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    • 2. 发明申请
    • METHOD AND APPARATUS FOR SOLDERING INSPECTION OF CIRCUIT BOARD
    • 焊接检查电路板的方法和装置
    • WO1996005714A1
    • 1996-02-22
    • PCT/JP1995001569
    • 1995-08-08
    • KABUSHIKI KAISHA KOBE SEIKO SHOKOIKE, ShiroMORITA, YasuoKAKEBAYASHI, YasunoriYOSHIDA, EijiNISHIJIMA, TaroMORI, Yoshikazu
    • KABUSHIKI KAISHA KOBE SEIKO SHO
    • H05K03/34
    • G01R31/304B23K31/12B23K2101/40B23K2101/42G01N23/04H05K13/08
    • A soldering inspection method and an apparatus therefor capable of improving soldering inspection accuracy by obtaining a higher precision X-ray transmission image corresponding well to the actual shape of a circuit board. The soldering inspection method comprises a step (23) of obtaining a one-face transmission image by irradiating X-rays to a circuit board having components mounted on only one side, steps (22, 27) of executing soldering inspection by using the one-side transmission image, a step (17) of obtaining a transmission image of a two-sided board by directing X-rays to the substrate having components mounted on both sides, steps (15, 18) of executing response correction so as to make response characteristics substantially constant within a predetermined spatial frequency range on the basis of the response characteristics to the spatial frequency of the imaging system and the image processing system in a transmission image read step of the one-side transmission image and the two-side transmission image, a step (20) of obtaining a transmission image of only the other side by subtracting the one-side transmission image subjected to response correction from the transmission image of the two-sided board subjected to response correction, and a step (21) of executing soldering inspection of the other side by using the transmission image of the other side. The present invention provides an apparatus for practicing this method.
    • 一种焊接检查方法及其装置,其能够通过获得与电路板的实际形状相对应的更高精度的X射线透射图像来提高焊接检查精度。 焊接检查方法包括:步骤(23),其通过将X射线照射到仅安装在一侧的部件的电路板来获得单面透射图像;步骤(22,27) 通过将X射线引导到具有安装在两侧的部件的基板来获得双面板的透射图像的步骤(17),执行响应校正的步骤(15,18),以便响应 基于在单面透射图像和双面透射图像的透射图像读取步骤中的成像系统和图像处理系统的空间频率的响应特性,在预定空间频率范围内基本上恒定的特性, 通过从双面b的透射图像中减去进行了响应校正的单面透射图像,获得仅一侧的透射图像的步骤(20) 以及通过使用另一侧的透射图像来执行另一侧的焊接检查的步骤(21)。 本发明提供一种用于实施该方法的装置。