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1. 发明申请

WO1996013728A1 PROBE STRUCTURE 审中-公开
标题翻译：探索结构
公开(公告)号：WO1996013728A1
公开(公告)日：1996-05-09
申请号：PCT/JP1995002092
申请日：1995-10-12
申请人： NITTO DENKO CORPORATION , TAKAYAMA, Yoshinari , BABA, Toshikazu , HINO, Atsushi , AMINO, Ichiro
发明人： NITTO DENKO CORPORATION
IPC分类号： G01R01/073
CPC分类号： G01R1/07314 , G01R1/06761 , H05K3/4007
摘要： An insulating substrate (1) has a contact (2) on one side (1a) and a conductor circuit (3) on the other side (1b). The contact (2) and the conductor circuit (3) are connected electrically with each other through a conductor (5) formed in a through-hole (4) bored in the insulating substrate (1). The contact (2) has a laminate structure comprising a deep layer (1c) having a hardness of 100 to 700 Hk, an intermediate layer (1b) having a hardness of 10 to 300 Hk and a surface layer (1a) having a hardness of 700 to 1,200 Hk. Preferably, the tensile stress of the surface layer (1a) is not greater than 50 kg/mm . A low and stable contact resistance is maintained in an electrical test of small objects such as ICs, particularly in burn-in test. In a test method which forms and utilizes solder bumps on the object, the solder component of the object after inspection does not adhere to the contact. Even when ON/OFF of contact with the object under test is repeated, deterioration from the initial contact state is less, and the test can be carried out with high reliability.
摘要翻译：绝缘基板（1）在一侧（1a）上具有触点（2）和另一侧（1b）上的导体电路（3）。触点（2）和导体电路（3）通过在绝缘基板（1）上钻孔的通孔（4）中形成的导体（5）彼此电连接。触点（2）具有包括硬度为100〜700Hk的深层（1c），硬度为10〜300Hk的中间层（1b）和硬度为10〜300Hk的表面层（1a）的层叠结构， 700至1,200 Hk。优选地，表面层（1a）的拉伸应力不大于50kg / mm 2。在小型物体（如IC）的电气测试中，特别是在老化测试中，保持了低稳定的接触电阻。在形成并利用物体上的焊料凸块的测试方法中，检查后物体的焊料部件不粘附于接触。即使重复与被测试物体的接触ON / OFF，初始接触状态的劣化也较小，可以高可靠性地进行试验。

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