专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2009011353A1 RESIN COMPOSITION AND IMAGE DISPLAY DEVICE 审中-公开
标题翻译：树脂组合物和图像显示装置
公开(公告)号：WO2009011353A1
公开(公告)日：2009-01-22
申请号：PCT/JP2008062791
申请日：2008-07-16
申请人： SONY CHEM & INF DEVICE CORP , TOYODA TOMOYUKI , SHINYA YOSHIHISA , KAMATA YUSUKE
发明人： TOYODA TOMOYUKI , SHINYA YOSHIHISA , KAMATA YUSUKE
IPC分类号： G09F9/00 , G02F1/1333
CPC分类号： G02F1/133308 , G02F1/1333 , G02F2001/133311 , G02F2001/133331 , G02F2201/50 , G02F2201/54 , G02F2202/023 , G02F2202/025 , G02F2202/28 , Y10T156/11 , Y10T156/1184 , Y10T428/24355
摘要： This invention provides an image display device having suppressed uneven display attributable to internal stress caused by cure shrinkage of a cured resin between a protective part and an image display part, and an external stress applied to the image display part by the warpage of the protective part, and having suppressed separation of the cured resin. The image display device comprises an image display part and a light transparent protective part disposed on the image display part. A cured resin layer is interposed between the image display part and the protective part, and the cured resin layer has a transmittance in a visible light region of not less than 90%, an elongation of not less than 700% at 25°C and not less than 400% at 80°C, and an adhesion to the protective part of not less than 0.4 N/cm at 25°C and not less than 0.3 N/cm at 80°C.
摘要翻译：本发明提供了一种图像显示装置，其抑制由于保护部分和图像显示部分之间的固化树脂的固化收缩引起的内部应力的不均匀显示以及通过保护部分的翘曲施加到图像显示部分的外部应力并且抑制了固化树脂的分离。图像显示装置包括图像显示部分和设置在图像显示部分上的透光保护部分。在图像显示部和保护部之间插入固化树脂层，固化树脂层的可见光区域的透射率为不低于90％，在25℃下的伸长率不小于700％，而不是在80℃下小于400％，并且在保护部分的粘合性在25℃下不小于0.4N / cm，在80℃下不小于0.3N / cm。

2. 发明申请

WO2010098324A9 METHOD OF PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：生产半导体器件的方法
公开(公告)号：WO2010098324A9
公开(公告)日：2010-11-18
申请号：PCT/JP2010052772
申请日：2010-02-23
申请人： SONY CHEM & INF DEVICE CORP , HAMAZAKI KAZUNORI , MATSUMURA TAKASHI , SATO DAISUKE , SUGA YASUHIRO
发明人： HAMAZAKI KAZUNORI , MATSUMURA TAKASHI , SATO DAISUKE , SUGA YASUHIRO
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L24/92 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/1134 , H01L2224/13017 , H01L2224/13144 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1623 , H01L2224/16238 , H01L2224/27334 , H01L2224/29007 , H01L2224/2919 , H01L2224/32012 , H01L2224/32225 , H01L2224/3224 , H01L2224/73103 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83194 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/364 , H01L2924/381 , H01L2924/00014 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2924/00012
摘要： A method of producing a semiconductor device in which a semiconductor chip is flip-chip mounted on a board with a non-conductive resin film (NCF), wherein said method prevents the NCF from protruding at the time of hot pressing, prevents non-conductive resin and inorganic filler from entering the space between the bumps and the electrode pads, and wherein the acquired semiconductor device exhibits sufficient moisture/reflow resistance. Specifically, the NCF has a size equivalent to 60 to 100% of the area of a region enclosed by a plurality of bumps that are arranged at the periphery of a semiconductor chip and has a minimum melt viscosity of 2×102 to 1×105 Pa·s. The NCF is temporarily bonded to a region enclosed by a plurality of electrodes of the board which correspond to the bumps. Next, the semiconductor chip and board are positioned so that the bumps and the corresponding electrodes face each other, and are hot pressed from the semiconductor chip side. This causes the bumps and the electrodes to metallically bond, and melts and further thermally hardens the NCF. Due to this, a semiconductor device is acquired.
摘要翻译：一种半导体器件的制造方法，其中用非导电树脂膜（NCF）将半导体芯片倒装安装在板上，其中所述方法防止NCF在热压时突出，防止不导电树脂和无机填料进入凸块和电极焊盘之间的空间，并且其中获得的半导体器件表现出足够的耐湿/回流性。具体地说，NCF的尺寸相当于由配置在半导体芯片的周围的多个凸块所包围的区域的面积的60〜100％，其最小熔融粘度为2×102〜1×105Pa ·秒。 NCF临时结合到由与凸块相对应的板的多个电极包围的区域。接下来，半导体芯片和板被定位成使得凸起和相应的电极彼此面对，并且从半导体芯片侧被热压。这导致凸起和电极金属结合，并熔融并进一步热硬化NCF。由此，获得半导体器件。

3. 发明申请

WO2010134494A3 MULTI-LAYER POLYESTER FILM 审中-公开
标题翻译：多层聚酯薄膜
公开(公告)号：WO2010134494A3
公开(公告)日：2011-02-24
申请号：PCT/JP2010058299
申请日：2010-05-17
申请人： SONY CHEM & INF DEVICE CORP , UENO YOSHIFUMI , SUTO TAKANOBU
发明人： UENO YOSHIFUMI , SUTO TAKANOBU
IPC分类号： G06F3/041 , B32B27/36 , G06F3/045
CPC分类号： G06F3/041 , B32B7/12 , B32B9/005 , B32B9/045 , B32B15/08 , B32B27/08 , B32B27/36 , B32B2255/10 , B32B2255/20 , B32B2307/308 , B32B2307/412 , B32B2307/50 , B32B2307/736 , B32B2457/202 , B32B2457/208
摘要： Disclosed is a transparent electrode sheet which suppresses the precipitation of oligomers without forming a coating layer or an applied layer on the PET surface of the adhesive layer. To avoid heat shrinkage during annealing in the manufacturing process, a touch panel is pre-annealed by heat shrinking the first and second resin films (1, 2) prior to annealing. As a result of having been pre-annealed, when the first and second resin films (1, 2) are heated above glass transition temperature the oligomers within said films are precipitated and disperse. The oligomers, which pass from the resin films (1, 2), along the boundary surface between the films (1, 2) and the adhesive layer (3) and move to the adhesive layer (3), mix with said layer, made from polyethylene containing terephthalic acid and ethylene glycol, and are not precipitated as crystals. Even if the oligomers do not mix with the adhesive layer (3), the light refraction indexes of the oligomers and said layer (3) are almost equal and so the oligomers are not visible.
摘要翻译：公开了一种透明电极片，其在粘合剂层的PET表面上没有形成涂层或涂覆层的情况下抑制低聚物的沉淀。为了避免在制造过程中退火期间的热收缩，触摸面板通过在退火之前热收缩第一和第二树脂薄膜（1,2）而进行预退火。作为预退火的结果，当将第一和第二树脂膜（1,2）加热到玻璃化转变温度以上时，所述膜内的低聚物沉淀并分散。从树脂膜（1,2）通过膜（1,2）和粘合剂层（3）之间的边界表面并移动到粘合剂层（3）的低聚物与所述层混合，制成由含有对苯二甲酸和乙二醇的聚乙烯制成，不析出。即使低聚物不与粘合剂层（3）混合，低聚物和所述层（3）的光折射率几乎相等，因此低聚物不可见。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式