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1. 发明申请

WO2009119983A3 FPD SUBSTRATE AND SEMICONDUCTOR WAFER INSPECTION SYSTEM USING DUPLICATE IMAGES 审中-公开
标题翻译：使用重复图像的FPD基板和半导体波形检测系统
公开(公告)号：WO2009119983A3
公开(公告)日：2009-11-26
申请号：PCT/KR2009001234
申请日：2009-03-12
申请人： WISEPLANET CO LTD , HONG KI-HYUN , NA SANG-CHAN , KIM TAE-HONG
发明人： HONG KI-HYUN , NA SANG-CHAN , KIM TAE-HONG
IPC分类号： H01L21/66
CPC分类号： G01N21/9501 , G01N21/8851 , G01N2021/8822
摘要： The present invention relates to an FPD substrate and semiconductor wafer inspection system using duplicate images. More particularly, the present invention relates to an FPD substrate and semiconductor wafer inspection system using duplicate images capable of acquiring two or more duplicated images through a single scanning of the particles adhered to a flat panel display, existing on a surface of the flat panel display and projected from the surface of the flat panel display. The present invention has advantages in that most of the defects and foreign substances can be detected by the types thereof through a single inspection.
摘要翻译：本发明涉及使用重复图像的FPD基板和半导体晶片检查系统。更具体地说，本发明涉及一种FPD基板和半导体晶片检查系统，其使用能够通过对平板显示器的表面上附着的平板显示器进行单次扫描来获取两个或更多个复制图像的重复图像并从平板显示器的表面投影。本发明的优点在于，通过单次检查可以通过其类型检测大部分缺陷和异物。

2. 发明申请

WO2012124925A3 FRANCHISE PARTNERSHIP SYSTEM PROVIDING PARTNERSHIP FRANCHISE SERVICE AND METHOD THEREFOR 审中-公开
标题翻译：提供合作伙伴链接服务的特许合作伙伴系统及其方法
公开(公告)号：WO2012124925A3
公开(公告)日：2012-11-08
申请号：PCT/KR2012001674
申请日：2012-03-07
申请人： LOTTE CARD CO LTD , KO WEON SEOK , LEE SANG KYU , KIM TAE HONG , CHOE SIR KHAN , KIM JONG HYUN , BAE EAN JU , KANG SEOK HEON , CHANG KYUNG SANG , LEE JU BAE
发明人： KO WEON SEOK , LEE SANG KYU , KIM TAE HONG , CHOE SIR KHAN , KIM JONG HYUN , BAE EAN JU , KANG SEOK HEON , CHANG KYUNG SANG , LEE JU BAE
IPC分类号： G06Q30/02 , G06Q20/24
CPC分类号： G06Q30/02
摘要： The present invention relates to a franchise partnership system providing a partnership franchise service, and a method therefor, and more specifically, in terms of a franchise, the present invention appoints a target partnership franchise through the type of business of a franchise or a card member assessment; receives agreement on a card use target amount from the target partnership franchise, and provides a partnership franchise service of differentiating and providing a discount rate or a free shopping service according to the agreement information; and in terms of a card member, provides the partnership franchise service at a partnership franchise used by a card member through a calculation of usage frequency or usage performance for each of the card members, thereby increasing the use of a membership card in a partnership franchise by supporting the use of the card in the franchise through a franchise fee discount or by using free shopping service and the like.
摘要翻译：本发明涉及提供合伙特许经营服务的特许经营合作系统及其方法，更具体地说，就特许经营而言，本发明通过特许经营或卡会员的业务类型来指定目标合伙经营特许评定; 从目标合伙企业特许经营商接受关于卡使用目标金额的协议，并且提供根据协议信息区分和提供折扣率或免费购物服务的合作伙伴特许经营服务; 并且就卡会员而言，通过计算每个卡会员的使用频率或使用表现来提供卡会员所使用的合伙经销商的合伙经营加盟服务，从而增加了合伙经营权会员卡的使用通过特许经营费用折扣或免费购物服务等支持在特许经营中使用该卡。

3. 发明申请

WO2011057238A3 INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTRATE VIAS 审中-公开
标题翻译：采用导电穿透基板VIAS的集成式解除电容器
公开(公告)号：WO2011057238A3
公开(公告)日：2011-08-18
申请号：PCT/US2010055949
申请日：2010-11-09
申请人： IBM , MCALLISTER MICHAEL F , SHAPIRO MICHAEL J , KIM TAE HONG , SPROGIS EDMUND J
发明人： MCALLISTER MICHAEL F , SHAPIRO MICHAEL J , KIM TAE HONG , SPROGIS EDMUND J
IPC分类号： H01L27/02 , H01L21/70
CPC分类号： H01L28/40 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/642 , H01L24/16 , H01L25/0657 , H01L2224/13025 , H01L2225/06513 , H01L2225/06541 , H01L2924/01078 , H01L2924/10253 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
摘要： A capacitor (180) in a semiconductor substrate (10) employs a conductive through-substrate via (TSV) (80) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor (80) provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSVs can be provided in the semiconductor substrate (10) to provide electrical connection for power supplies and signal transmission therethrough. The capacitor (180) has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.
摘要翻译：半导体衬底（10）中的电容器（180）采用导电贯穿衬底通孔（TSV）（80）作为内部电极和柱状掺杂半导体区域作为外部电极。电容器（80）在小面积上提供大的去耦电容，并且不影响电路密度或Si3D结构设计。可以在半导体衬底（10）中提供附加的导电TSV，以提供用于电源和通过其的信号传输的电连接。电容器（180）具有比具有相当电容的传统电容器阵列的电感更低的电感，从而能够降低层叠半导体芯片的电源系统中的高频噪声。

4. 发明申请

WO2006065073A1 APPARATUS FOR TESTING RELIABILITY OF SEMICONDUCTOR SAMPLE 审中-公开
标题翻译：测试半导体样品可靠性的设备
公开(公告)号：WO2006065073A1
公开(公告)日：2006-06-22
申请号：PCT/KR2005/004299
申请日：2005-12-14
申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE , YOU, Jong Jun , KIM, Young Goo , KIM, Tae Hong
发明人： YOU, Jong Jun , KIM, Young Goo , KIM, Tae Hong
IPC分类号： H01L21/66
CPC分类号： G01R31/2865 , G01R31/2868 , G01R31/2877 , G01R31/2887
摘要： Provided is a apparatus for testing reliability of a semiconductor sample including: a sample mounting part for mounting the semiconductor sample on an upper center part thereof, and mounting components having an evaluation circuit board at an upper peripheral part thereof; a heating block formed to have a tip shape and mounted on a lower part of the semiconductor sample to maintain a test temperature; a cooling block separated from the heating block and surrounding the heating block to cool the temperature of the components; and a fixing block for raising and lowering the semiconductor sample.
摘要翻译：提供了一种用于测试半导体样品的可靠性的装置，包括：用于将半导体样品安装在其上部中心的样品安装部分和在其上部周边具有评估电路板的安装部件; 加热块形成为具有尖端形状并且安装在半导体样品的下部以保持测试温度; 冷却块与加热块分离并围绕加热块以冷却部件的温度; 以及用于升高和降低半导体样品的固定块。

5. 发明申请

WO2005081461A1 APPARATUS AND METHOD FOR DUALIZING AN ASYNCHRONOUS TRANSFER MODE (ATM) ROUTER IN A CDMA2000 SYSTEM 审中-公开
标题翻译： CDMA2000系统中异步传输模式（ATM）路由器的设备和方法
公开(公告)号：WO2005081461A1
公开(公告)日：2005-09-01
申请号：PCT/KR2005/000134
申请日：2005-01-14
申请人： UTSTARCOM KOREA LIMITED , KIM, Tae Hong
发明人： KIM, Tae Hong
IPC分类号： H04L12/28
CPC分类号： H04L12/5601 , H04L41/0846 , H04L45/60 , H04L49/30 , H04L49/552 , H04L2012/5607 , H04L2012/5618 , H04L2012/5627 , H04W24/04 , H04W88/12
摘要： The present invention provides an apparatus and method for dualizing an Asynchronous Transfer Mode (ATM) router in a CDMA2000 system. In a conventional wireless communication system, an ATM router in a Base Station Controller (BSC) has two separate dualized main central processing boards, which are also referred to as ADSL Subscriber Physical board Assembly (ASPA) boards. Each of the ASPA boards includes one operation and maintenance processor, which maintains configuration and operation information. One of the conventional dualized ASPA boards transmits its configuration and operation information to the other, or receives the information from the other, in the form of message. This is in order to maintain the consistency between the information of the dualized ASPA boards, as needed. Such message passing, however, is generally time consuming and may possibly create network overload. According to the invention, the dualized ASPA boards communicate the configuration and operation information with each other using a File Transfer Protocol (FTP), rather than by message passing. Accordingly, communicating the information takes relatively less time, which can considerably reduce the whole system loads and decrease the possibility of data inconsistency between the dualized ASPA boards.
摘要翻译：本发明提供了一种用于在CDMA2000系统中二次化异步传输模式（ATM）路由器的装置和方法。在传统的无线通信系统中，基站控制器（BSC）中的ATM路由器具有两个单独的二元化主中央处理板，也被称为ADSL用户物理板组装（ASPA）板。每个ASPA板包括一个操作和维护处理器，它维护配置和操作信息。传统的二进制ASPA板之一将其配置和操作信息传输到另一个，或者以消息的形式从另一个接收信息。这是为了根据需要保持二元化ASPA板的信息之间的一致性。然而，这样的消息传递通常是耗时的，并且可能产生网络过载。根据本发明，二进制ASPA板使用文件传输协议（FTP）来传送配置和操作信息，而不是通过消息传递。因此，传达信息所需的时间相对较少，这可以大大减少整个系统负载，并降低二元化ASPA板之间数据不一致的可能性。

6. 发明申请

WO2012026632A1 FIXED TYPE CONSTANT VELOCITY JOINT 审中-公开
标题翻译：固定式恒定速度接头
公开(公告)号：WO2012026632A1
公开(公告)日：2012-03-01
申请号：PCT/KR2010/005602
申请日：2010-08-23
申请人： HYUNDAIWIA CORPORATION , OH, Seung Tark , KIM, Tae Hong , JO, Hyang Cheol
发明人： OH, Seung Tark , KIM, Tae Hong , JO, Hyang Cheol
IPC分类号： F16D3/22 , F16D3/20
CPC分类号： F16D3/2245 , F16D2003/22309
摘要： The ball guide tracks include first tracks and second tracks with different groove configurations and having dual, multiple, or differentiated center offsets with smaller offsets applied to the tracks having relatively large ball movements and larger offsets applied to the tracks having relatively small ball movements as the joint is articulated for assembling.
摘要翻译：球导轨包括具有不同凹槽构造的第一轨道和第二轨道，并且具有双重，多个或微分的中心偏移，其较小偏移应用于具有相对较大球运动的轨迹，并且较大的偏移应用于具有相对小的球运动的轨迹，接头铰接用于组装。

7. 发明申请

WO2011087262A3 ADDITIVE COMPOSITION FOR SKIM COAT MORTAR AND A SKIM COAT MORTAR COMPOSITION COMPRISING THE ADDITIVE COMPOSITION 审中-公开
标题翻译：用于防滑组合物的添加剂组合物和包含添加剂组合物的脱脂组合物组合物
公开(公告)号：WO2011087262A3
公开(公告)日：2011-12-01
申请号：PCT/KR2011000201
申请日：2011-01-12
申请人： SAMSUNG FINE CHEMICALS CO LTD , KANG JIN KYU , KIM TAE HONG
发明人： KANG JIN KYU , KIM TAE HONG
IPC分类号： C11D3/075 , C04B24/04 , C04B24/16 , C04B24/38
CPC分类号： C04B28/02 , C04B2103/304 , C04B2103/402 , C04B2103/406 , C04B14/28 , C04B22/064 , C04B24/383 , C04B2103/408 , C04B2103/32 , C04B24/16 , C04B22/142 , C04B24/123 , C04B24/04 , C04B24/2652 , C04B24/32
摘要： Disclosed are an additive composition for skim coat mortar and a skim coat mortar composition comprising the additive composition. The disclosed additive composition for skim coat mortar comprises a cellulose ether and at least one type of auxiliary additive.
摘要翻译：公开了一种用于脱脂涂层砂浆的添加剂组合物和包含该添加剂组合物的脱脂涂层砂浆组合物。所公开的用于脱脂乳浆的添加剂组合物包括纤维素醚和至少一种类型的辅助添加剂。

8. 发明申请

WO2011057238A2 INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTRATE VIAS 审中-公开
标题翻译：采用导电通孔衬底VIAS的集成解耦电容器
公开(公告)号：WO2011057238A2
公开(公告)日：2011-05-12
申请号：PCT/US2010/055949
申请日：2010-11-09
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MCALLISTER, Michael, F. , SHAPIRO, Michael, J. , KIM, Tae, Hong , SPROGIS, Edmund, J.
发明人： MCALLISTER, Michael, F. , SHAPIRO, Michael, J. , KIM, Tae, Hong , SPROGIS, Edmund, J.
IPC分类号： H01L27/02 , H01L21/70
CPC分类号： H01L28/40 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/642 , H01L24/16 , H01L25/0657 , H01L2224/13025 , H01L2225/06513 , H01L2225/06541 , H01L2924/01078 , H01L2924/10253 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
摘要： A capacitor (180) in a semiconductor substrate (10) employs a conductive through-substrate via (TSV) (80) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor (80) provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSVs can be provided in the semiconductor substrate (10) to provide electrical connection for power supplies and signal transmission therethrough. The capacitor (180) has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.
摘要翻译：半导体衬底（10）中的电容器（180）采用导电贯穿衬底通孔（TSV）（80）作为内部电极并且使用柱状掺杂半导体区域作为外部电极。电容器（80）在小面积内提供较大的去耦电容，并且不影响电路密度或Si3D结构设计。可以在半导体衬底（10）中提供额外的导电TSV以提供电源和通过其传输信号的电连接。电容器（180）具有比具有可比较电容的传统电容器阵列更低的电感，从而能够降低堆叠半导体芯片的电源系统中的高频噪声。

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