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    • 5. 发明申请
    • THIN GLASS PROCESSING USING A CARRIER SUBSTRATE
    • 使用载体基板进行薄玻璃加工
    • WO2013040051A1
    • 2013-03-21
    • PCT/US2012/054886
    • 2012-09-12
    • APPLE INC.FEINSTEIN, Casey, J.ZHONG, John, Z.YOUNGS, Lynn, R.POONS, Stephen, S.
    • FEINSTEIN, Casey, J.ZHONG, John, Z.YOUNGS, Lynn, R.POONS, Stephen, S.
    • H01L21/70G02F1/1333H01L27/12H01L21/77
    • G06F3/0416G02F1/1333G02F1/1368G06F3/044H01L27/1266Y10T29/49155
    • A method of fabricating a display panel from a thin substrate (100, 200, 200') using a carrier substrate (102, 304, 304') is disclosed. The method includes depositing a bonding agent (101) on a first surface of the thin substrate (100, 200, 200'); depositing a bonding agent (103) on a second surface of the carrier substrate (102, 304, 304'); bonding the thin substrate (100, 200, 200') and the carrier substrate (102, 304, 304') with the bonding agent (101, 103) deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate (100, 200, 200') opposite the first surface; and separating the processed thin substrate (100, 200, 200') from the carrier substrate (102, 304, 304'). The thin substrate (100, 200, 200') has a thickness less than a required thickness for sustaining thin film processing while the combined thickness of the bonded thin substrate (100, 200, 200') and the carrier substrate (102, 304, 304') is greater than or equal to that the required thickness.
    • 公开了一种使用载体衬底(102,304,304')从薄衬底(100,200,200')制造显示面板的方法。 该方法包括在薄衬底(100,200,200')的第一表面上沉积粘合剂(101); 在所述载体基板(102,304,304')的第二表面上沉积粘合剂(103); 用沉积在第一表面和第二表面上的粘合剂(101,103)将薄衬底(100,200,200')和载体衬底(102,304,304')结合; 在与第一表面相对的薄基板(100,200,200')的第三表面上执行薄膜处理; 以及将所处理的薄衬底(100,200,200')与所述载体衬底(102,304,304')分离。 薄衬底(100,200,200')的厚度小于用于维持薄膜处理的所需厚度,而结合的薄衬底(100,200,200')和载体衬底(102,304)的组合厚度 304')大于或等于所需厚度。