
    • 2005-01-07
    • 3M INNOVATIVE PROPERTIES COMPANY
    • PEKUROVSKY, Mikhail, L.KOLB, William, B.NOYOLA, Joan, M.
    • B05C
    • B05C5/0254Y10S118/02
    • A method of applying a material to a moving substrate is disclosed. The method includes providing a die comprising a die body having a cavity therein, wherein the cavity is in fluid communication with an applicator slot. The die is then oriented such that the applicator slot is positioned so as to dispense the material onto the substrate. The material is introduced into the die cavity such that the material is dispensed onto the substrate through the applicator slot. At least one end of the slot includes means for preventing lateral widening of the dispensed material. In another embodiment, means will be disposed at both ends of the applicator slot. The method is particularly useful when the capillary number characteristic of the coating process is less than 0.5
    • 公开了一种将材料施加到移动基板的方法。 该方法包括提供包括其中具有空腔的模具主体的模具,其中该空腔与涂抹器槽流体连通。 然后定位模具,使得涂敷器狭缝被定位以便将材料分配到基底上。 材料被引入到模腔中,使得材料通过涂抹器槽被分配到基底上。 狭槽的至少一端包括用于防止分配材料横向变宽的装置。 在另一个实施例中,装置将设置在涂抹器槽的两端。 当涂层过程的毛细管数量特征小于0.5时,该方法特别有用