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1. 发明申请

WO2007007865A1 METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDER-ATTACHED ELECTRONIC CIRCUIT BOARD 审中-公开
标题翻译：将焊粉连接到电子电路板和焊接的电子电路板的方法
公开(公告)号：WO2007007865A1
公开(公告)日：2007-01-18
申请号：PCT/JP2006/314019
申请日：2006-07-07
申请人： SHOWA DENKO K.K. , SHOJI, Takashi , SAKAI, Takekazu , KUBOTA, Tetsuo
发明人： SHOJI, Takashi , SAKAI, Takekazu , KUBOTA, Tetsuo
IPC分类号： H05K3/34 , H05K3/24
CPC分类号： H05K3/3478 , H05K3/282 , H05K2203/0285 , H05K2203/0425 , H05K2203/0786 , H05K2203/124
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
摘要翻译：用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，由此赋予粘合性以形成增粘部分，通过干法或湿法将焊料粉末附着到增粘部分，然后除去添加有防锈剂的水，脱氧水或脱氧水的液体中过度粘附的焊料粉末。

2. 发明申请

WO2008016128A1 PRODUCTION METHOD OF SOLDIER CIRCUIT BOARD 审中-公开
标题翻译：销售电路板的生产方法
公开(公告)号：WO2008016128A1
公开(公告)日：2008-02-07
申请号：PCT/JP2007/065217
申请日：2007-07-27
申请人： SHOWA DENKO K.K. , SHOJI, Takashi , SAKAI, Takekazu
发明人： SHOJI, Takashi , SAKAI, Takekazu
IPC分类号： H05K3/34 , H01L23/12
CPC分类号： H05K3/3478 , H01L21/4853 , H05K3/3452 , H05K2203/033 , H05K2203/041 , H05K2203/0415 , H05K2203/043 , H05K2203/0485 , H05K2203/0776
摘要： A method for producing a solder circuit board includes the steps of imparting tackiness to a surface of an electrically conductive circuit electrode on a printed-wiring board to form a tacky part, causing only one solder particle to adhere to the tacky part, and heating the printed-wiring board, thereby melting the solder particle to form a bump part which corresponds to the tacky part and to which an electronic part is to be connected and forming a solder circuit.
摘要翻译：一种焊接电路板的制造方法，其特征在于，在印刷布线基板上的导电性电路电极的表面赋予粘合性，形成粘着部，仅使一个焊料粒子附着在粘着部上，从而熔化焊料颗粒以形成与粘性部分相对应的凸起部分，并且电子部件将被连接并形成焊接电路。

3. 发明申请

WO03064102A8 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE 审中-公开
标题翻译：焊接金属，焊接焊剂和焊膏
公开(公告)号：WO03064102A8
公开(公告)日：2004-07-15
申请号：PCT/JP0300873
申请日：2003-01-30
申请人： SHOWA DENKO KK , SHOJI TAKASHI , NISHIOKA AYAKO , KUROZUMI TADATOSHI , SHIBUYA YOSHINORI , AMITA HITOSHI
发明人： SHOJI TAKASHI , NISHIOKA AYAKO , KUROZUMI TADATOSHI , SHIBUYA YOSHINORI , AMITA HITOSHI
IPC分类号： B23K35/363 , B23K35/02 , B23K35/14 , B23K35/26 , B23K35/36 , H05K3/34 , B23K101/36
CPC分类号： B23K35/02 , B23K35/26 , B23K35/262 , B23K35/3616 , B23K2201/36 , H05K3/3484
摘要： Solder metal consists essentially of 8.8 to 5.0 mass% of Zn, 0.05 to 0 mass% of Bi and the balance of Sn and unavoidable impurities.
摘要翻译：焊锡金属主要由8.8〜5.0质量％的Zn，0.05〜0质量％的Bi和余量的Sn和不可避免的杂质构成。

4. 发明申请

WO2008069328A1 METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD 审中-公开
标题翻译：生产导电电路板的方法
公开(公告)号：WO2008069328A1
公开(公告)日：2008-06-12
申请号：PCT/JP2007/073730
申请日：2007-12-03
申请人： SHOWA DENKO K.K. , SHOJI, Takashi , SAKAI, Takekazu
发明人： SHOJI, Takashi , SAKAI, Takekazu
IPC分类号： H05K3/22 , H05K3/24 , H05K3/34
CPC分类号： H05K3/3484 , H05K2203/0126 , H05K2203/0485
摘要： A conductive circuit board is produced by imparting tackiness to the conductive circuit surface on a printed wiring board, attaching solder powder to the tacky area by supplying a slurry containing solder powder, and then heating the printed wiring board to melt the solder, thereby forming a solder circuit. In the solder circuit prepared by this method, tackiness is imparted to portions of the circuit with an insufficient amount of solder attached thereto and solder powder is attached to these tacky areas, or a solder paste is applied to the portions of the circuit with an insufficient amount cf solder attached, and the solder powder or solder paste is melted to rectify the solder circuit, thereby producing a conductive circuit board with little variation in the amount of solder attached.
摘要翻译：通过向印刷电路板上的导电电路表面赋予粘性，通过供给含有焊料粉末的浆料将焊料粉末附着在粘性区域，然后加热印刷线路板来熔化焊料，从而形成导电电路板焊接电路。在通过该方法制备的焊料回路中，粘附部分的电路附着在焊料的量不足，焊料粉末附着在这些粘性区域上，或者焊膏被施加到电路部分不足焊锡附着量，焊料粉末或焊锡膏熔化，使焊锡电路整流，从而制造导电电路板，焊料附着量变化不大。

5. 发明申请

WO2008047888A1 METHOD FOR FORMING SOLDER LAYER ON PRINTED-WIRING BOARD AND SLURRY DISCHARGE DEVICE 审中-公开
标题翻译：在印刷电路板和浆液放电装置上形成焊盘层的方法
公开(公告)号：WO2008047888A1
公开(公告)日：2008-04-24
申请号：PCT/JP2007/070395
申请日：2007-10-12
申请人： SHOWA DENKO K.K. , SHOJI, Takashi , SAKAI, Takekazu
发明人： SHOJI, Takashi , SAKAI, Takekazu
IPC分类号： H05K3/34 , H05K3/24
CPC分类号： H05K3/3484 , B23K3/0638 , B23K2201/42 , H05K2203/0126 , H05K2203/124
摘要： A method for forming a solder layer on the surface of a conductive circuit on a printed-wiring board includes discharging slurry containing solder powder onto the surface and heating the substrate. The slurry is discharged by dint of the pressure in a tank for the slurry. In a discharging device to be used in the method, the tank for storing the slurry is provided with a discharge pipe (2) for the slurry and a delivery pipe (1) for gas or solvent to be used for adjusting the pressure in the tank. In this device, one common pipe may be used both for discharging the slurry from the tank and delivering the slurry to the tank and one common pipe may be used for both delivering gas into the tank and sucking the gas from the tank.
摘要翻译：在印刷电路板上的导电电路的表面上形成焊料层的方法包括将含有焊料粉末的浆料排出到表面上并加热基板。浆料通过浆料中的压力排出。在该方法中使用的排出装置中，用于储存浆料的罐设置有用于浆料的排出管（2）和用于调节罐中的压力的用于气体或溶剂的输送管（1）。在该装置中，可以使用一根普通的管子来从罐中排出浆料并将浆料输送到罐中，并且可以使用一根普通的管道将两个气体输送到罐中并从罐中吸入气体。

6. 发明申请

WO2005109977A1 METHOD FOR PRODUCTION OF ELECTRONIC CIRCUIT BOARD 审中-公开
标题翻译：生产电子电路板的方法
公开(公告)号：WO2005109977A1
公开(公告)日：2005-11-17
申请号：PCT/JP2005/008835
申请日：2005-05-10
申请人： SHOWA DENKO K.K. , SAKAI, Takekazu , SHOJI, Takashi
发明人： SAKAI, Takekazu , SHOJI, Takashi
IPC分类号： H05K3/34
CPC分类号： H05K3/3484 , H05K2203/0292 , H05K2203/0425 , H05K2203/0485 , Y10T29/49144
摘要： A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.
摘要翻译：一种用于将焊接粉末沉积到电子电路板的方法包括以下步骤：向基底的暴露的金属表面施加粘性并将焊接粉末沉积在液体中的所得粘着部分上。该方法还可以包括加热基板，从而熔化焊接粉末并形成焊接电路的步骤。

7. 发明申请

WO2007029866A1 METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDERED ELECTRONIC CIRCUIT BOARD 审中-公开
标题翻译：焊接粉末焊接到电子电路板和焊接电子电路板的方法
公开(公告)号：WO2007029866A1
公开(公告)日：2007-03-15
申请号：PCT/JP2006/318099
申请日：2006-09-06
申请人： SHOWA DENKO K.K. , SHOJI, Takashi , SAKAI, Takekazu
发明人： SHOJI, Takashi , SAKAI, Takekazu
IPC分类号： H05K3/34 , B23K3/06 , H05K3/24
CPC分类号： H05K3/3484 , B23K1/20 , B23K3/0607 , B23K2201/42 , H05K2203/0126 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/124 , Y10T428/24802
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackif ier compound, thereby imparting tackiness to the metallic surface to form a tacky part, and supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder. A method for the production of a soldered electronic circuit board, includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder, and thermally fusing the attached solder powder, thereby forming a circuit .
摘要翻译：焊料粉末的附着方法包括用增粘剂处理电子电路板的暴露的金属表面的步骤，从而赋予金属表面粘性以形成粘性部分，并向粘性部分供给焊料粉末悬浮在液体中的浆料，从而引起焊料粉末的附着。制造焊接电子电路板的方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，从而赋予金属表面粘性以形成粘性部分，向粘性部分供应将焊料粉末悬浮在液体中，从而引起焊料粉末的附着，并使附着的焊料粉末热熔融，从而形成电路。

8. 发明申请

WO2006104238A1 PRODUCTION METHOD OF SOLDER CIRCUIT BOARD 审中-公开
标题翻译：焊接电路板的生产方法
公开(公告)号：WO2006104238A1
公开(公告)日：2006-10-05
申请号：PCT/JP2006/307006
申请日：2006-03-28
申请人： SHOWA DENKO K.K. , SHOJI, Takashi , SAKAI, Takekazu , KUBOTA, Tetsuo
发明人： SHOJI, Takashi , SAKAI, Takekazu , KUBOTA, Tetsuo
IPC分类号： H05K3/34
CPC分类号： H05K3/3484 , B23K1/0016 , B23K3/06 , B23K2201/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/1527
摘要： A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.
摘要翻译：一种焊接电路板的制造方法，其特征在于，在设置在印刷电路板上的导电电路电极的表面赋予粘合性，形成赋予粘着性的区域。在赋予粘合性的区域上形成焊料粉末并加热印刷电路板，从而熔化焊料从而形成焊料电路。将焊料粉末放置在容器中。具有表面已经赋予粘性的电极的印刷线路板被放置在容器中。将容器倾斜，从而将焊料粉末沉积在赋予粘性的区域上。

9. 发明申请

WO2003064102A1 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE 审中-公开
标题翻译：焊接金属，焊接焊剂和焊膏
公开(公告)号：WO2003064102A1
公开(公告)日：2003-08-07
申请号：PCT/JP2003/000873
申请日：2003-01-30
申请人： SHOWA DENKO K.K. , SHOJI, Takashi , NISHIOKA, Ayako , KUROZUMI, Tadatoshi , AMITA, Hitoshi
发明人： SHOJI, Takashi , NISHIOKA, Ayako , KUROZUMI, Tadatoshi , AMITA, Hitoshi
IPC分类号： B23K35/26
CPC分类号： B23K35/02 , B23K35/26 , B23K35/262 , B23K35/3616 , B23K2201/36 , H05K3/3484
摘要： Solder metal consists essentially of 8.8 to 5.0 mass% of Zn, 0.05 to 0 mass% of Bi and the balance of Sn and unavoidable impurities.
摘要翻译：焊锡金属主要由8.8〜5.0质量％的Zn，0.05〜0质量％的Bi和余量的Sn和不可避免的杂质构成。

10. 发明申请

WO0158639A9 SOLDER PASTE, SOLDERING METHOD USING SAID SOLDER PASTE AND JOINTED PRODUCT PREPARED BY SAID SOLDERING METHOD 审中-公开
标题翻译：焊膏，焊接方法使用焊膏和焊接方法
公开(公告)号：WO0158639A9
公开(公告)日：2002-01-17
申请号：PCT/JP0100877
申请日：2001-02-08
申请人： SHOWA DENKO KK , AMITA HITOSHI , MURASE NORIKO , SHOJI TAKASHI
发明人： AMITA HITOSHI , MURASE NORIKO , SHOJI TAKASHI
IPC分类号： B23K1/00 , B23K35/02 , B23K35/22 , B23K35/26 , B23K35/36 , B23K35/363 , H05K3/34
CPC分类号： B23K35/3616 , B23K35/025 , B23K35/262
摘要： A solder paste which comprises a halogen compound as an activator in such an amount as to give a halogen ion concentration per 1 g of the flux used in the paste of 3,000 ppm or less in terms of a chlorine ion; a method for soldering using the solder paste; and a jointed product prepared by using the soldering method. The solder paste exhibits excellent storage stability.
摘要翻译：一种焊膏，其包含卤素化合物作为活化剂，其量使得每1g所述浆料中的氯离子浓度以氯离子计为3000ppm以下; 使用焊膏进行焊接的方法; 和通过使用焊接方法制备的接合产品。焊膏表现出优异的储存稳定性。

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