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1. 发明申请

WO2007094177A1 STAINLESS STEEL SUBSTRATE WITH CONDUCTIVE METAL LAYER, HARD DISK SUSPENSION MATERIAL AND HARD DISK SUSPENSION MANUFACTURED BY USING THE MATERIAL 审中-公开
标题翻译：带导电金属层的不锈钢基板，硬盘悬挂材料和使用材料制造的硬盘悬挂
公开(公告)号：WO2007094177A1
公开(公告)日：2007-08-23
申请号：PCT/JP2007/051751
申请日：2007-01-26
申请人： NIPPON STEEL MATERIALS CO., LTD. , YAMASAKI, Yoshito , NAKATSUKA, Jun , NAGASAKI, Shuji , INAGUMA, Tooru , KUBO, Yuji , SUGIURA, Tsutomu
发明人： YAMASAKI, Yoshito , NAKATSUKA, Jun , NAGASAKI, Shuji , INAGUMA, Tooru , KUBO, Yuji , SUGIURA, Tsutomu
IPC分类号： B32B15/01 , B21B1/22 , B32B15/088 , C23C28/00 , C25D5/26 , G11B21/21 , H05K1/05
CPC分类号： H05K1/056 , B21B1/38 , B21B3/02 , B32B15/043 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/281 , B32B2255/06 , B32B2255/205 , B32B2307/202 , B32B2307/306 , B32B2429/00 , B32B2457/00 , C22C38/40 , C23C28/00 , C23C28/021 , C23C28/023 , C23C28/025 , C25D5/10 , C25D5/36 , G11B5/4833 , Y10T428/12396 , Y10T428/12549 , Y10T428/12569 , Y10T428/12924
摘要： ABSTRACT A stainless steel substrate with one or more conductive metal layers, a method for manufacturing the same, and a hard disk drive suspension material using the same that are excellent in etching accuracy and does not involve the use of any substances casing environmental burdens, while ensuring stable adhesion between the conductive metal layers on the stainless steel substrate and the polyimide-based resin layer. The conductive metal layers are formed to have a total thickness ranging from 0.1 to 10?m, a centerline average surface roughness Ra from 0.05 to 1?m, and a ten-point average surface roughness Rz from 1 to 5?m, respectively.
摘要翻译：摘要具有一个或多个导电金属层的不锈钢基板，其制造方法和使用该不锈钢基板的蚀刻精度优异且不涉及使用任何物质外壳环境负荷的硬盘驱动悬架材料，同时确保不锈钢基板上的导电金属层与聚酰亚胺系树脂层之间的粘合性。形成导电金属层的总厚度为0.1〜10μm，中心线平均表面粗糙度Ra为0.05〜1μm，十点平均表面粗糙度Rz分别为1〜5μm。

2. 发明申请

WO2000052507A1 OPTICAL FIBER 审中-公开
标题翻译：光纤
公开(公告)号：WO2000052507A1
公开(公告)日：2000-09-08
申请号：PCT/JP2000001237
申请日：2000-03-02
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , KATO, Takatoshi , KUBO, Yuji , TAKAHASHI, Yuji , YONEDA, Michifumi
发明人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
IPC分类号： G02B6/22
CPC分类号： G02B6/0365 , G02B6/0228 , G02B6/03633
摘要： An optical fiber having a sufficiently large effective cross sectional area while suppressing an increase of the dispersion slope in the 1.55 'mu'm wavelength band. The optical fiber comprises an inner core where a core region extends along a predetermined axis and an outer core provided on the periphery of the inner core and having a refractive index lower than that of the inner core. Specifically, the relative index difference 'DELTA'n¿1 of the inner core to the reference region in the clad region provided on the periphery of the core region, the relative index difference 'DELTA'n¿2 of the outer core to the reference region, the ratio a/b of the outside diameter (2b) of the outer core to the outside diameter (2a) of the inner core, outside, and the outside diameter (2b) of the outer core are all adequately determined according to the structure of the clad region.
摘要翻译：一种具有足够大的有效横截面积同时抑制1.55μm波段的色散斜率增加的光纤。光纤包括内芯，其中芯区沿着预定轴线延伸，外芯设置在内芯的周边上，折射率低于内芯的折射率。具体而言，设置在芯区周边的包层区域中的内芯与参考区域的相对折射率差ΔTA1n1，外芯相对于参考区域的相对折射率差ΔTATA2，比率a / b 外芯的外径（2b）与内芯的外径（2a），外芯的外径（2b）和外芯的外径（2b）都可以根据包层区域的结构充分确定。

3. 发明申请

WO9933609B1 DEVICE AND METHOD FOR COOL AIR COOLING TYPE MACHINING 审中-公开
标题翻译：冷空气冷却式加热装置及方法
公开(公告)号：WO9933609B1
公开(公告)日：1999-08-26
申请号：PCT/JP9805796
申请日：1998-12-22
申请人： TOYOTA MOTOR CO LTD , MUKAI RYOHEI , KATSUTA MAMORU , YOSHIMI TAKAYUKI , NISHI KOJI , ONO NAOTO , MIZUTANI YOSHIHIRO , KOBAYASHI YASUNORI , KUMAZAWA TADASHI , SATO MASAAKI , KUBO YUJI
发明人： MUKAI RYOHEI , KATSUTA MAMORU , YOSHIMI TAKAYUKI , NISHI KOJI , ONO NAOTO , MIZUTANI YOSHIHIRO , KOBAYASHI YASUNORI , KUMAZAWA TADASHI , SATO MASAAKI , KUBO YUJI
IPC分类号： B23Q15/12 , B23Q11/10 , B23Q17/00 , B24B5/04 , B24B49/14 , B24B55/02 , B23Q15/02
CPC分类号： B23Q11/1084 , B23Q11/10 , B23Q17/00 , B24B5/04 , B24B49/14 , B24B55/02 , G05B2219/49057 , G05B2219/49204 , G05B2219/49215
摘要： A machining device using a cool air cooling which can reduce effects by heat on a work and a machining tool and improve a machining precision. Specifically, a method of grinding a work (W) with a cooling air supplied to the work (W), a grindstone (42), a portion to be ground (P) of the work and a portion other than the portion (P) of the work, wherein the surface temperature of the work (W) is detected by a temperature detector (90): when the surface temperature reaches an upper threshold value, a second cooling air supply device (52) is controlled to gradually increase the flow rate of air supplied from a work cooling pipe (80); when the surface temperature reaches a lower threshold value, an air flow rate is gradually decreased; thereby making it possible to maintain the surface temperature of the work (W) at temperatures between the upper and lower threshold temperatures, restrict temperature rises of the work (W) surface and the machining tool and improve the machining precision of the work.
摘要翻译：一种使用冷空气冷却的加工装置，其可以减少加热对工件和加工工具的影响，并提高加工精度。具体而言，将工件（W）供给的冷却空气，磨石（42），工件的被研磨部（P）和除了部分（P）以外的部分研磨的工件（W）的方法，其中工件（W）的表面温度由温度检测器（90）检测：当表面温度达到上限阈值时，第二冷却空气供应装置（52）被控制以逐渐增加流量从工作冷却管（80）供给的空气的速度; 当表面温度达到较低的阈值时，空气流量逐渐减小; 从而能够将工件（W）的表面温度保持在上限和下限温度之间的温度，从而限制工件（W）表面和加工工具的温度上升，并提高加工精度。

4. 发明申请

WO1997001185A1 METHOD AND APPARATUS FOR FILM FORMATION 审中-公开
标题翻译：电影形成的方法和装置
公开(公告)号：WO1997001185A1
公开(公告)日：1997-01-09
申请号：PCT/JP1996001690
申请日：1996-06-19
申请人： NIPPON STEEL CORPORATION , KUBO, Yuji , TOKUMARU, Shinji
发明人： NIPPON STEEL CORPORATION
IPC分类号： H01L21/285
CPC分类号： H01L21/76843 , C23C14/046
摘要： A thin film is formed by sputtering on a substrate having holes while gas ions are emitted to the substrate at an angle alpha (0 DEG (1/aspect ratio) + 10 DEG ), depending on the aspect ratio of the hole, with respect to the perpendicular of the substrate at 30 to 500 eV. In this way, the gas ions are caused to impinge against the sputtered particles adhering to the side wall portion of the hole during the formation of the thin film so that the particles on the side wall may be sputtered again.
摘要翻译：通过溅射在具有孔的基板上形成薄膜，同时气体离子以α（0°<α= tan -1（1 /纵横比）+ 10°）发射到基板，取决于孔的纵横比相对于基板的垂直度为30至500eV。以这种方式，在形成薄膜期间使气体离子撞击粘附到孔的侧壁部分的溅射颗粒，使得侧壁上的颗粒可能再次溅射。

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