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    • 4. 发明申请
    • MANUFACTURING METHOD OF THIN FILM TRANSISTOR USING OXIDE SEMICONDUCTOR
    • 使用氧化物半导体薄膜晶体管的制造方法
    • WO2008149873A1
    • 2008-12-11
    • PCT/JP2008/060246
    • 2008-05-28
    • CANON KABUSHIKI KAISHAOMURA, HideyukiHAYASHI, Ryo
    • OMURA, HideyukiHAYASHI, Ryo
    • H01L29/786
    • H01L29/7869H01L29/78618
    • A manufacturing method of a thin film transistor having at least a gate electrode, a gate insulation film, an oxide semiconductor layer, a first insulation film, a source electrode, a drain electrode, and a second insulation film on a substrate, including: forming the gate electrode on the substrate; forming the gate insulation film on the gate electrode; forming a semiconductor layer including amorphous oxide on the gate insulation film; patterning the gate insulation film; patterning the oxide semiconductor layer; reducing the oxide semiconductor layer in resistance by forming the first insulation film on the oxide semiconductor layer in the atmosphere not including an oxidized gas; patterning the fist insulation film and forming a contact hole between the source electrode and the drain electrode and the oxide semiconductor layer; forming a source electrode layer and a drain electrode layer in the oxide semiconductor layer through the contact hole; forming the source electrode and the drain electrode through the contact hole and allowing the first insulation film to be exposed; patterning the exposed first insulation film and allowing a channel region of the oxide semiconductor layer to be exposed; and increasing the channel region in resistance by forming the second insulation film on the surface including the channel region of the oxide semiconductor layer in the atmosphere including an oxidized gas.
    • 一种在基板上至少具有栅电极,栅绝缘膜,氧化物半导体层,第一绝缘膜,源电极,漏电极和第二绝缘膜的薄膜晶体管的制造方法,包括:形成 基板上的栅电极; 在栅电极上形成栅极绝缘膜; 在所述栅极绝缘膜上形成包含无定形氧化物的半导体层; 图案化栅极绝缘膜; 图案化氧化物半导体层; 通过在不包含氧化气体的气氛中在氧化物半导体层上形成第一绝缘膜来减小电阻的氧化物半导体层; 图案化第一绝缘膜并在源电极和漏电极和氧化物半导体层之间形成接触孔; 在所述氧化物半导体层中通过所述接触孔形成源电极层和漏电极层; 通过所述接触孔形成所述源电极和所述漏电极,并使所述第一绝缘膜露出; 图案化暴露的第一绝缘膜并允许暴露氧化物半导体层的沟道区; 以及通过在包括氧化气体的气氛中的包括氧化物半导体层的沟道区域的表面上形成第二绝缘膜来增加电阻的沟道区域。
    • 7. 发明申请
    • THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    • 薄膜晶体管及其制造方法
    • WO2009136645A2
    • 2009-11-12
    • PCT/JP2009058724
    • 2009-04-28
    • CANON KKSATO AYUMUHAYASHI RYOYABUTA HISATOSANO MASAFUMI
    • SATO AYUMUHAYASHI RYOYABUTA HISATOSANO MASAFUMI
    • H01L29/786
    • H01L29/7869H01L29/78621
    • Provided are a coplanar structure thin film transistor that allows a threshold voltage to change only a little under electric stress, and a method of manufacturing the same. The thin film transistor includes on a substrate at least: a gate electrode; a gate insulating layer; an oxide semiconductor layer including a source electrode, a drain electrode, and a channel region; a channel protection layer; and an interlayer insulating layer. The channel protection layer includes one or more layers, the layer in contact with the oxide semiconductor layer among the one or more layers being made of an insulating material containing oxygen, ends of the channel protection layer are thinner than a central part of the channel protection layer, the interlayer insulating layer contains hydrogen, and regions of the oxide semiconductor layer that are in direct contact with the interlayer insulating layer form the source electrode and the drain electrode.
    • 提供一种共面结构薄膜晶体管,其制造方法允许阈值电压在电应力下变化很小。 薄膜晶体管至少在基板上包括:栅电极; 栅极绝缘层; 包括源电极,漏电极和沟道区的氧化物半导体层; 通道保护层; 和层间绝缘层。 沟道保护层包括一层或多层,一层或多层中与氧化物半导体层接触的层由含氧的绝缘材料制成,沟道保护层的端部比通道保护层的中心部分薄 层间绝缘层含有氢,与层间绝缘层直接接触的氧化物半导体层的区域形成源电极和漏电极。