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1. 发明申请

WO2013010038A2 HEAT TRANSFER SYSTEM WITH INTEGRATED EVAPORATOR AND CONDENSER 审中-公开
标题翻译：集成蒸发器和冷凝器的传热系统
公开(公告)号：WO2013010038A2
公开(公告)日：2013-01-17
申请号：PCT/US2012/046553
申请日：2012-07-12
申请人： FLEXTRONICS AP, LLC , SHABANY, Younes
发明人： SHABANY, Younes
IPC分类号： F28D15/02 , H05K7/20 , H01L23/427
CPC分类号： F28D15/0233 , F28D15/0266 , F28D15/06 , F28D2021/0028 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Two phase heat transfer systems including integrated fluid transfer paths for exchange of a working fluid between an evaporator and condenser. Separate fluid transfer paths may be defined for communication of working fluid between the evaporator and condenser, wherein at least one of the fluid transfer paths is integrated with the evaporator and/or condenser. In one embodiment, both first and second fluid transfer paths are integrally provided to establish direct fluid communication between the evaporator and condenser to facilitate flow of vaporized and condensed working fluid respectively.
摘要翻译：包括用于在蒸发器和冷凝器之间交换工作流体的集成流体传输路径的两相传热系统。分离的流体传输路径可被限定用于工作流体在蒸发器和冷凝器之间的连通，其中至少一个流体传输路径与蒸发器和/或冷凝器集成。在一个实施例中，第一和第二流体传送路径一体地设置以建立蒸发器和冷凝器之间的直接流体连通，以分别促进蒸发和冷凝的工作流体的流动。

2. 发明申请

WO2007109683A2 INCREASING AIR INLET/OUTLET SIZE FOR ELECTRONICS CHASSIS 审中-公开
标题翻译：增加空气入口/出口尺寸进行电子换档
公开(公告)号：WO2007109683A2
公开(公告)日：2007-09-27
申请号：PCT/US2007/064437
申请日：2007-03-20
申请人： FLEXTRONICS AP, LLC , SHABANY, Younes , YUM, Hans , COLLIS, Todd , BISBIKIS, Steve , KOO, Steve , MILLER, Kieran
发明人： SHABANY, Younes , YUM, Hans , COLLIS, Todd , BISBIKIS, Steve , KOO, Steve , MILLER, Kieran
IPC分类号： H05K7/20
CPC分类号： H05K7/20572
摘要： Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.
摘要翻译：提供了具有增加的横截面面积的空气入口的电子底盘，其有助于气流通过底盘，从而提供改进的冷却。当电子底盘经常被堆叠时，已经确定下底盘的上表面可以用于至少部分地限定上机架的空气入口。在这方面，可以去除下底盘的上部以增加空气入口的尺寸。也就是说，下机架的上壁和/或顶壁的部分被连接壁（例如锥形和/或倒角的壁）移除并连接。同样地，上部底盘的底壁可以被移除。当堆叠时，上机架的进气口可以设置在下机架的截头部分的上方。在这种布置中，所得空气进口的尺寸显着增加。

3. 发明申请

WO2009042232A1 THERMALLY ENHANCED MAGNETIC TRANSFORMER 审中-公开
标题翻译：热增强磁变压器
公开(公告)号：WO2009042232A1
公开(公告)日：2009-04-02
申请号：PCT/US2008/011261
申请日：2008-09-25
申请人： FLEXTRONICS AP, LLC , SHABANY, Younes , AGUAYO, Juan , RAO, Srinivas
发明人： SHABANY, Younes , AGUAYO, Juan , RAO, Srinivas
IPC分类号： H01F27/02
CPC分类号： H01F27/22 , H01F41/0206 , H01F2027/2819 , H01F2027/297 , Y10T29/49073
摘要： A planar transformer comprises a laminate substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, a core configured to fit inside the opening to enclose the laminate substrate. At least one heat sink fin is integrally formed with the top, bottom or both sides of the core. A method of forming a planar transformer comprises laminating a substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, fitting a core inside the opening, and enclosing the laminate substrate. One of the top, bottom or both sides of the core include one or more heat sink fins.
摘要翻译：平面变压器包括具有开口的层压基板，金属轨迹卷绕在其上，形成初级和次级绕组，芯构造成配合在开口内部以包围层压基板。至少一个散热片与芯的顶部，底部或两侧一体形成。一种形成平面变压器的方法包括将具有开口的基板与在其上缠绕的金属迹线层压，形成初级和次级绕组，将芯件安装在开口内部并封装层压基板。芯的顶部，底部或两侧中的一个包括一个或多个散热片。

4. 发明申请

WO2007109683A3 INCREASING AIR INLET/OUTLET SIZE FOR ELECTRONICS CHASSIS 审中-公开
标题翻译：增加空气入口/出口尺寸进行电子换档
公开(公告)号：WO2007109683A3
公开(公告)日：2008-04-10
申请号：PCT/US2007064437
申请日：2007-03-20
申请人： FLEXTRONICS AP LLC , SHABANY YOUNES , YUM HANS , COLLIS TODD , BISBIKIS STEVE , KOO STEVE , MILLER KIERAN
发明人： SHABANY YOUNES , YUM HANS , COLLIS TODD , BISBIKIS STEVE , KOO STEVE , MILLER KIERAN
IPC分类号： H05K7/20
CPC分类号： H05K7/20572
摘要： Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.
摘要翻译：提供了具有增加的横截面面积的空气入口的电子底盘，其有助于气流通过底盘，从而提供改进的冷却。当电子底盘经常被堆叠时，已经确定下底盘的上表面可以用于至少部分地限定上机架的空气入口。在这方面，可以去除下底盘的上部以增加空气入口的尺寸。也就是说，下机架的上壁和/或顶壁的部分被连接壁（例如锥形和/或倒角壁）移除并连接。同样地，上部底盘的底壁可以被移除。当堆叠时，上机架的进气口可以设置在下机架的截头部分的上方。在这种布置中，所得空气进口的尺寸显着增加。

5. 发明申请

WO2006014402A3 DENTAL LIGHT DEVICE HAVING AN IMPROVED HEAT SINK 审中-公开
公开(公告)号：WO2006014402A3
公开(公告)日：2006-02-09
申请号：PCT/US2005/023736
申请日：2005-06-30
申请人： DISCUS DENTAL IMPRESSIONS, INC , HAYMAN, Robert , SHABANY, Younes , ROSE, Eric, P.
发明人： HAYMAN, Robert , SHABANY, Younes , ROSE, Eric, P.
IPC分类号： A61C1/00 , A61B1/06
摘要： The present invention relates to a heat sink material (1200) that can more efficiently remove or divert heat from a light source (1300) or sources with a given weight of heat sink material (1200) when compared to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device (1000) when a reduced weight of heat sink material is used. The inventive heat sink (1200) has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

6. 发明申请

WO2007070758A3 AIRFLOW MANAGEMENT SYSTEM FOR ELECTRONICS CHASSIS 审中-公开
标题翻译：电子换档航空管理系统
公开(公告)号：WO2007070758A3
公开(公告)日：2009-04-16
申请号：PCT/US2006061695
申请日：2006-12-06
申请人： FLEXTRONICS AP LLC , SHABANY YOUNES
发明人： SHABANY YOUNES
IPC分类号： H05K7/20
CPC分类号： H05K7/20581
摘要： An electronics chassis is provided that utilizes multiple fan units, each of which may incorporate multiple fans, to improve airflow through an internal enclosure of the chassis. Various combinations of multiple fan units are utilized to increase airflow and provide redundancy in the event of the failure of one or more fans. In one arrangement, combinations of horizontally mounted and vertically mounted fans are utilized to improve airflow. In further arrangements, multiple access openings are provided into the enclosure such that an individual fan unit or an individual fan may be accessed for servicing purposes "without altering or discontinuing the operation of other fans or fan units.
摘要翻译：提供了一种电子机箱，其利用多个风扇单元，每个风扇单元可以并入多个风扇，以改善通过底盘的内部外壳的气流。利用多个风扇单元的各种组合来增加气流并且在一个或多个风扇发生故障的情况下提供冗余。在一种布置中，使用水平安装和垂直安装的风扇的组合来改善气流。在进一步的布置中，多个进入开口设置在外壳中，使得单独的风扇单元或单独的风扇可以被访问用于维修目的“而不改变或停止其他风扇或风扇单元的操作。

7. 发明申请

WO2007140110A2 LIQUID-AIR HYBRID COOLING IN ELECTRONICS EQUIPMENT 审中-公开
标题翻译：电子设备中的液体空气混合冷却
公开(公告)号：WO2007140110A2
公开(公告)日：2007-12-06
申请号：PCT/US2007/068894
申请日：2007-05-14
申请人： FLEXTRONICS AP, LLC , SHABANY, Younes
发明人： SHABANY, Younes
IPC分类号： H05K7/20
CPC分类号： H05K7/20645 , H05K7/20781
摘要： Provided herein are hybrid-cooled electronics chassis and boards. Such boards may be plugged in a chassis and connected to a common liquid-cooling loop shared by two or more of the boards inside that chassis. Liquid cooling conduits between the electronics board/module and the chassis are engaged and disengaged with little or no manual intervention. For instance, the connections between such cooling conduits may utilize quick coupling connectors that allow for automatic or near automatic engagement and disengagement upon the engagement of the electronics board/module with the electronics chassis. In one arrangement, a chassis includes a base portion that has a fan, liquid cooling system and heat exchanger mounted thereon. An electronics module is selectively engageable with the base portion in a manner to have air displaced across the electronics module when engaged as well establish liquid flow through the electronics module when engaged.
摘要翻译：这里提供了混合冷却电子机箱和电路板。这样的电路板可以插入机箱并连接到由该机箱内的两个或多个板共用的公共液冷回路。电子板/模块和底盘之间的液体冷却导管在很少或没有手动干预的情况下接合和分离。例如，这种冷却管道之间的连接可以利用快速耦合连接器，其允许在电子板/模块与电子底盘的接合时自动或接近自动接合和分离。在一种布置中，底架包括具有安装在其上的风扇，液体冷却系统和热交换器的基座部分。电子模块可选择性地与基部接合，以便在接合时具有穿过电子模块的空气，同时在接合时建立通过电子模块的液体流。

8. 发明申请

WO2006014402A2 DENTAL LIGHT DEVICE HAVING AN IMPROVED HEAT SINK 审中-公开
标题翻译：具有改进的散热器的牙科灯具
公开(公告)号：WO2006014402A2
公开(公告)日：2006-02-09
申请号：PCT/US2005023736
申请日：2005-06-30
申请人： DISCUS DENTAL IMPRESSIONS INC , HAYMAN ROBERT , SHABANY YOUNES , ROSE ERIC P
发明人： HAYMAN ROBERT , SHABANY YOUNES , ROSE ERIC P
IPC分类号： A61C1/00
CPC分类号： A61K8/21 , A61C19/004 , A61K6/0643 , A61K6/08 , A61K8/19 , A61K8/20 , A61K8/24 , A61Q11/00 , F28D20/02 , F28D2021/0029 , C08L91/06
摘要： The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compared to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.
摘要翻译：本发明涉及一种散热材料，当与由诸如金属的导热材料的固体块制成的散热器相比时，散热材料可以更有效地从具有给定重量的散热材料的光源或源移除或转移热量。它还涉及一种散热器，当使用减重的重量的散热材料时，可以更有效地从固化灯装置中去除或转移热量。本发明的散热器具有至少一种合适的相变材料，包括有机材料，无机材料及其组合。这些材料可能经历基本上可逆的相变，并且通常可以经历大的（如果不是无限数量的循环）而不失去其有效性。

9. 发明申请

WO2013010038A3 HEAT TRANSFER SYSTEM WITH INTEGRATED EVAPORATOR AND CONDENSER 审中-公开
标题翻译：具有集成蒸发器和冷凝器的热传递系统
公开(公告)号：WO2013010038A3
公开(公告)日：2013-03-07
申请号：PCT/US2012046553
申请日：2012-07-12
申请人： FLEXTRONICS AP LLC , SHABANY YOUNES
发明人： SHABANY YOUNES
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20
CPC分类号： F28D15/0233 , F28D15/0266 , F28D15/06 , F28D2021/0028 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Two phase heat transfer systems including integrated fluid transfer paths for exchange of a working fluid between an evaporator and condenser. Separate fluid transfer paths may be defined for communication of working fluid between the evaporator and condenser, wherein at least one of the fluid transfer paths is integrated with the evaporator and/or condenser. In one embodiment, both first and second fluid transfer paths are integrally provided to establish direct fluid communication between the evaporator and condenser to facilitate flow of vaporized and condensed working fluid respectively.
摘要翻译：两相传热系统，包括用于在蒸发器和冷凝器之间交换工作流体的集成流体传输路径。可以限定分离的流体传送路径用于在蒸发器和冷凝器之间的工作流体的通信，其中至少一个流体传送路径与蒸发器和/或冷凝器集成。在一个实施例中，第一和第二流体传送路径被一体地设置以在蒸发器和冷凝器之间建立直接的流体连通，以便于分别促进汽化和冷凝的工作流体的流动。

10. 发明申请

WO2007140110A3 LIQUID-AIR HYBRID COOLING IN ELECTRONICS EQUIPMENT 审中-公开
标题翻译：电子设备中的液体空气混合冷却
公开(公告)号：WO2007140110A3
公开(公告)日：2008-08-07
申请号：PCT/US2007068894
申请日：2007-05-14
申请人： FLEXTRONICS AP LLC , SHABANY YOUNES
发明人： SHABANY YOUNES
IPC分类号： H05K7/20
CPC分类号： H05K7/20645 , H05K7/20781
摘要： Provided herein are hybrid-cooled electronics chassis and boards. Such boards may be plugged in a chassis and connected to a common liquid-cooling loop shared by two or more of the boards inside that chassis. Liquid cooling conduits between the electronics board/module and the chassis are engaged and disengaged with little or no manual intervention. For instance, the connections between such cooling conduits may utilize quick coupling connectors that allow for automatic or near automatic engagement and disengagement upon the engagement of the electronics board/module with the electronics chassis. In one arrangement, a chassis includes a base portion that has a fan, liquid cooling system and heat exchanger mounted thereon. An electronics module is selectively engageable with the base portion in a manner to have air displaced across the electronics module when engaged as well establish liquid flow through the electronics module when engaged.
摘要翻译：这里提供了混合冷却电子机箱和电路板。这样的电路板可以插入机箱并连接到由该机箱内的两个或多个板共用的公共液冷回路。电子板/模块和底盘之间的液体冷却导管在很少或没有手动干预的情况下接合和分离。例如，这种冷却导管之间的连接可以利用快速耦合连接器，其允许在电子板/模块与电子底盘的接合时自动或接近自动地接合和分离。在一种布置中，底架包括具有安装在其上的风扇，液体冷却系统和热交换器的基座部分。电子模块可选择性地与基部接合，以便在接合时具有穿过电子模块的空气，同时在接合时建立通过电子模块的液体流。

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