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1. 发明申请

WO2011163025A1 ELECTRONIC DEVICE MODULE COMPRISING HETEROGENEOUS POLYOLEFIN COPOLYMER AND OPTIONALLY SILANE 审中-公开
标题翻译：包含异质聚烯烃共聚物和可选硅烷的电子器件模块
公开(公告)号：WO2011163025A1
公开(公告)日：2011-12-29
申请号：PCT/US2011/040492
申请日：2011-06-15
申请人： DOW GLOBAL TECHNOLOGIES LLC , NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
发明人： NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
IPC分类号： B32B17/10 , H01L31/048
CPC分类号： H01L31/0203 , B32B17/10018 , B32B17/1055 , B32B17/10697 , B32B17/10788 , C08L23/0815 , C08L2203/204 , H01L31/0481 , H05K1/032 , Y02E10/50
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer characterized as having has an average Mv and a valley temperature between the interpolymer and high crystalline fraction, The, such that the average Mv for a fraction above ThC from ATREF divided by average Mv of the whole polymer from ATREF (MhC/Mp) is less than about 1.95 and wherein the copolymer has a CDBI of less than 60%, (2) optionally, a vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, and (4) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合物材料包括（1）聚烯烃共聚物，由于在互聚物和高结晶部分之间具有平均Mv和谷值温度，所以来自ATREF的高于ThC的馏分的平均Mv除以ATREF（MhC / Mp）之外的整个聚合物的平均Mv小于约1.95，并且其中所述共聚物的CDBI小于60％，（2）任选的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量为至少约0.05重量％共聚物，和（4）任选地，基于共聚物的重量，至少约0.05重量％的助剂。

2. 发明申请

WO2011153541A1 ELECTRONIC DEVICE MODULE COMPRISING FILM OF HOMOGENEOUS POLYOLEFIN COPOLYMER AND GRAFTED SILANE 审中-公开
标题翻译：包含均相聚烯烃共聚物和接枝硅烷的膜的电子器件模块
公开(公告)号：WO2011153541A1
公开(公告)日：2011-12-08
申请号：PCT/US2011/039307
申请日：2011-06-06
申请人： DOW GLOBAL TECHNOLOGIES LLC , NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
发明人： NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
IPC分类号： C08F210/02 , C08L23/00 , H01L31/00
CPC分类号： H01L31/0203 , B32B17/10018 , B32B17/1055 , C08F210/16 , C08L23/08 , H01L23/293 , H01L31/0481 , H01L2924/0002 , Y02E10/50 , C08L2666/24 , C08F210/14 , C08F2500/02 , C08F2500/09 , C08F2500/11 , C08F2500/26 , H01L2924/00
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm 3 ; total unsaturation of not more than 125 per 100,000 carbons;; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/M n ), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145°C) and 1 H-NMR (125°C), (2) grafted vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）乙烯互聚物，其包含总聚合物密度不大于0.905g / cm3; 总不饱和度不超过每100,000个碳原子的125个; 最多3条长支链/ 1000个碳; 乙烯基-3含量小于5 / 100,000碳; 以及小于量（8000 / Mn）的乙烯基/ 1000个碳数的总数，其中通过凝胶渗透色谱法（145℃）和1 H-NMR（125℃）测量乙烯基-3含量和乙烯基测量值），（2）接枝的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量基于共聚物的重量为至少约0.05重量％，和（3）任选地，至少约0.05重量％，基于共聚物的重量。

3. 发明申请

WO2011163024A2 ELECTRONIC DEVICE MODULE COMPRISING LONG CHAIN BRANCHED (LCB), BLOCK, OR INTERCONNECTED COPOLYMERS OF ETHYLENE AND OPTIONALLY SILANE 审中-公开
标题翻译：包含长链分支（LCB），乙烯和可选硅烷的嵌段或互连共聚物的电子器件模块
公开(公告)号：WO2011163024A2
公开(公告)日：2011-12-29
申请号：PCT/US2011040489
申请日：2011-06-15
申请人： DOW GLOBAL TECHNOLOGIES INC , NAUMOVITZ JOHN A , PATEL RAJEN M , WU SHAOFU , NIEMANN DEBRA H
发明人： NAUMOVITZ JOHN A , PATEL RAJEN M , WU SHAOFU , NIEMANN DEBRA H
IPC分类号： B32B17/10
CPC分类号： H01L31/0203 , B32B17/10018 , B32B17/1055 , B32B17/10678 , B32B17/10697 , H01L23/293 , H01L31/0481 , H01L2924/0002 , H05K1/032 , Y02E10/50 , H01L2924/00
摘要： An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm> in °C, and a heat of fusion, Hf in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm > (0.2143* Hf) + 79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.
摘要翻译：公开了一种电子设备模块，包括：A.至少一个电子设备，以及B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）包含至少0.1个戊基通过核磁共振测定的每1000个碳原子的分支，以及DSC结晶度测定的最高峰熔融温度Tm> in℃和熔融热，Hf / J，其中Tm和 Hf对应于Tm>（0.2143×Hf）+ 79.643的关系，并且其中乙烯类聚合物具有小于约1摩尔％的正丁烷共聚单体和小于约0.5摩尔％的正庚烷，戊烯或者正庚烷共聚单体。（2）任选地，基于共聚物重量的至少约0.05重量％的自由基引发剂或光引发剂，（3）任选地，基于以下物质的至少约0.05重量％的量的助剂：共聚物的重量，和（4）任选的乙烯基硅烷化合物。

4. 发明申请

WO2011153540A1 ELECTRONIC DEVICE MODULE COMPRISING FILM OF HOMOGENEOUS POLYOLEFIN COPOLYMER AND ADHESIVE PROPERTY ENHANCING GRAFT POLYMER 审中-公开
标题翻译：包含均相聚烯烃共聚物和粘合性能增强聚合物膜的电子器件模块
公开(公告)号：WO2011153540A1
公开(公告)日：2011-12-08
申请号：PCT/US2011/039305
申请日：2011-06-06
申请人： DOW GLOBAL TECHNOLOGIES LLC , NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
发明人： NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
IPC分类号： C08L23/00 , H01L31/00 , C08F210/02
CPC分类号： H05K1/0353 , B32B17/10018 , B32B17/1055 , B32B17/10697 , C08F210/16 , C08L23/08 , H01L31/0481 , Y02E10/50 , C08L2666/24 , C08F210/14 , C08F2500/08 , C08F2500/09 , C08F2500/26
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm3; total unsaturation of not more than 125 per 100,000 carbons; and; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/Mn), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145°C) and 'H-NMR (125°C), (2) a graft polymer to enhance the adhesion, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）乙烯互聚物，其包含总聚合物密度不大于0.905g / cm3; 总不饱和度不超过125 / 100,000个碳; 和; 最多3条长支链/ 1000个碳; 乙烯基-3含量小于5 / 100,000碳; 和总数（1000 / Mn）的乙烯基/ 1000个碳的总数，其中乙烯基-3含量和乙烯基测量通过凝胶渗透色谱法（145℃）和1 H-NMR（125° C），（2）接枝聚合物，以增加粘合力，（3）任选的自由基引发剂或光引发剂，其量为基于共聚物重量的至少约0.05重量％，和（3）任选地，共混剂的量为至少约0.05重量％，基于共聚物的重量。

5. 发明申请

WO2013003543A1 MULTILAYERED POLYOLEFIN-BASED FILMS HAVING INTEGRATED BACKSHEET AND ENCAPSULATION PERFORMANCE COMPRISING A LAYER COMPRISING CRYSTALLINE BLOCK COPOLYMER COMPOSITE OR BLOCK COPOLYMER COMPOSITE 审中-公开
标题翻译：具有一体化背衬的多层聚烯烃基膜和包含结晶嵌段共聚物复合材料或嵌段共聚物复合材料层的包封性能
公开(公告)号：WO2013003543A1
公开(公告)日：2013-01-03
申请号：PCT/US2012/044561
申请日：2012-06-28
申请人： DOW GLOBAL TECHNOLOGIES LLC , BONEKAMP, Jeffrey, E. , HU, Yushan , NICKEL, Nichole, E. , CHU, Lih-long , NAUMOVITZ, John, A. , HOFIUS, Mark, G.
发明人： BONEKAMP, Jeffrey, E. , HU, Yushan , NICKEL, Nichole, E. , CHU, Lih-long , NAUMOVITZ, John, A. , HOFIUS, Mark, G.
IPC分类号： H01L31/048 , B32B27/32 , C08L53/00
CPC分类号： H01L31/18 , B32B27/08 , B32B27/32 , B32B27/327 , B32B2457/12 , C08L53/00 , H01L31/0481 , H01L31/049 , Y02E10/50
摘要： A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125°C.
摘要翻译：一种多层膜结构，其包括顶部封装层A，顶层A和底层C之间的连接层B和底层C，多层膜结构的特征在于连接层B包含结晶嵌段复合树脂或嵌段复合树脂并且底层C包含具有至少一个熔点大于125℃的聚烯烃。

6. 发明申请

WO2013003541A1 MULTILAYERED POLYOLEFIN-BASED FILMS HAVING A LAYER COMPRISING A CRYSTALLINE BLOCK COPOLYMER COMPOSITE OR A BLOCK COPOLYMER COMPOSITE RESIN 审中-公开
标题翻译：具有包含结晶嵌段共聚物复合物或嵌段共聚物复合树脂的层的多层基于聚烯烃的膜
公开(公告)号：WO2013003541A1
公开(公告)日：2013-01-03
申请号：PCT/US2012/044558
申请日：2012-06-28
申请人： DOW GLOBAL TECHNOLOGIES LLC , BONEKAMP, Jeffrey, E. , HU, Yushan , NICKEL, Nichole, E. , CHU, Lih-long , NAUMOVITZ, John, A. , HOFIUS, Mark, G.
发明人： BONEKAMP, Jeffrey, E. , HU, Yushan , NICKEL, Nichole, E. , CHU, Lih-long , NAUMOVITZ, John, A. , HOFIUS, Mark, G.
IPC分类号： B32B27/32 , H01L31/048
CPC分类号： H01L31/0487 , B32B27/08 , B32B27/32 , B32B2270/00 , B32B2457/12 , H01L31/049 , H01L31/18 , Y02E10/50
摘要： Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin- based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell. Also disclosed is a lamination process to construct a laminated PV module comprising such multilayer film structures.
摘要翻译：公开了包括包含结晶嵌段共聚物复合物（CBC）或特定嵌段共聚物复合物（BC）的层（B）的多层膜结构，其包含i）包含至少80mol％聚合的乙烯的乙烯聚合物（EP） ii）基于α-烯烃的结晶聚合物（CAOP）和iii）包含（a）包含至少80mol％聚合的乙烯和（b）结晶α-烯烃嵌段（CAOB））的乙烯聚合物嵌段的嵌段共聚物; 以及包含聚烯烃的层C，该聚烯烃具有大于1255℃的至少一个熔融峰，层C的顶部表面与层B的底部表面粘合接触。这种多层膜结构优选包含（A）密封层A 具有与层B的顶部面部表面粘合接触的底部面部表面。这种膜适用于包括诸如PV电池的电子设备的电子设备（ED）模块。还公开了构成包括这种多层膜结构的叠层PV模块的叠层工艺。

7. 发明申请

WO2011163024A3 ELECTRONIC DEVICE MODULE COMPRISING LONG CHAIN BRANCHED (LCB), BLOCK, OR INTERCONNECTED COPOLYMERS OF ETHYLENE AND OPTIONALLY SILANE 审中-公开
公开(公告)号：WO2011163024A3
公开(公告)日：2011-12-29
申请号：PCT/US2011/040489
申请日：2011-06-15
申请人： DOW GLOBAL TECHNOLOGIES, INC. , NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
发明人： NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
IPC分类号： B32B17/10 , H01L31/048
摘要： An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, T m > in °C, and a heat of fusion, H f in J/g, as determined by DSC Crystallinity, where the numerical values of T m and H f correspond to the relationship: T m > (0.2143* H f ) + 79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.

8. 发明申请

WO2011150193A1 ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER WITH LOW UNSATURATION AND OPTIONAL VINYL SILANE 审中-公开
标题翻译：具有低不饱和度和可选的乙烯基硅烷的聚烯烃共聚物的电子器件模块
公开(公告)号：WO2011150193A1
公开(公告)日：2011-12-01
申请号：PCT/US2011/038116
申请日：2011-05-26
申请人： DOW GLOBAL TECHNOLOGIES LLC , NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
发明人： NAUMOVITZ, John, A. , PATEL, Rajen, M. , WU, Shaofu , NIEMANN, Debra, H.
IPC分类号： C08L23/00 , H01L31/00 , C08F210/02
CPC分类号： C08L23/08 , B32B17/10018 , B32B17/1055 , C08L2205/02 , H01L31/0481 , Y02E10/50 , C08L2666/06
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene-based polymer composition characterized by a Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit/1,000,000C, preferably the ethylene-based polymer compositions comprise up to about 3 long chain branches/1000 carbons, more preferably from about 0.01 to about 3 long chain branches/1000 carbons; the ethylene-based polymer composition can have a ZSVR of at least 2; the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit/1, 000,000C; the ethylene-based polymer compositions can have a bimodal molecular weight distribution (MWD) or a multi-modal MWD; the ethylene-based polymer compositions can have a comonomer distribution profile comprising a mono or bimodal distribution from 35°C to 120°C, excluding purge; the ethylene-based polymer compositions can comprise a single DSC melting peak; the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl silane, (3) optionally, a free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (4) optionally, a co-agent.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合物材料包括（1）基于乙烯的聚合物组合物的特征在于共聚单体分布常数大于约45，更优选大于50，最优选大于95，高达400，优选高达200，其中组合物具有小于120总不饱和单元/ 1,000,000C 优选地，基于乙烯的聚合物组合物包含最多约3个长链分支/ 1000个碳，更优选约0.01至约3个长支链/ 1000个碳; 基于乙烯的聚合物组合物可以具有至少2的ZSVR; 基于乙烯的聚合物组合物可以进一步表征为包含少于20个亚乙烯基不饱和单元/ 1,000,000C; 乙烯基聚合物组合物可以具有双峰分子量分布（MWD）或多模态MWD; 基于乙烯的聚合物组合物可以具有包含35℃至120℃的单峰或双峰分布的共聚单体分布分布，不包括吹扫; 基于乙烯的聚合物组合物可以包含单个DSC熔融峰; 基于乙烯的聚合物组合物可包含约17,000至约220,000的重均分子量（Mw），（2）任选的乙烯基硅烷，（3）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（4）任选的助剂。

9. 发明申请

WO2005100018A1 MULTICOMPONENT STRUCTURES HAVING IMPROVED ADHESION BETWEEN COMPONENTS 审中-公开
标题翻译：具有组分之间改善粘合性的多组分结构
公开(公告)号：WO2005100018A1
公开(公告)日：2005-10-27
申请号：PCT/US2005/011824
申请日：2005-04-05
申请人： DOW GLOGAL TECHNOLOGIES INC. , LEE, Eric, K. , NAUMOVITZ, John, A. , LADIKA, Mladen
发明人： LEE, Eric, K. , NAUMOVITZ, John, A. , LADIKA, Mladen
IPC分类号： B32B27/30
CPC分类号： B32B7/12 , B32B27/08 , B32B27/30 , B32B27/304 , B32B2310/0837 , B32B2439/00 , C08J5/12 , Y10T428/1307 , Y10T428/1321 , Y10T428/1352 , Y10T428/1362 , Y10T428/31616 , Y10T428/31667 , Y10T428/31681 , Y10T428/31797
摘要： The present invention includes a multicomponent structure comprising at least two components having a tie layer or adhesive layer directly between them, the tie layer comprising at least one olefin unsaturated ester copolymer and at least one photoinitiator and optionally a crosslinking enhancer. The tie layer is preferably irradiated with sufficient actinic radiation to result in increased interlayer adhesion strength between the two components as compared with the interlayer adhesion strength before treatment with the actinic radiation or between the components having a tie layer of the same composition except without the added photoinitiator or crosslinking enhancer. Without the photoinitiator, optionally crosslinking enhancer, and radiation the interlayer adhesion of the components is preferably less than 55 N/m. At least one of the components (first component or layer) preferably comprises a halopolymer, more preferably vinylidene chloride polymer, most preferably at least a majority of a vinyl idene chloride polymer. In another embodiment, at least one component exhibits interlayer adhesion strength similar to vinylidene chloride polymers. The structure optionally is or comprises such structures as a multilayer film, bag, or package, a lined or composite pipe, or other structure having more than one component. The tie layer is advantageously irradiated with an amount of UV light effective to increase the adhesion strength between the first and second components.
摘要翻译：本发明包括多组分结构，其包含至少两个在其间直接连接层或粘合剂层的组分，所述粘结层包含至少一种烯烃不饱和酯共聚物和至少一种光引发剂和任选的交联增强剂。与使用光化辐射处理之前的层间粘合强度或具有相同组成的粘结层的组分之间相比，接合层优选用足够的光化辐射照射以导致两组分之间的层间粘合强度增加，除了不添加光引发剂或交联增强剂。没有光引发剂，任选的交联增强剂和辐射，组分的层间粘附优选小于55N / m。组分（第一组分或第一层）中的至少一种优选包含卤代聚合物，更优选偏二氯乙烯聚合物，最优选氯乙烯基氯化聚合物的至少大部分。在另一个实施方案中，至少一种组分显示类似于偏二氯乙烯聚合物的层间粘合强度。该结构任选地或包括诸如多层膜，袋或包装，衬里或复合管或具有多于一种组分的其它结构的结构。接合层有利地用一定量的UV光照射，以有效地增加第一和第二组分之间的粘合强度。

10. 发明申请

WO2015062108A1 MULTILAYER DOWN-CONVERTING ENCAPSULANT FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME 审中-公开
标题翻译：多层下转换封装膜和包括其的电子器件
公开(公告)号：WO2015062108A1
公开(公告)日：2015-05-07
申请号：PCT/CN2013/086510
申请日：2013-11-04
申请人： DOW GLOBAL TECHNOLOGIES LLC , ROHM AND HAAS COMPANY , NAUMOVITZ, John A. , CHEN, Hongyu , HUANG, Yan , ZHANG, Ada Yu , XU, Zhi
发明人： NAUMOVITZ, John A. , CHEN, Hongyu , HUANG, Yan , ZHANG, Ada Yu , XU, Zhi
IPC分类号： H01L31/048 , B32B27/08 , C09K11/06
CPC分类号： H01L31/055 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/306 , B32B27/308 , B32B27/32 , B32B2264/00 , B32B2307/206 , B32B2307/422 , B32B2307/72 , B32B2307/7246 , B32B2457/00 , B32B2457/12 , C09K11/02 , C09K11/06 , C09K2211/1007 , C09K2211/1092 , C09K2211/182 , H01L31/0296 , H01L31/0322 , H01L31/048 , H01L31/0481 , Y02E10/52
摘要： A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt% based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.
摘要翻译：具有至少两层的多层包封膜包括包含密封剂树脂的第一层和包含密封剂树脂和至少一种下转换器如稀土有机金属络合物的第二层。下转换器可以以基于密封剂膜的总重量的至少0.0001重量％的量存在。多层密封剂膜的其它层可以包括或可以不包括下变频器。优选地，多层密封剂膜包含至少一个具有至少一个下变换器的层和至少一个没有下变频器的层。这种多层下转换膜可以用于诸如PV模块的电子设备中。

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