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1. 发明申请

WO2009110764A2 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION 审中-公开
标题翻译：正性光敏聚酰亚胺组合物
公开(公告)号：WO2009110764A2
公开(公告)日：2009-09-11
申请号：PCT/KR2009001121
申请日：2009-03-06
申请人： LG CHEMICAL LTD , SEONG HYE-RAN , PARK CHAN-HYO , OH DONG-HYUN , SHIN HYE-IN , KIM KYUNG-JUN , SHIN SE-JIN
发明人： SEONG HYE-RAN , PARK CHAN-HYO , OH DONG-HYUN , SHIN HYE-IN , KIM KYUNG-JUN , SHIN SE-JIN
IPC分类号： G03F7/039
CPC分类号： G03F7/0233 , H01L51/5237 , H01L51/5253
摘要： The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.
摘要翻译：本发明涉及包括聚酰亚胺，聚酰胺酸和光敏化合物的正型光敏聚酰亚胺组合物。包含正性光敏聚酰亚胺组合物的有机发光器件（OLED）用有机绝缘层可以控制锥角和释气，并且相对于基板具有优异的粘附性，防水控制能力和储存稳定性，并且喜欢。

2. 发明申请

WO2008120915A1 MANUFACTURING METHOD OF FILM HAVING MICRO-PATTERN THEREON AND FILM MANUFACTURED THEREBY 审中-公开
标题翻译：具有微型薄膜的薄膜制造方法及其制造方法
公开(公告)号：WO2008120915A1
公开(公告)日：2008-10-09
申请号：PCT/KR2008/001754
申请日：2008-03-28
申请人： LG CHEM, LTD. , CHOI, Hyun Seok , LEE, Yeon Keun , LEE, Kwang Joo , PARK, Chan Hyo , CHOI, Bo Yun
发明人： CHOI, Hyun Seok , LEE, Yeon Keun , LEE, Kwang Joo , PARK, Chan Hyo , CHOI, Bo Yun
IPC分类号： G02B5/02
CPC分类号： G03F7/2032 , G02B6/0053 , G02B6/0065 , G03F7/2022 , Y10T428/24479
摘要： A method of efficiently manufacturing a film having micro-patterns and an optical film manufactured using the same are used for various optical purposes. The method includes forming a first micro-pattern on one face of the film, and forming a second micro-pattern, which has a geometry equal to that of the first micro-pattern, on the other face of the film by a photo-lithography method using the first micro-pattern formed on one face of the film as a photomask.
摘要翻译：为了各种光学目的，使用有效地制造具有微图形的膜的方法和使用其制造的光学膜。该方法包括在膜的一个面上形成第一微图案，并且通过光刻法在膜的另一个表面上形成具有与第一微图案几何相等的几何形状的第二微图案使用形成在膜的一个面上的第一微图案作为光掩模。

3. 发明申请

WO2005029177A1 LIQUID PHOTO SOLDER RESIST COMPOSITION AND PHOTO SOLDER RESIST FILM THEREOF 审中-公开
标题翻译：液体照片焊接电阻组合物及其照片焊接电阻膜
公开(公告)号：WO2005029177A1
公开(公告)日：2005-03-31
申请号：PCT/KR2004/001158
申请日：2004-05-17
申请人： KOLON INDUSTRIES INC. , PARK, Chan-Hyo , MOON, Sung-Bae , BONG, Dong-Hun , CHUNG, Chang-Beom
发明人： PARK, Chan-Hyo , MOON, Sung-Bae , BONG, Dong-Hun , CHUNG, Chang-Beom
IPC分类号： G03C1/04
CPC分类号： C08F283/10 , G03F7/038 , H05K3/287
摘要： The present invention is directed to a liquid photo solder resist composition and a solder resist film prepared from the composition. In the liquid photo solder resist composition including a UV-curing resin developable with an aqueous alkali solution, a UV-reactive acrylic monomer, an epoxy resin, a photopolymerization initiator, and an organic solvent, the epoxy resin has an isocyanurate structure comprising one epoxy group and at least two acryl groups in one molecule as prepared by steps including: (a) reacting a cyanurate compound with an acrylate-based monomer to yield a product having acryl groups; and (b) adding an epichlorohydrine to the product of the step (a). The photo solder resist film prepared from the liquid photo solder resist composition guarantees a wide dry control width without surface stickiness and provides excellent properties.
摘要翻译：本发明涉及由该组合物制备的液体光阻焊剂组合物和阻焊膜。在包含用碱性水溶液显影的UV固化树脂，UV反应性丙烯酸单体，环氧树脂，光聚合引发剂和有机溶剂的液态光阻焊剂组合物中，环氧树脂具有包含一个环氧树脂的异氰脲酸酯结构基团和至少两个丙烯酸基团，其通过以下步骤制备，所述方法包括：（a）使氰尿酸酯化合物与丙烯酸酯基单体反应，得到具有丙烯酰基的产物; 和（b）向步骤（a）的产物中加入表氯醇。由液态光阻焊剂组合物制备的光阻焊膜保证宽的干燥控制宽度，无表面粘性，并提供优异的性能。

4. 发明申请

WO2009142435A2 PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYIMIDE RESIN AND NOVOLAK RESIN 审中-公开
标题翻译：含有聚酰胺树脂和NOVOLAK树脂的感光树脂组合物
公开(公告)号：WO2009142435A2
公开(公告)日：2009-11-26
申请号：PCT/KR2009002646
申请日：2009-05-20
申请人： LG CHEMICAL LTD , PARK CHAN HYO , SHIN HYE IN , SEONG HYE RAN , KIM KYUNG JUN , OH DONG HYUN
发明人： PARK CHAN HYO , SHIN HYE IN , SEONG HYE RAN , KIM KYUNG JUN , OH DONG HYUN
IPC分类号： G03F7/037
CPC分类号： G03F7/0233 , G03F7/0046 , G03F7/40
摘要： Provided is a specified resin composition which can easily control the angle of the lateral sides of a pattern, as a photosensitive-heat resistant resin composition comprising a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. When the photosensitive heat-resistant resin composition is used, the difference of development between an exposed portion and an unexposed portion in forming patterns is great, and sensitivity, resolution, heat resistance and adhesive properties are very excellent. Especially, the angle of the lateral sides of patterns can be easily controlled by a composition ratio of the resins. Thus, the resin composition can be used in forming a pattern circuit on an insulating layer of an OLED.
摘要翻译：提供一种指定的树脂组合物，其可以容易地控制图案的侧面的角度，作为感光耐热树脂组合物，其包含a）碱溶性聚酰亚胺树脂，b）碱溶性酚醛清漆树脂，c）光敏剂，和d）有机溶剂。当使用感光耐热树脂组合物时，形成图案中的曝光部分和未曝光部分之间的显影差异很大，并且灵敏度，分辨率，耐热性和粘合性能非常优异。特别地，可以通过树脂的组成比容易地控制图案的侧面的角度。因此，树脂组合物可以用于在OLED的绝缘层上形成图案电路。

5. 发明申请

WO2009110764A3 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION 审中-公开
公开(公告)号：WO2009110764A3
公开(公告)日：2009-09-11
申请号：PCT/KR2009/001121
申请日：2009-03-06
申请人： LG CHEM, LTD. , SEONG, Hye-Ran , PARK, Chan-Hyo , OH, Dong-Hyun , SHIN, Hye-In , KIM, Kyung-Jun , SHIN, Se-Jin
发明人： SEONG, Hye-Ran , PARK, Chan-Hyo , OH, Dong-Hyun , SHIN, Hye-In , KIM, Kyung-Jun , SHIN, Se-Jin
IPC分类号： G03F7/039
摘要： The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.

6. 发明申请

WO2011139073A3 NEGATIVE PHOTORESIST COMPOSITION, AND METHOD FOR PATTERNING DEVICE 审中-公开
标题翻译：负面光电组合物，以及用于绘制装置的方法
公开(公告)号：WO2011139073A3
公开(公告)日：2012-03-22
申请号：PCT/KR2011003306
申请日：2011-05-03
申请人： LG CHEMICAL LTD , PARK CHAN-HYO , KIM KYUNG-JUN , KIM YU-NA
发明人： PARK CHAN-HYO , KIM KYUNG-JUN , KIM YU-NA
IPC分类号： G03F7/004 , H01L21/027
CPC分类号： G03F7/0384 , G03F7/0045 , G03F7/0382 , G03F7/30 , G03F7/38 , G03F7/40
摘要： The present invention relates to a negative photoresist composition which shows excellent sensitivity and enables formation of a satisfactory photoresist pattern having a reverse tapered shape, thereby enabling effective patterning of various thin films during a manufacturing process of a device and capable of being easily removed after patterning, and a method for patterning a device. The photoresist composition comprises: an alkali-soluble binder resin; a first photoacid generator containing a halogen atom; a triazine-based second photoacid generator; a crosslinking agent containing an alkoxy structure; and a solvent.
摘要翻译：本发明涉及一种负光致抗蚀剂组合物，其显示出优异的灵敏度并且能够形成具有倒锥形形状的令人满意的光致抗蚀剂图案，从而能够在器件的制造过程中有效地构图各种薄膜，并且能够在图案化之后容易地除去，以及用于图案化装置的方法。光致抗蚀剂组合物包括：碱溶性粘合剂树脂; 含有卤素原子的第一种光致酸产生剂; 基于三嗪的第二光酸产生剂; 含有烷氧基结构的交联剂; 和溶剂。

7. 发明申请

WO2011008036A3 PHOTOSENSITIVE POLYIMIDE AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME 审中-公开
标题翻译：含有聚酰亚胺和感光性树脂组合物
公开(公告)号：WO2011008036A3
公开(公告)日：2011-06-23
申请号：PCT/KR2010004614
申请日：2010-07-15
申请人： LG CHEMICAL LTD , JO JUNG HO , KIM KYUNG JUN , SEONG HYE RAN , JEONG HYE WON , PARK CHAN HYO , KIM YU NA , KIM SANG WOO , SHIN SE JIN , AHN KYOUNG HO
发明人： JO JUNG HO , KIM KYUNG JUN , SEONG HYE RAN , JEONG HYE WON , PARK CHAN HYO , KIM YU NA , KIM SANG WOO , SHIN SE JIN , AHN KYOUNG HO
IPC分类号： C08G73/10 , C08G61/12 , C08L79/08 , G03F7/037
CPC分类号： G03F7/0233 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/16 , C08L79/08 , G03F7/0048
摘要： The present invention relates to a polyimide or to a precursor thereof, as expressed in chemical formula 1 or 2, and to a photosensitive resin composition comprising same. The polyimide or the precursor thereof is produced from a diamine containing a polyalkylene oxide. The photosensitive resin composition of the present invention not only has excellent optical transmittance, resolution, photosensitivity and image-forming capability, but also exhibits superior adhesion properties to a substrate of silicon film, silicon oxide film or metal film. Particularly, the photosensitive resin composition of the present invention can be produced into a high-quality film with no defects such as cracks or the like.
摘要翻译：本发明涉及如化学式1或2所示的聚酰亚胺或其前体，以及涉及包含其的感光性树脂组合物。聚酰亚胺或其前体由含有聚环氧烷的二胺制成。本发明的感光性树脂组合物不仅具有优异的光透射率，分辨率，光敏性和成像能力，而且对硅膜，氧化硅膜或金属膜的基板表现出优异的粘附性。特别地，本发明的感光性树脂组合物可以制造成没有缺陷如裂纹等的高质量的膜。

8. 发明申请

WO2011111965A3 PHOTOSENSITIVE ORGANIC INSULATION COMPOSITION FOR AN OLED DEVICE 审中-公开
标题翻译：用于OLED器件的光敏有机绝缘组合物
公开(公告)号：WO2011111965A3
公开(公告)日：2012-01-05
申请号：PCT/KR2011001562
申请日：2011-03-07
申请人： LG CHEMICAL LTD , KIM SANG WOO , AHN KYOUNG HO , KIM KYUNG JUN , SHIN SE JIN , JEONG HYE WON , PARK CHAN HYO , JO JUNG HO , KIM YU NA
发明人： KIM SANG WOO , AHN KYOUNG HO , KIM KYUNG JUN , SHIN SE JIN , JEONG HYE WON , PARK CHAN HYO , JO JUNG HO , KIM YU NA
IPC分类号： G03F7/004 , C08J5/18 , G03F7/039 , H01B3/38
CPC分类号： G03F7/0007 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/1082 , C09D179/08 , G03F7/0233 , H01B3/30 , H01B3/306
摘要： The present invention relates to polyimide expressed by chemical formula 1 or 2, or to a precursor thereof, and to a photosensitive organic insulation composition comprising the polyimide or the precursor. The polyimide or the precursor thereof is prepared from a diamine comprising polyakylene oxide. When used for an OLED device, the photosensitive organic insulation composition of the present invention can be hardened at a low temperature, shorten the time required for hardening, form a low taper angle, and produce a film with high sensitivity and no residuals on the edge thereof. In addition, the composition of the present invention is a positive photosensitive composition, the light exposure portion of which has superior solubility in an alkali solution, thus minimizing foreign substances during development.
摘要翻译：本发明涉及由化学式1或2表示的聚酰亚胺或其前体以及包含聚酰亚胺或前体的光敏有机绝缘组合物。聚酰亚胺或其前体由包含聚氧化烯的二胺制备。当用于OLED器件时，本发明的光敏有机绝缘组合物可以在低温下硬化，缩短硬化所需的时间，形成低锥角，并且产生具有高灵敏度的膜并且在边缘上没有残留物它们。此外，本发明的组合物是阳光敏组合物，其曝光部分在碱溶液中具有优异的溶解性，从而使显影期间的异物最小化。

9. 发明申请

WO2011008042A3 A POLYIMIDE AND A LIGHT-SENSITIVE RESIN COMPOSITION COMPRISING THE SAME 审中-公开
标题翻译：聚酰亚胺和包含其的光敏树脂组合物
公开(公告)号：WO2011008042A3
公开(公告)日：2011-06-09
申请号：PCT/KR2010004634
申请日：2010-07-16
申请人： LG CHEMICAL LTD , KIM SANG WOO , PARK CHAN HYO , KIM KYUNG JUN , SEONG HYE RAN , SHIN SE JIN , JEONG HYE WON , JO JUNG HO
发明人： KIM SANG WOO , PARK CHAN HYO , KIM KYUNG JUN , SEONG HYE RAN , SHIN SE JIN , JEONG HYE WON , JO JUNG HO
IPC分类号： C08G73/10 , C08L79/08 , G03F7/004 , G03F7/039
CPC分类号： G03F7/0233 , C08G73/1042 , C08L61/04 , C08L79/08 , C08L2205/02 , G03F7/0048 , C08L2666/14
摘要： Provided are a polyimide and a light-sensitive resin composition comprising the same, which are employed in the buffer coatings of semiconductors. The polyimide is a polyimide polymer represented by Formula 1. Further, provided is a light-sensitive resin composition which comprises: 1) a soluble BDA series polyimide having an i-ray transmittance of at least 70%; 2) poly(amic acid) having a percentage elongation of at least 40%; 3) a novolac resin; and 4) a diazonaphthoquinone-based light-sensitive substance, and which has a high degree of resolution, high sensitivity, outstanding film characteristics and mechanical properties which are characteristics required of the buffer coatings of semiconductors.
摘要翻译：本发明提供用于半导体缓冲涂层的聚酰亚胺和包含其的光敏树脂组合物。聚酰亚胺是由式1表示的聚酰亚胺聚合物。此外，提供了一种光敏树脂组合物，其包含：1）具有至少70％的i射线透射率的可溶性BDA系列聚酰亚胺; 2）具有至少40％伸长率的聚（酰胺酸）; 3）酚醛清漆树脂; 4）重氮萘醌系感光性物质，作为半导体缓冲被膜所要求的特性，分辨率高，灵敏度高，膜特性，机械特性优异。

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