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    • 1. 发明申请
    • SPACE-SAVING THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICES
    • 节省电子设备的热管理系统
    • WO2015047737A1
    • 2015-04-02
    • PCT/US2014/055113
    • 2014-09-11
    • CYAN INC.NEWHOUSE, Todd, AndrewWILSON, Colin, John
    • NEWHOUSE, Todd, AndrewWILSON, Colin, John
    • H05K7/20
    • H05K7/20336F28D15/02F28D15/04H05K7/20727H05K7/20809
    • A thermal management system includes a distributor plate secured to and parallel to a circuit board. The circuit board has a module secured thereto and the distributor plate defines an area on an inner surface thereof secured to or otherwise in thermal contact with the module. Heat pipes embedded in the distributor plate include a portion over the module and a portion over the circuit board outward from the module. A portion of the heat pipes outward from the module may be substantially perpendicular to a direction of airflow between the circuit board and distributor plate. The module may be located closer to one edge of the circuit board and the heat pipes may according extend from adjacent that edge to an opposite edge of the circuit board. An inward facing surface may include fins extending toward the circuit board and the fins may be contoured to the circuit board.
    • 热管理系统包括固定到电路板并平行于电路板的分配板。 电路板具有固定到其上的模块,并且分配器板在其内表面上限定固定或与模块热接触的区域。 嵌入分配器板中的热管包括模块上方的一部分和从模块向外的电路板上的一部分。 从模块向外的热管的一部分可以基本上垂直于电路板和分配器板之间的气流方向。 模块可以位于更接近电路板的一个边缘处,并且热管可以从电路板的相邻边缘延伸到相对边缘。 向内的表面可以包括朝向电路板延伸的翅片,并且散热片可以形成为电路板。