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1. 发明申请

WO2006031296A8 BALL GRID ARRAY CONNECTOR 审中-公开
标题翻译：球网阵列连接器
公开(公告)号：WO2006031296A8
公开(公告)日：2008-02-14
申请号：PCT/US2005026331
申请日：2005-07-25
申请人： FCI AMERICAS TECHNOLOGY INC , FRAMATOME CONNECTORS INT , MINICH STEVE , HARPER DONALD JR
发明人： MINICH STEVE , HARPER DONALD JR
IPC分类号： H01R13/514
CPC分类号： H05K7/1084 , H01R12/707 , H01R12/7076 , H01R13/24 , H01R13/514 , H01R13/6315 , H01R43/24
摘要： An electrical connector having a leadframe assembly and a connector housing is disclosed. The leadframe may include a lead frame and an electrical contact extending at least partially through the lead frame. The connector housing contains the leadframe assembly in each of one or more directions and also allows the leadframe assembly to move relative to the housing in the each direction. After the connector is mounted to a substrate, such as a printed circuit board, the housing is free to move in at least one direction relative to the leadframe assemblies. The connector may also include a contact receiving wafer having a face that at least partially defines an aperture that extends therethrough. A terminal portion of the contact may extend at least partially into the aperture. The faces that define the aperture contain the terminal portion of the contact in each of a plurality of directions and also allows the terminal portion of the contact to move in each direction.
摘要翻译：公开了一种具有引线框组件和连接器壳体的电连接器。引线框架可以包括引线框架和至少部分延伸穿过引线框架的电触点。连接器壳体在一个或多个方向中的每一个中包含引线框架组件，并且还允许引线框组件在每个方向上相对于壳体移动。在将连接器安装到基板（例如印刷电路板）之后，壳体可相对于引线框架组件沿至少一个方向自由移动。连接器还可以包括具有至少部分限定穿过其延伸的孔的面的接触接收晶片。接触件的端子部分可以至少部分地延伸到孔中。限定孔径的面在多个方向中的每一个中包含接触件的端子部分，并且还允许接触件的端子部分在每个方向上移动。

2. 发明申请

WO2007081467A2 PICKUP CAP FOR ELECTRICAL CONNECTOR 审中-公开
标题翻译：电气连接器的拾取头
公开(公告)号：WO2007081467A2
公开(公告)日：2007-07-19
申请号：PCT/US2006/046949
申请日：2006-12-11
申请人： FCI AMERICAS TECHNOLOGY, INC. , FCI , HARPER, Donald, Jr.
发明人： HARPER, Donald, Jr.
IPC分类号： H01R13/44
CPC分类号： H01R43/205 , H01R43/0242 , H01R43/0249 , H01R43/0256 , H01R43/0263
摘要： An improved pickup cap may be provided with a surface area configuration that imparts a more even temperature distribution across the ball grid array during reflow. The pickup cap, when connected to the electrical connector, may cover the sides of the electrical connector, but not cover the central portion of the electrical connector. Such a configuration of pickup cap surface areas may provide a more even temperature distribution across the grid of solder balls during reflow of the solder balls.
摘要翻译：可以提供改进的拾取盖，其具有表面区域配置，其在回流期间在球栅阵列上赋予更均匀的温度分布。拾取盖当连接到电连接器时可以覆盖电连接器的侧面，但不覆盖电连接器的中心部分。拾取盖表面区域的这种构造可以在焊球回流期间在焊球的网格上提供更均匀的温度分布。

3. 发明申请

WO2006031296A3 BALL GRID ARRAY CONNECTOR 审中-公开
公开(公告)号：WO2006031296A3
公开(公告)日：2006-03-23
申请号：PCT/US2005/026331
申请日：2005-07-25
申请人： FCI AMERICAS TECHNOLOGY, INC. , FCI , MINICH, Steve , HARPER, Donald, Jr.
发明人： MINICH, Steve , HARPER, Donald, Jr.
IPC分类号： H01R13/514
摘要： An electrical connector having a leadframe assembly and a connector housing is disclosed. The leadframe may include a lead frame and an electrical contact extending at least partially through the lead frame. The connector housing contains the leadframe assembly in each of one or more directions and also allows the leadframe assembly to move relative to the housing in the each direction. After the connector is mounted to a substrate, such as a printed circuit board, the housing is free to move in at least one direction relative to the leadframe assemblies. The connector may also include a contact receiving wafer having a face that at least partially defines an aperture that extends therethrough. A terminal portion of the contact may extend at least partially into the aperture. The faces that define the aperture contain the terminal portion of the contact in each of a plurality of directions and also allows the terminal portion of the contact to move in each direction.

4. 发明申请

WO2007081467A3 PICKUP CAP FOR ELECTRICAL CONNECTOR 审中-公开
标题翻译：电气连接器的拾取头
公开(公告)号：WO2007081467A3
公开(公告)日：2008-06-19
申请号：PCT/US2006046949
申请日：2006-12-11
申请人： FCI AMERICAS TECHNOLOGY INC , FRAMATOME CONNECTORS INT , HARPER DONALD JR
发明人： HARPER DONALD JR
IPC分类号： H01R13/60
CPC分类号： H01R43/205 , H01R43/0242 , H01R43/0249 , H01R43/0256 , H01R43/0263
摘要： An improved pickup cap (200) is provided with a surface area configuration that imparts a more even temperature distribution across the ball grid array during reflow. The pickup cap, when connected to the electrical connector, may cover the sides of the electrical connector, but not cover the central portion of the electrical connector. Such a configuration of pickup cap surface provides a more even temperature distribution across the grid of solder balls during reflow of solder balls.
摘要翻译：提供了一种改进的拾取盖（200），其具有在回流期间赋予球栅阵列更均匀的温度分布的表面区域配置。拾取盖当连接到电连接器时可以覆盖电连接器的侧面，但不覆盖电连接器的中心部分。拾取盖表面的这种构造在焊球回流期间提供跨越焊球网格的更均匀的温度分布。

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