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1. 发明申请

WO2010027236A3 FUSED HETEROCYCLIC COMPOUND 审中-公开
标题翻译：熔合杂环化合物
公开(公告)号：WO2010027236A3
公开(公告)日：2010-06-17
申请号：PCT/KR2009005073
申请日：2009-09-08
申请人： LG LIFE SCIENCES LTD , LEE CHANG SEOK , LEE TAE HEE , YOON SOOK KYUNG , CHOI JEUNG SOON , JANG YONG JIN , KIM SUNG WOOK , CHANG HYE KYUNG , PARK MI JEONG , KIM TAE HUN , AHN YOUNG HA , PARK HEE DONG , PARK HYUN JUNG , LIM DONG CHUL , LEE JOO YOUN , LEE SUNG HACK , PARK WAN SU , OH YEONG SOO
发明人： LEE CHANG SEOK , LEE TAE HEE , YOON SOOK KYUNG , CHOI JEUNG SOON , JANG YONG JIN , KIM SUNG WOOK , CHANG HYE KYUNG , PARK MI JEONG , KIM TAE HUN , AHN YOUNG HA , PARK HEE DONG , PARK HYUN JUNG , LIM DONG CHUL , LEE JOO YOUN , LEE SUNG HACK , PARK WAN SU , OH YEONG SOO
IPC分类号： C07D495/04
CPC分类号： C07D495/04 , C07D519/00
摘要： The present invention relates to a fused heterocyclic compound having the Formula 1, which is useful as a platelet aggregation inhibitor, a method for preparing the same, and a pharmaceutical composition for inhibiting platelet aggregation comprising the same.
摘要翻译：本发明涉及用作血小板聚集抑制剂的具有式1的稠合杂环化合物，其制备方法和包含其的血小板聚集抑制药物组合物。

2. 发明申请

WO2009051440A3 BUMP STRUCTURE WITH MULTIPLE LAYERS AND METHOD OF MANUFACTURE 审中-公开
标题翻译：具有多层结构的BUMP和制造方法
公开(公告)号：WO2009051440A3
公开(公告)日：2009-06-04
申请号：PCT/KR2008006149
申请日：2008-10-17
申请人： SML ELECTRONICS INC , LEE SANG CHUL , KIM SUNG-WOOK
发明人： LEE SANG CHUL , KIM SUNG-WOOK
IPC分类号： H05K5/06 , H01L23/04
CPC分类号： B81C1/00269 , B81B2207/093 , B81C2203/0118 , B81C2203/019 , B81C2203/035 , B81C2203/036 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/056 , H01L2224/16238 , H01L2224/81192 , H01L2224/81399 , H01L2224/81805 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1461 , Y10T156/10
摘要： A bump structure with multiple layers may include a first layer electrically connected to a protective substrate hermetically packaging a base substrate, the first layer allowing the base substrate and the protective substrate to be spaced apart from each other at a predetermined distance; and a second layer electrically connected to the first layer, the second layer being eutectically bonded on a surface of the base substrate. The first layer may have a melting point higher than a eutectic temperature of the second layer and the base substrate. When using a bump structure with multiple layers, it is possible to secure a space in which a micro-structure such as a microelectromechanical systems (MEMS) device on a base substrate may be driven. Further, it is possible to prevent a contact between adjacent structures or electrodes from being generated due to diffusion of a bonding material in a hermetical packaging process.
摘要翻译：具有多层的凸块结构可以包括电气连接到保护基底的第一层，该保护基底密封地封装基底基底，第一层允许基底基板和保护基板以预定距离彼此间隔开; 以及与所述第一层电连接的第二层，所述第二层共晶接合在所述基底基板的表面上。第一层可以具有比第二层和基底的共晶温度高的熔点。当使用具有多层的凸块结构时，可以确保其上可以驱动基础基板上的诸如微机电系统（MEMS）装置之类的微结构的空间。此外，可以防止由于粘合材料在气密封装过程中的扩散而产生相邻结构或电极之间的接触。

3. 发明申请

WO2006068338A1 REAL-TIME BUSINESS PROCESS TRIGGERING SYSTEM AND METHOD USINGR RFID 审中-公开
标题翻译：实时业务流程触发系统和使用RFID的方法
公开(公告)号：WO2006068338A1
公开(公告)日：2006-06-29
申请号：PCT/KR2004/003504
申请日：2004-12-29
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE , HWANG, Jae-Gak , CHOI, Seong-Hwan , LEE, Yong-Joon , KIM, Sung-Wook , CHAE, Jong-Suk
发明人： HWANG, Jae-Gak , CHOI, Seong-Hwan , LEE, Yong-Joon , KIM, Sung-Wook , CHAE, Jong-Suk
IPC分类号： G06F17/60
CPC分类号： G06Q10/06
摘要： Provided is a real-time business process triggering system (RBPTS) using a Radio Frequency Identification (RFID) and a method thereof . The RBPTS is to provides interface to a corporation information system by generating an RFID event proper to a specific domain by giving the RFID data a business meaning to apply the RFID data to a predetermined rule before transmitting the RFID data to the corporation information system, provide a rule modeling function to flexibly managing changes in application field and environment, and provide an RFID related-action related to rule performance, and a method thereof . The RBPTS includes: an RFID middleware adapter for receiving RFID data from an RFID middleware/RFID reader and generating RFID events Extensible Markup Language (XML) document; an event manager for receiving the RFID events XML document from the RFID middleware adapter and generating an event query for inference; a rule manager for generating a result set by performing rule inference on the event query through an inference engine and generating an action list; Web Service arbitrator for communicating through Web Service using an external application and a Simple Object Access Protocol (SOAP); an action manager for performing real-time action by calling the Web Service through the Web Service arbitrator based on the action list; and an event repository for storing and managing registered all RFID event information, rule and action. The RBPTS is applied to maritime freight transportation.
摘要翻译：提供了一种使用射频识别（RFID）的实时业务处理触发系统（RBPTS）及其方法。 RBPTS是通过在将RFID数据发送到公司信息系统之前给予RFID数据以将RFID数据应用于预定规则的业务意义，通过产生适合于特定领域的RFID事件来向公司信息系统提供接口，提供规则建模功能，灵活管理应用领域和环境的变化，并提供与规则性能相关的RFID相关动作及其方法。 RBPTS包括：RFID中间件适配器，用于从RFID中间件/ RFID读取器接收RFID数据，并生成RFID事件可扩展标记语言（XML）文档; 用于从RFID中间件适配器接收RFID事件XML文档并生成用于推断的事件查询的事件管理器; 规则管理器，用于通过通过推理引擎对所述事件查询进行规则推理来生成结果集并生成动作列表; Web服务仲裁员通过使用外部应用程序和简单对象访问协议（SOAP）的Web服务进行通信; 通过基于行动列表的Web服务仲裁员调用Web服务来执行实时动作的动作管理器; 以及用于存储和管理注册的所有RFID事件信息，规则和动作的事件存储库。 RBPTS适用于海运货物运输。

4. 发明申请

WO2009104910A4 JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME 审中-公开
标题翻译：接合结构和基板接合方法
公开(公告)号：WO2009104910A4
公开(公告)日：2010-01-14
申请号：PCT/KR2009000791
申请日：2009-02-19
申请人： BARUN ELECTRONICS CO LTD , KIM SUNG WOOK
发明人： KIM SUNG WOOK
IPC分类号： H01L21/60
CPC分类号： H01L21/50 , H01L23/10 , H01L24/83 , H01L2224/838 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K2201/0373
摘要： The present invention concerns a joining structure and a substrate-joining method using the same. The joining structure comprises a substrate, and comprises a plurality of joining patterns which are located on the said substrate and which are spaced apart from each other. The substrate-joining method using the joining structure can comprise: a stage involving the formation of a plurality of joining patterns which are spaced apart from each other on a first substrate; and a stage of joining a second substrate on the plurality of joining patterns. When the said joining structure is employed, it is possible to reduce or prevent damage due to spreading of the joining substance during joining of the two substrates.
摘要翻译：本发明涉及使用该结构的接合结构和基板接合方法。接合结构包括基板，并且包括位于所述基板上并且彼此间隔开的多个接合图案。使用接合结构的基板接合方法可以包括：在第一基板上形成彼此间隔开的多个接合图案的台阶; 以及在所述多个接合图案上接合第二基板的阶段。当使用所述接合结构时，可以减少或防止由于在两个基板的接合期间接合物质的扩散而造成的损坏。

5. 发明申请

WO2009104910A2 JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME 审中-公开
标题翻译：连接结构和使用该连接结构的基板连接方法
公开(公告)号：WO2009104910A2
公开(公告)日：2009-08-27
申请号：PCT/KR2009000791
申请日：2009-02-19
申请人： SML ELECTRONICS INC , KIM SUNG WOOK
发明人： KIM SUNG WOOK
IPC分类号： H01L21/60
CPC分类号： H01L21/50 , H01L23/10 , H01L24/83 , H01L2224/838 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K2201/0373
摘要： The present invention concerns a joining structure and a substrate-joining method using the same. The joining structure comprises a substrate, and comprises a plurality of joining patterns which are located on the said substrate and which are spaced apart from each other. The substrate-joining method using the joining structure can comprise: a stage involving the formation of a plurality of joining patterns which are spaced apart from each other on a first substrate; and a stage of joining a second substrate on the plurality of joining patterns. When the said joining structure is employed, it is possible to reduce or prevent damage due to spreading of the joining substance during joining of the two substrates.
摘要翻译：本发明涉及接合结构体和使用该接合结构体的基板接合方法。接合结构包括基板，并且包括位于所述基板上并且彼此间隔开的多个接合图案。使用接合结构的基板接合方法可以包括：涉及形成在第一基板上彼此间隔开的多个接合图案的台; 以及在所述多个接合图案上接合第二基板的阶段。当采用所述接合结构时，可以减少或防止在两个基板接合期间由于接合物质的扩散而造成的损坏。

6. 发明申请

WO2005031420A1 METHOD FOR MANUFACTURING ALUMINUM SPRAY-COATED ANTI-CORROSIVE OPTICAL UNIT 审中-公开
标题翻译：制造铝喷涂抗腐蚀光学单元的方法
公开(公告)号：WO2005031420A1
公开(公告)日：2005-04-07
申请号：PCT/KR2004/002493
申请日：2004-09-24
申请人： LG CABLE LTD. , KIM, Sung-wook , SHIM, Sung-ik
发明人： KIM, Sung-wook , SHIM, Sung-ik
IPC分类号： G02B6/44
CPC分类号： G02B6/4488 , C23C4/02 , C23C4/08 , C23C4/131 , C23C4/18 , G02B6/4422
摘要： Disclosed herein is a manufacturing method of an optical unit having an aluminum coating layer formed on the surface of a stainless-steel loose-tube. The method improves productivity and price competitiveness of products through spray-coating of aluminum using arc heat. That is, such a method comprises the step of producing fine aluminum powder by liquefying an aluminum preform using arc heat, and spray-coating the fine aluminum powder on the surface of the stainless-steel loose-tube by using high-pressure air.
摘要翻译：本文公开了一种在不锈钢松套管的表面上形成有铝涂层的光学单元的制造方法。该方法通过使用电弧热喷涂铝来提高产品的生产率和价格竞争力。也就是说，这种方法包括通过使用电弧热液化铝预成型体并通过使用高压空气将细铝粉喷涂在不锈钢松套管的表面上来生产细铝粉的步骤。

7. 发明申请

WO2010027236A2 FUSED HETEROCYCLIC COMPOUND 审中-公开
标题翻译：熔融杂环化合物
公开(公告)号：WO2010027236A2
公开(公告)日：2010-03-11
申请号：PCT/KR2009/005073
申请日：2009-09-08
申请人： LG LIFE SCIENCES LTD. , LEE, Chang Seok , LEE, Tae Hee , YOON, Sook Kyung , CHOI, Jeung Soon , JANG, Yong Jin , KIM, Sung Wook , CHANG, Hye Kyung , PARK, Mi Jeong , KIM, Tae Hun , AHN, Young Ha , PARK, Hee Dong , PARK, Hyun Jung , LIM, Dong Chul , LEE, Joo Youn , LEE, Sung Hack , PARK, Wan Su , OH, Yeong Soo
发明人： LEE, Chang Seok , LEE, Tae Hee , YOON, Sook Kyung , CHOI, Jeung Soon , JANG, Yong Jin , KIM, Sung Wook , CHANG, Hye Kyung , PARK, Mi Jeong , KIM, Tae Hun , AHN, Young Ha , PARK, Hee Dong , PARK, Hyun Jung , LIM, Dong Chul , LEE, Joo Youn , LEE, Sung Hack , PARK, Wan Su , OH, Yeong Soo
IPC分类号： C07D495/04
CPC分类号： C07D495/04 , C07D519/00
摘要： The present invention relates to a fused heterocyclic compound having the Formula 1, which is useful as a platelet aggregation inhibitor, a method for preparing the same, and a pharmaceutical composition for inhibiting platelet aggregation comprising the same.
摘要翻译：本发明涉及具有式1的稠合杂环化合物，其可用作血小板聚集抑制剂，其制备方法和包含其的用于抑制血小板聚集的药物组合物。

8. 发明申请

WO2009051440A2 BUMP STRUCTURE WITH MULTIPLE LAYERS AND METHOD OF MANUFACTURE 审中-公开
标题翻译：具有多层的冲击结构和制造方法
公开(公告)号：WO2009051440A2
公开(公告)日：2009-04-23
申请号：PCT/KR2008/006149
申请日：2008-10-17
申请人： SML ELECTRONICS, INC. , LEE, Sang Chul , KIM, Sung-Wook
发明人： LEE, Sang Chul , KIM, Sung-Wook
IPC分类号： H05K5/06 , H01L23/04
CPC分类号： B81C1/00269 , B81B2207/093 , B81C2203/0118 , B81C2203/019 , B81C2203/035 , B81C2203/036 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/056 , H01L2224/16238 , H01L2224/81192 , H01L2224/81399 , H01L2224/81805 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1461 , Y10T156/10
摘要： A bump structure with multiple layers may include a first layer electrically connected to a protective substrate hermetically packaging a base substrate, the first layer allowing the base substrate and the protective substrate to be spaced apart from each other at a predetermined distance; and a second layer electrically connected to the first layer, the second layer being eutectically bonded on a surface of the base substrate. The first layer may have a melting point higher than a eutectic temperature of the second layer and the base substrate. When using a bump structure with multiple layers, it is possible to secure a space in which a micro-structure such as a microelectromechanical systems (MEMS) device on a base substrate may be driven. Further, it is possible to prevent a contact between adjacent structures or electrodes from being generated due to diffusion of a bonding material in a hermetical packaging process.
摘要翻译：具有多层的凸块结构可以包括电连接到保护基板的第一层，该保护基板气密地封装基板，第一层允许基板和保护基板彼此间隔开预定距离; 以及电连接到所述第一层的第二层，所述第二层共晶地结合在所述基底基板的表面上。第一层的熔点可以高于第二层和基底的共晶温度。当使用具有多层的凸块结构时，可以确保其中可以驱动基础衬底上的诸如微电子机械系统（MEMS）器件的微结构的空间。此外，可以防止在密封包装工艺中由于键合材料的扩散而产生相邻结构或电极之间的接触。

9. 发明申请

WO2008026853A1 ANGULAR VELOCITY SENSOR STRUCTURE 审中-公开
标题翻译：角速度传感器结构
公开(公告)号：WO2008026853A1
公开(公告)日：2008-03-06
申请号：PCT/KR2007/004073
申请日：2007-08-24
申请人： SML ELECTRONICS, INC. , LEE, Sang Chul , KIM, Sung Wook
发明人： LEE, Sang Chul , KIM, Sung Wook
IPC分类号： G01P3/483 , G01P3/44
CPC分类号： G01P15/125 , G01C19/56 , G01P2015/0814
摘要： An angular velocity sensor structure for improving the off-axis sensitivity is provided in which a structure for detecting an off-axis acceleration component applied to the angular velocity sensor structure is directly adapted to the sensor structure, thereby measuring the off-axis acceleration component actually applied to the sensor structure without distortion.
摘要翻译：提供了用于提高离轴灵敏度的角速度传感器结构，其中用于检测施加到角速度传感器结构的离轴加速度分量的结构直接适用于传感器结构，从而实际测量离轴加速度分量应用于传感器结构而不变形。

10. 发明申请

WO2006095959A1 GAP-TYPE OVERHEAD TRANSMISSION LINE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译： GAP型超声波传输线及其制造方法
公开(公告)号：WO2006095959A1
公开(公告)日：2006-09-14
申请号：PCT/KR2006/000081
申请日：2006-01-09
申请人： LS CABLE LTD. , PARK, Hyun-ho , PARK, Sung-yul , KIM, Sung-wook , SHIM, Sung-ik
发明人： PARK, Hyun-ho , PARK, Sung-yul , KIM, Sung-wook , SHIM, Sung-ik
IPC分类号： H01B5/10
CPC分类号： H01B5/10 , Y10T29/49117
摘要： A gap-type overhead transmission line includes a steel core member; a conductor layer positioned to surround the steel core member and having at least one strand wire aggregated therein; and a coating layer interposed in a solid state between the steel core member and the conductor layer so as to surround the steel core member, the coating layer including a material that is sublimated after the conductor layer is stranded so as to form a predetermined gap between the steel core member and the conductor layer.
摘要翻译：间隙型架空传输线包括钢芯构件; 导体层，定位成围绕所述钢芯构件并且具有聚集在其中的至少一根股线; 以及在钢芯构件和导体层之间以固态插入以包围钢芯构件的涂层，所述涂层包括在导体层被绞合之后升华的材料，以在第一和第钢芯构件和导体层。

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