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    • 1. 发明申请
    • REFLECTIVE SURFACE ATTACHED LIGHT EMITTING DEVICE
    • 反射表面附着的发光装置
    • WO2007032619A1
    • 2007-03-22
    • PCT/KR2006/003535
    • 2006-09-06
    • KIM, Kwang Hee
    • KIM, Kwang Hee
    • H01L33/00
    • H01L25/167H01L33/486H01L33/60H01L2224/48091H01L2224/48227H01L2224/48247H01L2924/10253H01L2924/3025H01L2924/00014H01L2924/00
    • Provided is a light emitting device in which a mount portion for bonding an LED chip and a reflector for reflecting light are adhered after being separately manufactured. The light emitting device includes: a mount portion on which one or more LED chips are bonded; a wire portion which is formed to connect an n-electrode and a p-electrode of the LED chip; and a reflector which is separated from the mount portion, and is bonded with the mount portion so as to reflect light emitted from the LED chip. In addition, one or more LED chips are formed, wherein internal reflectors are respectively formed around areas where the plurality of LED chips is formed, and external reflectors are further formed out of areas where the plurality of internal reflectors is formed. Accordingly, a light emitting device package can be simply manufactured in various sizes by using a method in which a substrate bonded with a chip and a cup portion functioning as a reflector are separately formed, and thereafter the two parts are adhered to be integrated as one part. Therefore, an optical directivity of the light emitting device can be easily achieved in terms of diversity. Further, it is possible to manufacture and produce a light emitting device with high brightness in a high-variety low-volume manner.
    • 提供了一种发光装置,其中分别制造用于粘合LED芯片的安装部分和用于反射光的反射器。 发光器件包括:一个或多个LED芯片接合在其上的安装部分; 形成为连接所述LED芯片的n电极和p电极的线部分; 以及与安装部分隔开并与安装部分接合以反射从LED芯片发射的光的反射器。 此外,形成一个或多个LED芯片,其中在形成有多个LED芯片的区域周围分别形成内部反射器,并且在形成有多个内部反射器的区域之外进一步形成外部反射器。 因此,通过使用分别形成有作为反射体的芯片和杯状部分接合的基板的方法,可以简单地制造各种尺寸的发光器件封装,此后两个部分被粘合成一体化 部分。 因此,在分集方面可以容易地实现发光装置的光学方向性。 此外,可以以各种低容量的方式制造和制造具有高亮度的发光器件。