会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE
    • 环氧树脂组合物用于铜层压板
    • WO2005108488A1
    • 2005-11-17
    • PCT/KR2005/001358
    • 2005-05-10
    • LG CHEM, LTD.KIM, Sung-WooAHN, Hyeon-WooMIN, Hyun-SungLEE, Yong-SeokKOO, Eun-Hae
    • KIM, Sung-WooAHN, Hyeon-WooMIN, Hyun-SungLEE, Yong-SeokKOO, Eun-Hae
    • C08L63/02
    • C08L63/00C08G59/3218C08G59/621H05K1/0373H05K2201/0209H05K2201/0257
    • The present invention relates to an epoxy resin composition for a printed circuit board (PCB). The composition of the invention comprises a) a bisphenol A type of novolak resin having an average epoxy equivalent of 100 to 500 and a multi-functional epoxy resin having at least 3 functional groups and having an average epoxy equivalent of 100 to 500, b) a curing accelerator comprising an imidazole compound, c) nanoclay as a filler, d) a brominated phenolic curing agent including 40 to 70% of bromine based on weight, and e) a bisphenol A type of novolak phenolic curing agent. Also provided are a prepreg and a copper clad laminate (CCL) using the composition. The epoxy resin composition of the present invention comprises nanoclay, which has an organic and inorganic structure, in which organic materials are intercalated into the interlayer of the layered silicate. Because it has superior heat resistance, a high glass transition temperature (T ), and superior flame retardance and mechanical properties, it is useful in manufacturing copper g clad laminates for printed circuit boards.
    • 本发明涉及印刷电路板(PCB)用环氧树脂组合物。 本发明的组合物包括a)平均环氧当量为100-500的双酚A型酚醛清漆树脂和具有至少3个官能团并具有100-500的平均环氧当量的多官能环氧树脂,b) 包含咪唑化合物的固化促进剂,c)作为填料的纳米粘土,d)包含40至70重量%的溴的溴化酚固化剂,和e)双酚A型酚醛清漆酚固化剂。 还提供了使用该组合物的预浸料和覆铜层压板(CCL)。 本发明的环氧树脂组合物包含具有有机和无机结构的纳米粘土,其中有机材料插入到层状硅酸盐的中间层中。 由于具有优异的耐热性,高的玻璃化转变温度(T)和优异的阻燃性和机械性能,因此可用于制造用于印刷电路板的铜箔层压板。