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    • 3. 发明申请
    • MULTI-CHIP MODULE INTEGRATING MEMS MIRROR ARRAY WITH ELECTRONICS
    • 将MEMS镜像阵列与电子集成在一起的多芯片模块
    • WO03042094A8
    • 2004-04-22
    • PCT/US0235890
    • 2002-11-07
    • MOVAZ NETWORKS INC
    • BHATTARAI AMALRAJAN NARAYANAN
    • B81B7/00B81B7/02B81B7/04G02B26/08
    • G02B26/0841B81B7/04B81B2201/042B81C1/00238
    • An integrated module including an array of electrostatically actuated mirrors usable as an optical switch. An array of tiltable mirrors (70, 72) is formed as a micro electromechanical system (MEMS) in one substrate carrier (60). A ceramic multi-chip module (MCM) (62) is formed having multiple layers (80) of wiring and electrodes (94) at one surface forming one side part of the electrostatic capacitive actuators. The MEMS substrate is bonded to the carrier (62) with the carrier electrodes (94) in opposition to the mirrors (70, 72), which form counter electrodes. Advantageously, a handle layer of the MEMS substrate is not removed and the mirrors released until after the bonding with the MCM. Separate high-voltage integrated circuits (ICs) (66) driving the actuators and low-voltage ICs controlling the high-voltage ICs (66) are bonded on the side of the MCM (62) opposite the MEMS (60) with the MCM providing electrical interconnections (68).
    • 一个集成模块,包括一个可用作光开关的静电致动反射镜阵列。 在一个衬底载体(60)中,可倾斜反射镜阵列(70,72)形成为微机电系统(MEMS)。 陶瓷多芯片模块(MCM)(62)形成为在形成静电电容致动器的一个侧部的一个表面处具有布线和电极(94)的多个层(80)。 MEMS衬底通过载体电极(94)与载体(62)结合而与形成反电极的反射镜(70,72)相对。 有利的是,MEMS衬底的手柄层不被去除并且镜子被释放直到与MCM结合之后。 驱动致动器的独立高压集成电路(IC)(66)和控制高压IC(66)的低压IC在MCM(62)的与MEMS(60)相对的一侧上结合,其中MCM 电气互连(68)。
    • 7. 发明申请
    • RECONFIGURABLE FREE SPACE WAVELENGTH CROSS CONNECT
    • 可重复自由空间波长交叉连接
    • WO02084372A2
    • 2002-10-24
    • PCT/US0211396
    • 2002-04-11
    • MOVAZ NETWORKS INC
    • GOLUB JOHNSMITH DAVID APRESLEY HARRYBAO ZHUOYU
    • G02B6/26G02B6/34G02B6/35H04Q11/00G02B26/00
    • G02B6/356G02B6/266G02B6/2931G02B6/29313G02B6/29395G02B6/3512G02B6/3518G02B6/3542G02B6/357G02B6/3582H04Q11/0005H04Q2011/0016H04Q2011/0022H04Q2011/0024H04Q2011/003H04Q2011/0049H04Q2011/0052
    • An optical cross connect (100), especially a wavelength cross connect, using free-space optics (106, 114, 116), a diffraction grating (108), and a micro electromechanical systems (MEMS) array (122) of movable mirrors (128). A concentrator (104) receives light from widely separated optical fibers (170) and brings the beams together into a more closely spaced linear array. Free-space optics process all the beams. Front-end optics (106) collimate the beams from the fibers and flatten their fields. The diffraction grating (108) spectrally separates each beam into sub-beams. A long-focus lens (114) focuses the sub-beams onto the 2-dimensional MEMS array (122). A fold mirror (124) reflectively couples two such mirrors, whereby the switched signals propagate back through the same optics and are spectrally recombined onto the fibers. Other embodiments include white-color cross connects, multiple MEMS arrays, and parallel optics. Power dividers (272) or wavelength interleavers can divide signals from the fibers, and multiple cross connects (276a, 276b) switch different wavelength groups.
    • 使用自由空间光学器件(106,114,116),衍射光栅(108)和可移动反射镜的微机电系统(MEMS)阵列(122)的光学交叉连接(100),特别是波长交叉连接 128)。 集中器(104)接收来自广泛分离的光纤(170)的光,并将光束组合成更紧密间隔的线性阵列。 自由空间光学处理所有的光束。 前端光学器件(106)使来自纤维的光束准直,并平坦化其场。 衍射光栅(108)将每个光束光谱分离成子光束。 长焦点透镜(114)将子光束聚焦到二维MEMS阵列(122)上。 折叠反射镜(124)反射耦合两个这样的反射镜,由此切换的信号通过相同的光学器件传播回来并且被光谱重新结合到光纤上。 其他实施例包括白色交叉连接,多个MEMS阵列和并行光学器件。 功率分配器(272)或波长交织器可以分离来自光纤的信号,并且多个交叉连接(276a,276b)切换不同的波长组。
    • 8. 发明申请
    • MULTI-CHIP MODULE INTEGRATING MEMS MIRROR ARRAY WITH ELECTRONICS
    • 多芯片模块集成MEMS电子阵列与电子
    • WO2003042094A2
    • 2003-05-22
    • PCT/US2002/035890
    • 2002-11-07
    • MOVAZ NETWORKS, INC.
    • BHATTARAI, AmalRAJAN, Narayanan
    • B81B7/04
    • G02B26/0841B81B7/04B81B2201/042B81C1/00238
    • An integrated module including an array of electrostatically actuated mirrors usable as an optical switch. An array of tiltable mirrors (70, 72) is formed as a micro electromechanical system (MEMS) in one substrate carrier (60). A ceramic multi-chip module (MCM) (62) is formed having multiple layers (80) of wiring and electrodes (94) at one surface forming one side part of the electrostatic capacitive actuators. The MEMS substrate is bonded to the carrier (62) with the carrier electrodes (94) in opposition to the mirrors (70, 72), which form counter electrodes. Advantageously, a handle layer of the MEMS substrate is not removed and the mirrors released until after the bonding with the MCM. Separate high-voltage integrated circuits (ICs) (66) driving the actuators and low-voltage ICs controlling the high-voltage ICs (66) are bonded on the side of the MCM (62) opposite the MEMS (60) with the MCM providing electrical interconnections (68).
    • 一种集成模块,包括可用作光学开关的静电致动反射镜阵列。 在一个衬底载体(60)中形成可倾斜反射镜阵列(70,72)作为微机电系统(MEMS)。 陶瓷多芯片模块(MCM)(62)形成为在形成静电电容式致动器的一个侧面的一个表面处具有多层(80)布线和电极(94)。 MEMS基板与载体(62)接合,载体电极(94)与形成对电极的反射镜(70,72)相对。 有利地,MEMS衬底的手柄层不被去除,并且反射镜释放直到与MCM接合之后。 驱动执行器的单独高压集成电路(66)和控制高电压IC(66)的低电压IC与MCM(60)的MCM(62)侧面接合,MCM提供 电互连(68)。