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    • 1. 发明申请
    • METHOD FOR PREPARING TIN/SILVER ALLOY PLATING SOLUTION
    • 制备锡/银合金镀层溶液的方法
    • WO2013191481A2
    • 2013-12-27
    • PCT/KR2013005431
    • 2013-06-20
    • S & SCHEM CO LTDKIM DONG HYUN
    • KIM DONG HYUNBANG TAE JOOH JEONG HUNSON JIN HOYUK YEONG NANLEE HYOUNG KEUN
    • C25D3/56C25D3/60C25D3/64
    • C25D3/60C25D3/64
    • The present invention relates to a method for preparing a tin/silver alloy plating solution comprising methane sulfonic acid tin, methane sulfonic acid silver, methane sulfonic acid, a nonionic surfactant, and additives. The method comprises: a first step of removing extricated anion metal impurities existing in the methane sulfonic acid and nonionic surfactant; a second step of dissolving, by means of an electrolysis method, tin and silver in the methane sulfonic acid from which the impurities have been removed, respectively, so as to produce methane sulfonic acid tin and methane sulfonic acid silver; a third step of combining the methane sulfonic acid, methane sulfonic acid tin, methane sulfonic acid silver, nonionic surfactant, and additives so as to produce a mixture solution; and a fourth step of filtering the mixture solution. Thus, the method of the present invention may enable the anion metal impurities of each raw material for preparing a plating solution to be removed, and a plating solution to be prepared from refined materials, thus providing a plating solution which enables the production of a uniformly plated film even in high-speed plating and which has a constant silver precipitate content.
    • 本发明涉及一种制备包含甲磺酸锡,甲磺酸银,甲磺酸,非离子表面活性剂和添加剂的锡/银合金电镀溶液的方法。 该方法包括:除去存在于甲磺酸和非离子表面活性剂中的过量阴离子金属杂质的第一步骤; 分别通过电解法将锡和银溶解在除去杂质的甲烷磺酸中以产生甲磺酸锡和甲磺酸银的第二步; 将甲磺酸,甲磺酸锡,甲磺酸银,非离子表面活性剂和添加剂结合起来制造混合溶液的第三步骤; 以及过滤混合溶液的第四步骤。 因此,本发明的方法可以使每种原料的阴离子金属杂质能够制备待除去的电镀液,以及由精制材料制备的电镀液,从而提供能够均匀地制备的电镀液 即使在高速电镀中也具有恒定的银沉淀含量。