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1. 发明申请

WO2007109581A3 RESILIENT GROUNDING CLIP IN ELECTRONICS CHASSIS 审中-公开
公开(公告)号：WO2007109581A3
公开(公告)日：2007-09-27
申请号：PCT/US2007/064232
申请日：2007-03-16
申请人： FLEXTRONICS AP, LLC , BISBIKIS, Steve , KOO, Steve , COLLIS, Todd
发明人： BISBIKIS, Steve , KOO, Steve , COLLIS, Todd
IPC分类号： H05K5/00
摘要： The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insures that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.

2. 发明申请

WO2007109683A3 INCREASING AIR INLET/OUTLET SIZE FOR ELECTRONICS CHASSIS 审中-公开
标题翻译：增加空气入口/出口尺寸进行电子换档
公开(公告)号：WO2007109683A3
公开(公告)日：2008-04-10
申请号：PCT/US2007064437
申请日：2007-03-20
申请人： FLEXTRONICS AP LLC , SHABANY YOUNES , YUM HANS , COLLIS TODD , BISBIKIS STEVE , KOO STEVE , MILLER KIERAN
发明人： SHABANY YOUNES , YUM HANS , COLLIS TODD , BISBIKIS STEVE , KOO STEVE , MILLER KIERAN
IPC分类号： H05K7/20
CPC分类号： H05K7/20572
摘要： Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.
摘要翻译：提供了具有增加的横截面面积的空气入口的电子底盘，其有助于气流通过底盘，从而提供改进的冷却。当电子底盘经常被堆叠时，已经确定下底盘的上表面可以用于至少部分地限定上机架的空气入口。在这方面，可以去除下底盘的上部以增加空气入口的尺寸。也就是说，下机架的上壁和/或顶壁的部分被连接壁（例如锥形和/或倒角壁）移除并连接。同样地，上部底盘的底壁可以被移除。当堆叠时，上机架的进气口可以设置在下机架的截头部分的上方。在这种布置中，所得空气进口的尺寸显着增加。

3. 发明申请

WO2007109683A2 INCREASING AIR INLET/OUTLET SIZE FOR ELECTRONICS CHASSIS 审中-公开
标题翻译：增加空气入口/出口尺寸进行电子换档
公开(公告)号：WO2007109683A2
公开(公告)日：2007-09-27
申请号：PCT/US2007/064437
申请日：2007-03-20
申请人： FLEXTRONICS AP, LLC , SHABANY, Younes , YUM, Hans , COLLIS, Todd , BISBIKIS, Steve , KOO, Steve , MILLER, Kieran
发明人： SHABANY, Younes , YUM, Hans , COLLIS, Todd , BISBIKIS, Steve , KOO, Steve , MILLER, Kieran
IPC分类号： H05K7/20
CPC分类号： H05K7/20572
摘要： Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.
摘要翻译：提供了具有增加的横截面面积的空气入口的电子底盘，其有助于气流通过底盘，从而提供改进的冷却。当电子底盘经常被堆叠时，已经确定下底盘的上表面可以用于至少部分地限定上机架的空气入口。在这方面，可以去除下底盘的上部以增加空气入口的尺寸。也就是说，下机架的上壁和/或顶壁的部分被连接壁（例如锥形和/或倒角的壁）移除并连接。同样地，上部底盘的底壁可以被移除。当堆叠时，上机架的进气口可以设置在下机架的截头部分的上方。在这种布置中，所得空气进口的尺寸显着增加。

4. 发明申请

WO2007109581A2 RESILIENT GROUNDING CLIP IN ELECTRONICS CHASSIS 审中-公开
标题翻译：电子底座中的电缆接地片
公开(公告)号：WO2007109581A2
公开(公告)日：2007-09-27
申请号：PCT/US2007064232
申请日：2007-03-16
申请人： FLEXTRONICS AP LLC , BISBIKIS STEVE , KOO STEVE , COLLIS TODD
发明人： BISBIKIS STEVE , KOO STEVE , COLLIS TODD
IPC分类号： H05K5/00
CPC分类号： H05K9/0062 , G06F1/182 , H05K9/0016
摘要： The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insures that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.
摘要翻译：这里的装置和方法为插入到计算机卡底盘（例如，VME机架，CompactPCI机箱，ATCA机箱等）中的计算机卡提供了接地。弹性夹可以配置有计算机卡底盘的底盘构件。夹子固定在计算机卡底座上，并与地平面保持接触，如ESD屏蔽。夹具可以具有自锁机构，其确保夹具位于与底架构件的固定位置。然后可以将计算机卡插入计算机卡底盘，从而与弹性夹接触。计算机卡可以包括接地销，其插入通过底盘构件内的孔以与弹性夹接触。因此，插入的计算机卡可以从计算机卡机箱提供ESD保护以及接地参考电位。

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