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1. 发明申请

WO2007002269A3 PROCESS OF PRODUCING PRINTED WIRING BOARD 审中-公开
标题翻译：生产印刷线路板的过程
公开(公告)号：WO2007002269A3
公开(公告)日：2007-04-26
申请号：PCT/US2006024275
申请日：2006-06-22
申请人： 3M INNOVATIVE PROPERTIES CO , SATOH KAZUO , YAMAZAKI HIDEO , NAKAMORI YUKIO
发明人： SATOH KAZUO , YAMAZAKI HIDEO , NAKAMORI YUKIO
IPC分类号： H05K3/00
CPC分类号： H05K3/0058 , H01L21/4846 , H01L23/49833 , H01L23/4985 , H01L2924/0002 , H05K1/189 , H05K3/0097 , H05K3/386 , H05K2201/2009 , H05K2203/0143 , H05K2203/1105 , H05K2203/1476 , H05K2203/1545 , H01L2924/00
摘要： Provided is a process for providing a printed wiring board equipped with a reinforcing sheet that has simple processing steps, a small number of steps and therefore can be carried out easily, simply and in a short period of time, while also allowing en bloc, large-volume production instead of batch production.
摘要翻译：本发明提供一种配备有增强片的印刷线路板的方法，其具有简单的处理步骤，少量的步骤，并且因此可以容易地，简单地并且在短时间内执行，同时还可以整体地批量生产而不是批量生产。

2. 发明申请

WO2007021687A1 METHOD OF LAMINATING ADHEREND 审中-公开
标题翻译：粘合剂的方法
公开(公告)号：WO2007021687A1
公开(公告)日：2007-02-22
申请号：PCT/US2006/030883
申请日：2006-08-08
申请人： 3M INNOVATIVE PROPERTIES COMPANY , SATOH, Kazuo, , MIKAMI, Haruyuki, , YAMAZAKI, Hideo,
发明人： SATOH, Kazuo, , MIKAMI, Haruyuki, , YAMAZAKI, Hideo,
IPC分类号： B32B37/12 , C09J7/00 , H05K3/46
CPC分类号： B32B37/003 , B32B37/12 , C09J7/38 , C09J7/403 , C09J2201/28 , H05K1/0393 , H05K3/0061 , H05K3/0064 , H05K3/381 , H05K3/386 , H05K2203/066 , H05K2203/1152 , Y10T156/1039
摘要： There is provided a means for laminating and bonding a flexible printed circuit and a stiffener film with an adhesive layer therebetween by using a laminator without creating air bubbles at the lamination surface and without using large-scale manufacturing equipment. A method comprising: providing a laminate in which liners are on upper and lower surfaces of a half-cured reactive adhesive layer (3), removing one of the liners from the laminate, and bonding a surface of a first adherend (2) to the first exposed surface of the adhesive layer; removing the other liner from the laminate, pressure bonding a minute embossing pattern (4) surface of an embossed liner to the second exposed surface of the adhesive layer to form a minute embossing pattern on the surface of the adhesive layer; and removing the embossed liner from the surface of the adhesive layer, and thermocompression bonding a second adherend to the surface of the adhesive layer having the minute embossing pattern.
摘要翻译：提供了一种用于通过使用层压机在其间具有粘合剂层的柔性印刷电路和加强膜的层压和接合的装置，而不在层压表面上产生气泡并且不使用大规模制造设备。一种方法，包括：提供层叠体，其中衬垫位于半固化的反应性粘合剂层（3）的上表面和下表面上，从层压体中去除一个衬垫，并将第一粘附体（2）的表面粘合到粘合剂层的第一暴露表面; 从层压体中除去另一个衬垫，将压花衬垫的微小压花图案（4）表面压粘到粘合剂层的第二暴露表面上，以在粘合剂层的表面上形成微小的压花图案; 从粘合剂层的表面除去压纹衬垫，并将第二被粘物热压到具有微小压花图案的粘合剂层的表面上。

3. 发明申请

WO2006083615A3 METHOD FOR CONNECTING TWO PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARD THEREFORE 审中-公开
标题翻译：用于连接两个印刷电路板和印刷电路板的方法
公开(公告)号：WO2006083615A3
公开(公告)日：2007-03-15
申请号：PCT/US2006002417
申请日：2006-01-24
申请人： 3M INNOVATIVE PROPERTIES CO , SATOH KAZUO , YAMAZAKI HIDEO
发明人： SATOH KAZUO , YAMAZAKI HIDEO
IPC分类号： H05K3/36 , C09J5/06 , H05K1/14
CPC分类号： H05K3/361 , H05K3/28 , H05K3/305 , H05K3/4007 , H05K2201/0367 , H05K2201/09481 , H05K2201/10977 , H05K2203/0733 , H05K2203/1189
摘要： To provide a PCB that does not generate a short-circuit problem even at a very- small pitch and has high connection reliability a method is provided for connecting a PCB (10) having a connection portion (3) to a second PCB (20) having a connection portion (33) wherein the connection portion of one or both of the PCBs has at least one conductive bump (4) , and comprising: positioning the connection portion of the PCB opposite the connection portion of the second circuit board with a thermosetting adhesive film (30) between the connection portions of the PCB and second circuit board, and applying heat and pressure to the connection portions and the thermosetting adhesive film such that the adhesive film is displaced sufficiently to allow electrical contact between the at least one bump and the connection portion of the opposing circuit board and such that the heat is sufficient to cause the adhesive to set. Also provided is an article comprising a PCB having a connection portion with at least one conductive bump, and a thermosetting adhesive film on the surface of the connection portion.
摘要翻译：为了提供即使在非常小的间距也不产生短路问题的PCB并且具有高的连接可靠性，提供了一种用于将具有连接部分（3）的PCB（10）连接到第二PCB（20）的方法，具有连接部分（33），其中一个或两个PCB的连接部分具有至少一个导电凸块（4），并且包括：将PCB的与第二电路板的连接部分相对的连接部分与热固性在所述PCB和第二电路板的连接部分之间的粘合膜（30），并且向连接部分和热固性粘合剂膜施加热和压力，使得粘合剂膜充分移位以允许至少一个凸起和相对电路板的连接部分，使得热量足以使粘合剂固化。还提供了一种制品，其包括具有至少一个导电凸块的连接部分的PCB和在连接部分的表面上的热固性粘合剂膜。

4. 发明申请

WO2007002269A2 PROCESS OF PRODUCING PRINTED WIRING BOARD 审中-公开
标题翻译：生产印刷线路板的工艺
公开(公告)号：WO2007002269A2
公开(公告)日：2007-01-04
申请号：PCT/US2006/024275
申请日：2006-06-22
申请人： 3M INNOVATIVE PROPERTIES COMPANY , SATOH, Kazuo , YAMAZAKI, Hideo , NAKAMORI, Yukio
发明人： SATOH, Kazuo , YAMAZAKI, Hideo , NAKAMORI, Yukio
CPC分类号： H05K3/0058 , H01L21/4846 , H01L23/49833 , H01L23/4985 , H01L2924/0002 , H05K1/189 , H05K3/0097 , H05K3/386 , H05K2201/2009 , H05K2203/0143 , H05K2203/1105 , H05K2203/1476 , H05K2203/1545 , H01L2924/00
摘要： Provided is a process for providing a printed wiring board equipped with a reinforcing sheet that has simple processing steps, a small number of steps and therefore can be carried out easily, simply and in a short period of time, while also allowing en bloc, large-volume production instead of batch production.
摘要翻译：提供了一种具有加工板的印刷线路板的方法，其具有简单的加工步骤，少量的步骤，因此可以简单且在短时间内容易地进行，同时还允许整体，大的 - 批量生产而不是批量生产。

5. 发明申请

WO1986000253A1 CUTTER USED AS CUTTING AND GRINDING TOOLS 审中-公开
标题翻译：切割机用作切割和研磨工具
公开(公告)号：WO1986000253A1
公开(公告)日：1986-01-16
申请号：PCT/JP1985000350
申请日：1985-06-21
申请人： CREATIVE SCIENCE TECHNOLOGY INSTITUTE, INC. , MUKOHDA, Bunzo , SATOH, Kazuo
发明人： CREATIVE SCIENCE TECHNOLOGY INSTITUTE, INC.
IPC分类号： B24D07/00
CPC分类号： B23D61/025 , B24D5/12 , B28D1/041
摘要： A cutting edge portion (2) of this cutter (A) used as cutting and grinding tools is provided with a plurality of through holes (7). The cutting edge portion (2) including these holes (7) is further provided thereon with cutting or grinding grains (8) which have been laid on the surface of the edge portion (2) by electro-deposition. When the front of the cutting edge portion (2) is worn, a new edge is formed due to the provision of the through holes (7), i.e., the new edge is naturally generated. These holes (7) also enable the ground powder and chips to be disposed of effectively, and effectively prevent overheating of the cutting edge portion (2).
摘要翻译：用作切割和研磨工具的该切割器（A）的切割边缘部分（2）设置有多个通孔（7）。包括这些孔（7）的切割边缘部分（2）还设置有通过电沉积放置在边缘部分（2）的表面上的切割或研磨颗粒（8）。当切削刃部分（2）的前部磨损时，由于设置通孔（7）而形成新的边缘，即新的边缘是自然产生的。这些孔（7）还能够有效地处理粉碎粉碎物，有效地防止切削刃部（2）的过热。

6. 发明申请

WO1983000838A1 RUBBER SHEET BONDING DEVICE 审中-公开
标题翻译：橡胶板粘接装置
公开(公告)号：WO1983000838A1
公开(公告)日：1983-03-17
申请号：PCT/JP1982000350
申请日：1982-08-31
申请人： SUMITOMO RUBBER INDUSTRIES, LIMITED , SATOH, Kazuo , NOSAKA, Tsutomu
发明人： SUMITOMO RUBBER INDUSTRIES, LIMITED
IPC分类号： B29H17/10
CPC分类号： B29D30/3007 , B29D2030/427 , B29D2030/428 , B29D2030/4437 , B29D2030/4443 , B29D2030/445
摘要： Dispositif de soudage de feuille en caoutchouc fournissant une feuille en caoutchouc non vulcanisée (11) à un tambour de moulage (1) principalement pendant le moulage d'un pneu brut pour le souder à la périphérie extérieure du tambour (1) et le relier de manière annulaire aux parties périphériques. La feuille en caoutchouc (11) est appliquée après étirement de son extrémité d'une quantité appropriée de manière à empêcher la production d'un joint déficient à cause du retrait de la feuille (11), et la feuille en caoutchouc suivante est découpée à la même longueur que la longueur périphérique extérieure du reste du tambour pendant l'étape où elle est enroulée autour de la périphérie du tambour (1).

7. 发明申请

WO2006127721A1 METHOD FOR FORMING VIA HOLE IN SUBSTRATE FOR FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用于在柔性印刷电路板的基板中形成孔的方法
公开(公告)号：WO2006127721A1
公开(公告)日：2006-11-30
申请号：PCT/US2006/019940
申请日：2006-05-23
申请人： 3M INNOVATIVE PROPERTIES COMPANY , SATOH, Kazuo , YAMAZAKI, Hideo
发明人： SATOH, Kazuo , YAMAZAKI, Hideo
IPC分类号： H05K3/00 , H05K1/03
CPC分类号： H05K3/002 , H05K1/0393 , H05K3/064 , H05K3/388 , H05K2203/0361 , H05K2203/0554
摘要： There is provided a method for forming a via hole (2) in a substrate (10) for a flexible printed circuit board, the method being capable of simply forming a via hole having an excellent circularness of an opening portion and high reliability. In a method for forming a via hole in a substrate for a flexible printed circuit board, the method includes the steps: forming a first thin film layer (11) containing metal or alloy and having a thickness of less than 2 µm on one surface (15) of a substrate, disposing a second thin film layer (12) over the first thin film layer (11), selectively removing a portion, corresponding to a region where the via hole (2) is formed, of the second thin film layer (12), etching the first thin film layer (11), and subjecting the substrate (10) to chemical milling to form the via hole (2).
摘要翻译：提供了一种在用于柔性印刷电路板的基板（10）中形成通孔（2）的方法，该方法能够简单地形成具有优异的开口部圆形度和高可靠性的通孔。在柔性印刷电路板用基板中形成通孔的方法中，该方法包括以下步骤：在一个表面上形成含有金属或合金的厚度小于2μm的第一薄膜层（11） 15），在第一薄膜层（11）上设置第二薄膜层（12），选择性地除去与形成有通孔（2）的区域相对应的第二薄膜层（12），蚀刻第一薄膜层（11），对基板（10）进行化学研磨以形成通孔（2）。

8. 发明申请

WO2006083615A2 METHOD FOR CONNECTING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：连接印刷电路板的方法
公开(公告)号：WO2006083615A2
公开(公告)日：2006-08-10
申请号：PCT/US2006/002417
申请日：2006-01-24
申请人： 3M INNOVATIVE PROPERTIES COMPANY , SATOH, Kazuo , YAMAZAKI, Hideo
发明人： SATOH, Kazuo , YAMAZAKI, Hideo
CPC分类号： H05K3/361 , H05K3/28 , H05K3/305 , H05K3/4007 , H05K2201/0367 , H05K2201/09481 , H05K2201/10977 , H05K2203/0733 , H05K2203/1189
摘要： To provide a PCB that does not generate a short-circuit problem even at a very small pitch and has high connection reliability a method is provided for connecting a printed circuit board (PCB) to a second circuit board comprising: providing a printed circuit board (PCB) having a connection portion; providing a second circuit board having a connection portion, the second circuit board to be connected to the PCB, wherein the connection portion of one or both of the PCB and second circuit board has at least one conductive bump, positioning the connection portion of the PCB opposite the connection portion of the second circuit board with a thermosetting adhesive film between the connection portions of the PCB and second circuit board, and applying heat and pressure to the connection portions and the thermosetting adhesive film such that the adhesive film is displaced sufficiently to allow electrical contact between the at least one bump and the connection portion of the opposing circuit board and such that the heat is sufficient to cause the adhesive to set. Also provided is an article comprising a PCB having a connection portion with at least one conductive bump, and a thermosetting adhesive film on the surface of the connection portion.
摘要翻译：为了提供即使以非常小的间距也不产生短路问题的PCB，并且具有高的连接可靠性，提供了一种将印刷电路板（PCB）连接到第二电路板的方法，包括：提供印刷电路板（ PCB）具有连接部分; 提供具有连接部分的第二电路板，要连接到PCB的第二电路板，其中PCB和第二电路板中的一个或两者的连接部分具有至少一个导电凸块，将PCB的连接部分与第二电路板的连接部分相对，在PCB和第二电路板的连接部分之间具有热固性粘合剂膜，并且向连接部分和热固性粘合剂膜施加热和压力，使得粘合剂膜充分移位以允许所述至少一个凸块与相对的电路板的连接部分之间的电接触，并且使得热量足以使粘合剂固化。还提供了一种制品，其包括具有至少一个导电凸块的连接部分的PCB和在连接部分的表面上的热固性粘合剂膜。

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