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1. 发明申请

WO2006096543A3 TEMPERATURE SENSING AND PREDICTION IN IC SOCKETS 审中-公开
标题翻译： IC插座温度感测和预测
公开(公告)号：WO2006096543A3
公开(公告)日：2009-04-16
申请号：PCT/US2006007687
申请日：2006-03-03
申请人： WELLS CTI LLC , LOPEZ CHRISTOPHER A , DENHEYER BRIAN J
发明人： LOPEZ CHRISTOPHER A , DENHEYER BRIAN J
IPC分类号： F25B41/04 , G01R31/01
CPC分类号： G01R31/2874 , G01K7/425 , G01R31/2891
摘要： An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device (20) includes a current sensing device (26) that measures current passing through an IC (24), and a temperature control apparatus (28) that measures a surface temperature of the IC (24). The device further includes an electronic controller (30) that calculates the power consumed by the IC (24) according to the measured current and adjusts the temperature of a heater or cooler (28) responsive to the measured surface temperature and power consumption.
摘要翻译：提供了一种装置和方法，其优选地组合温度感测和预测以用于集成电路的更精确的温度控制。 IC温度感测和预测装置（20）包括测量通过IC（24）的电流的电流感测装置（26）和测量IC（24）的表面温度的温度控制装置（28）。该装置还包括电子控制器（30），该电子控制器根据所测量的电流来计算由IC（24）消耗的功率，并响应于测量的表面温度和功率消耗来调节加热器或冷却器（28）的温度。

2. 发明申请

WO2005084328A3 BURN-IN TESTING APPARATUS AND METHOD 审中-公开
标题翻译：燃烧测试装置和方法
公开(公告)号：WO2005084328A3
公开(公告)日：2005-12-22
申请号：PCT/US2005006724
申请日：2005-02-28
申请人： WELLS CTI LLC , LOPEZ CHRISTOPHER A , DENHEYER BRIAN J , KUENSTER GORDON B
发明人： LOPEZ CHRISTOPHER A , DENHEYER BRIAN J , KUENSTER GORDON B
IPC分类号： G01K1/02 , G01K1/16 , G01R1/04 , G01R31/02
CPC分类号： G01R1/0458 , G01K1/16
摘要： An integrated circuit (IC) package testing apparatus (Figure 5) integrates a temperature sensor (48), heater (or cooler) (44), and controller (42) within a single modular unit (22). The controller is a microprocessor embedded within the modular unit in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket.
摘要翻译：集成电路（IC）封装测试装置（图5）在单个模块单元（22）内集成了温度传感器（48），加热器（或冷却器）（44）和控制器（42）。控制器是嵌入在与传感器和加热器通信的模块化单元内的微处理器。控制器允许用户将控制器输入选定的测试温度。每个IC封装的测试温度由控制器独立控制。该模块可轻松地从开放式插座上安装和拆卸。

3. 发明申请

WO2007016038A3 TEMPERATURE CONTROL IN IC SOCKETS 审中-公开
标题翻译： IC插座温度控制
公开(公告)号：WO2007016038A3
公开(公告)日：2007-11-22
申请号：PCT/US2006028705
申请日：2006-07-24
申请人： WELLS CTI LLC , LOPEZ CHRISTOPHER A
发明人： LOPEZ CHRISTOPHER A
IPC分类号： G01R31/26
CPC分类号： G01R1/0458 , G01R31/2874
摘要： One embodiment discloses a system for testing IC packages, comprising a plurality of IC testing socket bases configured to receive a plurality of IC packages. A plurality of IC testing socket lid comprises a temperature sensor thermally contacting and measuring a surface temperature of the IC package. A heater or cooler directly contacts the IC package and an electronic controller receives signals from the temperature sensor. The electronic controller is programmed to change the temperature of the heater or cooler responsive to the measured surface temperature of the IC package. A plurality of cooling devices are arranged to individually remove heat generate by each of the plurality of IC packages. The electronic controller in each IC testing socket lid is further programmed to control a corresponding cooling device to maintain the surface temperature of one of the plurality of IC packages.
摘要翻译：一个实施例公开了一种用于测试IC封装的系统，包括被配置为接收多个IC封装的多个IC测试插座底座。多个IC测试插座盖包括热接触和测量IC封装的表面温度的温度传感器。加热器或冷却器直接接触IC封装，电子控制器接收来自温度传感器的信号。电子控制器被编程为响应于IC封装的测量表面温度来改变加热器或冷却器的温度。多个冷却装置被布置成单独地去除由多个IC封装中的每一个产生的热量。每个IC测试插座盖中的电子控制器进一步被编程为控制对应的冷却装置以维持多个IC封装之一的表面温度。

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