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1. 发明申请

WO02062859A3 RADICAL POLYMERIZABLE COMPOSITIONS CONTAINING POLYCYCLIC OLEFINS 审中-公开
标题翻译：含有多环烯烃的自由基聚合物组合物
公开(公告)号：WO02062859A3
公开(公告)日：2003-05-22
申请号：PCT/US0148791
申请日：2001-12-18
申请人： LOCTITE , DERSHEM STEPHEN M , FORRESTAL KEVIN J
发明人： DERSHEM STEPHEN M , FORRESTAL KEVIN J
IPC分类号： C08F232/08 , C08F222/40 , C08F290/02 , C08F299/00 , C09J4/00 , H01L21/50
CPC分类号： C08F232/08
摘要： In accordance with the present invention, there are provided free-radical polymerizable compositions comprising polycyclic olefins, wherein the polycyclic olefins contain little, if any, cyclopentenyl unsaturation. As a result, these olefins are sufficiently reactive with the propagating free-radicals during cure to provide a highly crosslinked thermoset resin. Moreover, invention compositions comprise high molecular weight polycyclic olefins having low volatility. Accordingly, the observed undesirable weight loss upon cure of prior art thermosetting compositions is considerably reduced. Further provided by the present invention are compositions comprising functionalized polycyclic olefin monomers. These functionalized olefin monomers provide additional benefits such as increased adhesion to a variety of surfaces and greater control over glass transition temperatures.
摘要翻译：根据本发明，提供了包含多环烯烃的自由基可聚合组合物，其中多环烯烃含有很少（如果有的话）环戊烯基不饱和度。结果，这些烯烃在固化期间与增长的自由基充分反应，以提供高度交联的热固性树脂。此外，本发明组合物包含具有低挥发性的高分子量多环烯烃。因此，在现有技术的热固性组合物固化时观察到的不希望的重量损失显着降低。本发明进一步提供的是包含官能化多环烯烃单体的组合物。这些官能化烯烃单体提供额外的益处，例如增加对各种表面的粘附性和对玻璃化转变温度的更大控制。

2. 发明申请

WO9607691A2 THERMOSETTING RESIN COMPOSITIONS CONTAINING MALEIMIDE AND/OR VINYL COMPOUNDS 审中-公开
标题翻译：含有马来酰亚胺和/或乙烯基化合物的热固性树脂组合物
公开(公告)号：WO9607691A2
公开(公告)日：1996-03-14
申请号：PCT/US9511116
申请日：1995-08-30
申请人： QUANTUM MATERIALS INC , DERSHEM STEPHEN M , PATTERSON DENNIS B , OSUNA JOSE A JR
发明人： DERSHEM STEPHEN M , PATTERSON DENNIS B , OSUNA JOSE A JR
IPC分类号： C07D207/44 , C07D207/452 , C07D401/04 , C08F22/40 , C08F290/06 , C08G65/32 , C08G73/10 , C08G73/12 , C08G77/04 , C09J4/00 , C09J179/08 , H01L21/52
CPC分类号： C07D207/452 , C07D401/04 , C08G73/10 , C08G73/12 , C08G73/121 , C09J179/085
摘要： In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they dispaly good adhesion to both the substrate and the device attached thereto.
摘要翻译：根据本发明，提供了新型热固性树脂组合物，其不需要溶剂来提供具有合适粘度的系统以便于处理。本发明组合物具有快速固化的益处。所得到的热固性材料对于升高的温度是稳定的，高度柔性的，具有低水分吸收性，并因此可用于各种应用中，例如在粘合剂应用中，因为它们对基材和连接到其上的装置表现出良好的粘合性。

3. 发明申请

WO9419402A3 DIE-ATTACH COMPOSITIONS 审中-公开
标题翻译： DIE-ATTACH组合物
公开(公告)号：WO9419402A3
公开(公告)日：1994-10-13
申请号：PCT/US9401776
申请日：1994-02-23
申请人： QUANTUM MATERIALS INC , DERSHEM STEPHEN M , PATTERSON DENNIS B , DERFELT DEBORAH L
发明人： DERSHEM STEPHEN M , PATTERSON DENNIS B , DERFELT DEBORAH L
IPC分类号： C08L79/04 , C08G73/06 , C08K3/08 , C09J179/00 , C09J179/08 , H01B1/20 , H01B1/22 , C08G73/00 , H01B1/02
CPC分类号： H01B1/22 , C08G73/0655 , C08K3/08 , C08L79/04
摘要： In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer vehicle, electrically conductive filler, and a curing catalyst, preferably in the substantial absence of alkylphenol. The recognition that attach paste compositions are effective without the addition of alkylphenol has the benefit of reducing the cost of preparation, as well as the ease of preparation of die-attach pastes containing electrically conductive filler and polycyanate ester monomer. The incorporation of alkylphenol into die-attach paste compositions has been found to be unnecessary, due to the presence of catalytically active species on the surface of filler flake employed in the preparation of such pastes. Indeed, it is desirable to eliminate alkylphenols from die-attach paste compositions because alkylphenols are acidic species that do not become incorporated into the final polymerized matrix of the cured attach paste. These acidic species can thus leach out, leaving voids in the cured composition and causing corrosion of sensitive electronic parts which come in contact therewith. Optional treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.

4. 发明申请

WO1998004602A1 PERFLUORINATED HYDROCARBON POLYMER-FILLED ADHESIVE FORMULATIONS AND USES THEREFOR 审中-公开
标题翻译：全氟烃聚合物填充胶粘剂及其用途
公开(公告)号：WO1998004602A1
公开(公告)日：1998-02-05
申请号：PCT/US1997011945
申请日：1997-07-08
申请人： QUANTUM MATERIALS, INC. , DERSHEM, Stephen, M. , FORRAY, Deborah, D.
发明人： QUANTUM MATERIALS, INC.
IPC分类号： C08F259/08
CPC分类号： C09J4/06 , C08F259/08 , C08L2666/04 , C09J183/04 , C08F259/00
摘要： In accordance with the present invention, it has been discovered that perfluorinated hydrocarbon polymers can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i.e., very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants. Invention formulations can be used for a variety of purposes, such as, for example, for the preparations of filled adhesive formulations with a reduced propensity to settle out, excellent dispensing characteristics due to the dixotropic nature thereof, and the like.
摘要翻译：根据本发明，已经发现全氟化烃聚合物可以用作制备具有优异的介电性能，即非常低的电导率的粘合剂制剂的填料。除低介电常数以外，本发明组合物显示优异的流变性能。本发明的制剂可以用于各种目的，例如用于沉降倾向降低的填充粘合剂制剂的制备，由于其具有双性性质的优异的分散特性等。

5. 发明申请

WO1996007691A3 THERMOSETTING RESIN COMPOSITIONS CONTAINING MALEIMIDE AND/OR VINYL COMPOUNDS 审中-公开
公开(公告)号：WO1996007691A3
公开(公告)日：1996-03-14
申请号：PCT/US1995011116
申请日：1995-08-30
申请人： QUANTUM MATERIALS, INC. , DERSHEM, Stephen, M. , PATTERSON, Dennis, B. , OSUNA, Jose, A., Jr.
发明人： QUANTUM MATERIALS, INC.
IPC分类号： C07D207/452

6. 发明申请

WO1994019402A2 DIE-ATTACH COMPOSITIONS 审中-公开
标题翻译： DIE-ATTACH组合物
公开(公告)号：WO1994019402A2
公开(公告)日：1994-09-01
申请号：PCT/US1994001776
申请日：1994-02-23
申请人： QUANTUM MATERIALS , DERSHEM, Stephen, M. , PATTERSON, Dennis, B. , DERFELT, Deborah, L.
发明人： QUANTUM MATERIALS
IPC分类号： C08K03/08
CPC分类号： H01B1/22 , C08G73/0655 , C08K3/08 , C08L79/04
摘要： In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer vehicle, electrically conductive filler, and a curing catalyst, preferably in the substantial absence of alkylphenol. The recognition that attach paste compositions are effective without the addition of alkylphenol has the benefit of reducing the cost of preparation, as well as the ease of preparation of die-attach pastes containing electrically conductive filler and polycyanate ester monomer. The incorporation of alkylphenol into die-attach paste compositions has been found to be unnecessary, due to the presence of catalytically active species on the surface of filler flake employed in the preparation of such pastes. Indeed, it is desirable to eliminate alkylphenols from die-attach paste compositions because alkylphenols are acidic species that do not become incorporated into the final polymerized matrix of the cured attach paste. These acidic species can thus leach out, leaving voids in the cured composition and causing corrosion of sensitive electronic parts which come in contact therewith. Optional treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
摘要翻译：根据本发明，提供了一种用于将半导体器件附着到衬底上的新型组合物。本发明组合物包含液体聚氰酸酯单体载体，导电填料和固化催化剂，优选基本上不存在烷基酚。附加糊剂组合物在不加入烷基酚的情况下有效的认识有益于降低制备成本，以及容易制备含有导电填料和聚氰酸酯单体的模片附着浆料。已经发现，由于在制备这种糊料中使用的填料片表面上存在催化活性物质，因此已经发现将烷基酚引入到模具附着糊剂组合物中是不必要的。实际上，由于烷基酚是不被引入固化的附着浆料的最终聚合基质中的酸性物质，因此期望从模头附着糊剂组合物中除去烷基酚。这些酸性物质因此可能被浸出，在固化的组合物中留下空隙并导致与其接触的敏感电子部件的腐蚀。填充剂的任选处理使其不含催化活性金属离子显着延长了组合物的适用期。

7. 发明申请

WO2011116050A2 CURING AGENTS FOR EPOXY RESINS 审中-公开
标题翻译：环氧树脂固化剂
公开(公告)号：WO2011116050A2
公开(公告)日：2011-09-22
申请号：PCT/US2011/028606
申请日：2011-03-16
申请人： DESIGNER MOLECULES, INC. , DERSHEM, Stephen, M
发明人： DERSHEM, Stephen, M
CPC分类号： C07D233/61 , C07D403/06 , C08G59/5033 , C08G59/686 , C09J163/00
摘要： The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.
摘要翻译：本发明涉及用于环氧树脂的固化剂，以及包含使用相同的制备方法和用途固化的这种树脂的组合物（例如粘合剂）。更具体地说，本发明涉及包含芳族胺，苯酚和/或苯基酯部分的环氧树脂的混合固化剂。本发明的另一方面涉及具有优异的固化潜伏期以及低固化温度起始的组合的新的咪唑催化剂。

8. 发明申请

WO2010122519A2 WELL TUBULAR, COATING SYSTEM AND METHOD FOR OILFIELD APPLICATIONS 审中-公开
标题翻译：井管，涂层系统和油田应用方法
公开(公告)号：WO2010122519A2
公开(公告)日：2010-10-28
申请号：PCT/IB2010/051778
申请日：2010-04-23
申请人： SCHLUMBERGER CANADA LIMITED , SERVICES PETROLIERS SCHLUMBERGER , SCHLUMBERGER HOLDINGS LIMITED , SCHLUMBERGER TECHNOLOGY B.V. , PRAD RESEARCH AND DEVELOPMENT LIMITED , CRASTER, Bernadette , HAMMAMI, Ahmed , JONES, Timothy G.J. , YAKIMOSKI, Todd , WANG, Jiarong , DERSHEM, Stephen M.
发明人： CRASTER, Bernadette , HAMMAMI, Ahmed , JONES, Timothy G.J. , YAKIMOSKI, Todd , WANG, Jiarong , DERSHEM, Stephen M.
IPC分类号： E21B17/00
CPC分类号： E21B17/00 , E21B41/02
摘要： A technique facilitates the use of polymer materials in a downhole environment via utilization of a coating that can be applied to the polymer material. The methodology enables formation of a coating that sufficiently bonds with an underlying base structure of polymer material to withstand the harsh environment encountered in a downhole application. Additionally, the coating may utilize reactive chemistries to further protect the polymer material against the ingress of deleterious fluids while located in the downhole environment. Well tubulars formed of coated polymer are also described.
摘要翻译：一种技术有助于通过利用可施加到聚合物材料上的涂层在井下环境中使用聚合物材料。该方法使得能够形成与聚合物材料的下面的基础结构充分结合的涂层，以承受在井下应用中遇到的恶劣环境。此外，涂层可以利用反应性化学物质来进一步保护聚合物材料，以防止位于井下环境中的有害流体进入。还描述了由涂覆的聚合物形成的良好的管状体。

9. 发明申请

WO2002062859A2 RADICAL POLYMERIZABLE COMPOSITIONS CONTAINING POLYCYCLIC OLEFINS 审中-公开
标题翻译：含有多环烯烃的自由基聚合物组合物
公开(公告)号：WO2002062859A2
公开(公告)日：2002-08-15
申请号：PCT/US2001/048791
申请日：2001-12-18
申请人： LOCTITE , DERSHEM, Stephen, M. , FORRESTAL, Kevin, J.
发明人： DERSHEM, Stephen, M. , FORRESTAL, Kevin, J.
IPC分类号： C08F32/00
CPC分类号： C08F232/08
摘要： In accordance with the present invention, there are provided free-radical polymerizable compositions comprising polycyclic olefins, wherein the polycyclic olefins contain little, if any, cyclopentenyl unsaturation. As a result, these olefins are sufficiently reactive with the propagating free-radicals during cure to provide a highly crosslinked thermoset resin. Moreover, invention compositions comprise high molecular weight polycyclic olefins having low volatility. Accordingly, the observed undesirable weight loss upon cure of prior art thermosetting compositions is considerably reduced. Further provided by the present invention are compositions comprising functionalized polycyclic olefin monomers. These functionalized olefin monomers provide additional benefits such as increased adhesion to a variety of surfaces and greater control over glass transition temperatures.
摘要翻译：根据本发明，提供了包含多环烯烃的自由基可聚合组合物，其中多环烯烃含有很少（如果有的话）环戊烯基不饱和度。结果，这些烯烃在固化期间与增长的自由基充分反应，以提供高度交联的热固性树脂。此外，本发明组合物包含具有低挥发性的高分子量多环烯烃。因此，在现有技术的热固性组合物固化时观察到的不希望的重量损失显着降低。本发明进一步提供的是包含官能化多环烯烃单体的组合物。这些官能化烯烃单体提供额外的益处，例如增加对各种表面的粘附性和对玻璃化转变温度的更大控制。

10. 发明申请

WO2011116050A3 CURING AGENTS FOR EPOXY RESINS 审中-公开
标题翻译：环氧树脂固化剂
公开(公告)号：WO2011116050A3
公开(公告)日：2012-04-12
申请号：PCT/US2011028606
申请日：2011-03-16
申请人： DESIGNER MOLECULES INC , DERSHEM STEPHEN M
发明人： DERSHEM STEPHEN M
IPC分类号： C07D233/61 , C07D233/58 , C07D403/06 , C08G59/40 , C08K5/3445 , C08L63/00 , C09D163/00
CPC分类号： C07D233/61 , C07D403/06 , C08G59/5033 , C08G59/686 , C09J163/00
摘要： The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.
摘要翻译：本发明涉及用于环氧树脂的固化剂，以及包含使用相同的制备方法和用途固化的这种树脂的组合物（例如粘合剂）。更具体地说，本发明涉及包含芳族胺，苯酚和/或苯基酯部分的环氧树脂的混合固化剂。本发明的另一方面涉及具有优异的固化潜伏期以及低固化温度起始的组合的新的咪唑催化剂。

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