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    • 3. 发明申请
    • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • 半导体发光器件
    • WO2007077960A1
    • 2007-07-12
    • PCT/JP2006/326366
    • 2006-12-27
    • SHOWA DENKO K.K.HASHIMOTO, TakashiYASUDA, Takaki
    • HASHIMOTO, TakashiYASUDA, Takaki
    • H01L33/00
    • H01L33/60H01L25/167H01L2224/16145H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/48465H01L2224/73265H01L2924/10253H01L2924/00014H01L2924/00
    • An object of the present invention is to provide a light-emitting device with a high output and a high efficiency by improving the efficiency for utilizing light emitted from a semiconductor light-emitting element. The inventive semiconductor light-emitting device comprises a package substrate, a sub-mount provided on the package substrate, a semiconductor light-emitting element provided on the sub-mount, and a reflector surrounding the sub-mount and the semiconductor light-emitting element, wherein the positions and sizes of the sub-mount, light-emitting element and reflector satisfy the following relationship (A) on a cross section perpendicular to the package substrate that passes through the center of the semiconductor light-emitting element, r - 1s ( (hs - d) x (1s - 1c)/hc --- (A) wherein r, 1s and 1c are distances from the drooping portion of the reflector, from the outer circumference of the sub-mount and from the outer circumference of the semiconductor light-emitting element to the center of the semiconductor light-emitting element, respectively, hs and d are heights of the sub-mount and of the drooping portion of the reflector, respectively, and hc is a height of the upper surface of the semiconductor light-emitting element from the upper surface of the sub-mount.
    • 本发明的目的是通过提高利用从半导体发光元件发出的光的效率来提供具有高输出和高效率的发光装置。 本发明的半导体发光装置包括封装基板,设置在封装基板上的副安装座,设置在副安装座上的半导体发光元件以及围绕副安装座和半导体发光元件的反射器 其中,所述副安装型发光元件和反射镜的位置和尺寸在穿过所述半导体发光元件的中心的与所述封装基板垂直的截面上满足以下关系式(A):r-1s ((hs-d)×(1s-1c)/ hc ---(A)其中,r,1s和1c是与反射器的下垂部分距离子安装座的外圆周和外周 半导体发光元件分别到半导体发光元件的中心,hs和d分别是反射器的副安装座和下垂部分的高度,hc是上表面的高度 的t 他的半导体发光元件从底座的上表面。