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1. 发明申请

WO2011149257A3 SYSTEM FOR IMPLEMENTING THE ENGLISH CURSIVE SCRIPT HANDWRITING OF A USER 审中-公开
标题翻译：用于执行用户的英文CURSIVE SCRIPT手写系统
公开(公告)号：WO2011149257A3
公开(公告)日：2012-02-23
申请号：PCT/KR2011003814
申请日：2011-05-25
申请人： JANG KYUNG-HO
发明人： JANG KYUNG-HO
IPC分类号： G06F3/02 , G06F3/041 , G06F17/00
CPC分类号： G06K9/00409 , G06F3/04883
摘要： According to the present invention, a system for implementing the English cursive script handwriting of a user involves taking, as an input, a predetermined number of handwritten letters directly written by the user, specifically in English cursive script, and automatically deducing and implementing the handwriting of the user through the inputted handwritten letters. The system of the present invention enables preceding letters and following letters to be naturally interconnected, while taking the characteristics of English cursive script, in which the letters are interconnected, into consideration.
摘要翻译：根据本发明，用于实现用户的英文草书脚本笔迹的系统涉及以用户直接书写的预定数量的手写字母作为输入，特别是以英文草书脚本作为输入，并且自动推导和实现手写的用户通过输入的手写字母。本发明的系统使得先前的字母和随后的字母自然地相互关联，同时考虑到字母相互关联的英文草书的特征。

2. 发明申请

WO2009032536A3 METHOD FOR MANUFACTURING A SEMICONDUCTOR DIE AND A SEMICONDUCTOR DEVICE COMPRISING THE SEMICONDUCTOR DIE OBTAINED THEREBY 审中-公开
标题翻译：用于制造半导体器件的方法和包含其中获得的半导体器件的半导体器件
公开(公告)号：WO2009032536A3
公开(公告)日：2009-04-30
申请号：PCT/US2008073797
申请日：2008-08-21
申请人： 3M INNOVATIVE PROPERTIES CO , JO KWANG-JAE , JANG KYUNG-HO
发明人： JO KWANG-JAE , JANG KYUNG-HO
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , H01L21/0212 , H01L21/02282 , H01L21/3127
摘要： Disclosed is a method for dicing a semiconductor wafer. The method for dicing a semiconductor wafer prevents a die from being contaminated with silicon dust, generated during the dicing of the wafer, and thus prevents defects in a subsequent wire bonding step, such as defects in bonding wire, contamination of a semiconductor device, etc. The method for dicing a semiconductor wafer comprises the steps of: applying a fluorine-containing polymer coating agent onto one surface of a wafer having a circuit pattern formed thereon to form a polymer coating layer, before dicing the wafer.
摘要翻译：公开了一种用于切割半导体晶片的方法。用于切割半导体晶片的方法防止晶片在晶片切割期间产生的硅粉污染，从而防止随后的引线键合步骤中的缺陷，例如接合线的缺陷，半导体器件的污染等用于切割半导体晶片的方法包括以下步骤：在切割晶片之前，在其上形成有电路图案的晶片的一个表面上涂覆含氟聚合物涂层剂以形成聚合物涂层。

3. 发明申请

WO2008020714A1 SYSTEM OF IMPLEMENTING USER HANDWRITING AND METHOD THEREOF 审中-公开
标题翻译：实施用户手册及其方法的系统
公开(公告)号：WO2008020714A1
公开(公告)日：2008-02-21
申请号：PCT/KR2007/003914
申请日：2007-08-16
申请人： JANG, Kyung-Ho
发明人： JANG, Kyung-Ho
IPC分类号： G06F17/00
CPC分类号： G06K9/46 , G06K2209/01
摘要： System for implementing user handwriting according to the present invention, comprising : a handwriting input module (120) for receiving user handwriting including at least 100 to 200 characters by a user with sample sentences; a feature determining module (150); a distance determining module (160) for determining a vertical distance between an uppermost point mark and a lowermost point mark between 2 characters and their segments and a horizontal distance between a leftmost point mark and a rightmost point mark between 2 characters and their segments; a position determining module (170) for determining positions of the uppermost and lowermost point marks and the leftmost and rightmost point marks between 2 characters and their segments; a handwriting combining module (180) for combining several handwriting base on data recognized by the feature determining module (150), the distance determining module (160) and the position determining module (170); and a handwriting output module (200) for outputting handwriting combined by the handwriting combining module (180).
摘要翻译：根据本发明的用于实现用户手写体的系统，包括：手写输入模块（120），用于接收用户具有至少100到200个字符的用户笔迹，所述用户手写具有示例句子; 特征确定模块（150）; 距离确定模块（160），用于确定2个字符与其段之间的最上标点和最下标点之间的垂直距离以及2个字符与其段之间的最左点标记和最右点标记之间的水平距离; 位置确定模块（170），用于确定2个字符及其片段之间的最上面和最下面的点标记和最左边和最右边的点标记的位置; 用于根据由特征确定模块（150）识别的数据，距离确定模块（160）和位置确定模块（170）组合几个手写基准的手写组合模块（180）。以及用于输出由手写合成模块（180）组合的笔迹的手写输出模块（200）。

4. 发明申请

WO2013043434A3 A METHOD, SYSTEM FOR MANUFACTURING A CIRCUIT BOARD, AND THE CIRCUIT BOARD THEREOF 审中-公开
标题翻译：一种用于制造电路板的方法，系统及其电路板
公开(公告)号：WO2013043434A3
公开(公告)日：2013-05-16
申请号：PCT/US2012054891
申请日：2012-09-12
申请人： 3M INNOVATIVE PROPERTIES CO , SONG HYUNG-JIN , JANG KYUNG-HO , LEE JUSTINA S
发明人： SONG HYUNG-JIN , JANG KYUNG-HO , LEE JUSTINA S
IPC分类号： H05K3/46 , B32B15/08 , H01L33/00
CPC分类号： H05K3/0058 , B32B7/02 , H05K1/05 , H05K1/056 , H05K3/022 , H05K2203/1545 , Y10T156/10 , Y10T428/24942 , Y10T428/2495
摘要： The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of LEDs. The method includes individual processes (in no particular order) like continuous contacting of various layers of the circuit board, B-staging of an adhesive used in the circuit board, pre-heating of the various layers when the various layers are arranged in an adjacent manner to each other, applying pressure to the circuit board when the various layers are arranged in an adjacent manner to each other, thermal curing of the adhesive and singulating the circuit board.
摘要翻译：本发明提供一种用于制造在LED制造期间使用的电路板的方法和系统。该方法包括像电路板的各个层的连续接触，电路板中使用的粘合剂的B阶段的各个工艺（没有特定的顺序），当各个层布置在相邻的层中时各种层的预热彼此相邻的方式，当各个层彼此相邻地布置时对电路板施加压力，热固化粘合剂并且对电路板进行单片化。

5. 发明申请

WO2013043434A2 A METHOD, SYSTEM FOR MANUFACTURING A CIRCUIT BOARD, AND THE CIRCUIT BOARD THEREOF 审中-公开
标题翻译：一种制造电路板的方法，系统及其电路板
公开(公告)号：WO2013043434A2
公开(公告)日：2013-03-28
申请号：PCT/US2012/054891
申请日：2012-09-12
申请人： 3M INNOVATIVE PROPERTIES COMPANY , SONG, Hyung-Jin , JANG, Kyung-Ho , LEE, Justina S.
发明人： SONG, Hyung-Jin , JANG, Kyung-Ho , LEE, Justina S.
IPC分类号： H05K3/46 , H01L33/00 , B32B15/08
CPC分类号： H05K3/0058 , B32B7/02 , H05K1/05 , H05K1/056 , H05K3/022 , H05K2203/1545 , Y10T156/10 , Y10T428/24942 , Y10T428/2495
摘要： The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of LEDs. The method includes individual processes (in no particular order) like continuous contacting of various layers of the circuit board, B-staging of an adhesive used in the circuit board, pre-heating of the various layers when the various layers are arranged in an adjacent manner to each other, applying pressure to the circuit board when the various layers are arranged in an adjacent manner to each other, thermal curing of the adhesive and singulating the circuit board.
摘要翻译：本发明提供了一种用于制造在制造LED期间使用的电路板的方法和系统。该方法包括单独的过程（不按特定顺序），如电路板的各层的连续接触，电路板中使用的粘合剂的B阶化，当各层布置在相邻的电路板中时预热各层当各层以彼此相邻的方式布置时，向电路板施加压力，粘合剂的热固化和单片化电路板。

6. 发明申请

WO2009145589A2 USER HANDWRITING CREATION SYSTEM 审中-公开
标题翻译：用户手写创作系统
公开(公告)号：WO2009145589A2
公开(公告)日：2009-12-03
申请号：PCT/KR2009002879
申请日：2009-05-29
申请人： JANG KYUNG-HO , UNIV IND & ACAD COLLABORATION
发明人： JANG KYUNG-HO
IPC分类号： G06F17/00
CPC分类号： G06K9/2081 , G06K9/00872 , G06K2209/01 , G06K2209/013
摘要： The user handwriting creation system of the present invention comprises: a handwriting recognition module that receives an appropriate number of letters from a user, detects the distance between phonemes/syllables and the shape and position of the phonemes/syllables, and recognizes the handwriting of the user; a point designation module that designates a detailed specific position within each phoneme in the handwriting of the user recognized through said handwriting recognition module; a reference point setting module that sets a reference point as a reference for a change in a phoneme/syllable at a position in an inner area of the phoneme/syllable or in an outer area of the phoneme/syllable of the handwriting of the user recognized through said handwriting recognition module; and a handwriting transformation module that designates coordinate values of x and yaxes for a first point based on said reference point, sets the coordinate values of points after the first point with respect to the x and y axes' distances to the immediately previous point, sets a relative coordinate value for each point, and then changes the relative coordinate value of a specific point or a specific phoneme/syllable to transform the position, distance, and shape of the handwriting.
摘要翻译：本发明的用户手写创建系统包括：从用户接收适当数量的字母的手写识别模块，检测音素/音节之间的距离以及音素/音节的形状和位置，并识别用户; 指定通过所述手写识别模块识别的用户的笔迹中的每个音素内的详细特定位置的点指定模块; 参考点设置模块，其将参考点设置为在音素/音节的内部区域中的位置处的音素/音节的改变或用户识别的用户手写的音素/音节的外部区域中的改变的参考通过所述手写识别模块; 以及基于所述参考点指定第一点的x和yaxes的坐标值的手写变换模块，将相对于前一点的x轴和y轴的距离设置在第一点之后的点的坐标值，设置每个点的相对坐标值，然后改变特定点或特定音素/音节的相对坐标值，以转换手写的位置，距离和形状。

7. 发明申请

WO2009032536A2 METHOD FOR MANUFACTURING A SEMICONDUCTOR DIE AND A SEMICONDUCTOR DEVICE COMPRISING THE SEMICONDUCTOR DIE OBTAINED THEREBY 审中-公开
标题翻译：制造半导体裸片的方法和包括由其获得的半导体裸片的半导体器件
公开(公告)号：WO2009032536A2
公开(公告)日：2009-03-12
申请号：PCT/US2008/073797
申请日：2008-08-21
申请人： 3M INNOVATIVE PROPERTIES COMPANY , JO, Kwang-jae , JANG, Kyung-ho
发明人： JO, Kwang-jae , JANG, Kyung-ho
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , H01L21/0212 , H01L21/02282 , H01L21/3127
摘要： Disclosed is a method for dicing a semiconductor wafer. The method for dicing a semiconductor wafer prevents a die from being contaminated with silicon dust, generated during the dicing of the wafer, and thus prevents defects in a subsequent wire bonding step, such as defects in bonding wire, contamination of a semiconductor device, etc. The method for dicing a semiconductor wafer comprises the steps of: applying a fluorine-containing polymer coating agent onto one surface of a wafer having a circuit pattern formed thereon to form a polymer coating layer, before dicing the wafer.
摘要翻译：公开了一种用于切割半导体晶片的方法。用于切割半导体晶片的方法防止了管芯被在晶片切割过程中产生的硅尘污染，并且因此防止了在随后的焊线步骤中的缺陷，例如焊线中的缺陷，半导体器件的污染等切割半导体晶片的方法包括以下步骤：在切割晶片之前，将含氟聚合物涂层剂施加到其上形成有电路图案的晶片的一个表面上以形成聚合物涂层。

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