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2. 发明申请

WO2007036922A1 AN INTEGRATED ELECTRONIC SENSOR 审中-公开
标题翻译：集成电子传感器
公开(公告)号：WO2007036922A1
公开(公告)日：2007-04-05
申请号：PCT/IE2006/000107
申请日：2006-10-02
申请人： CUMMINS, Timothy
发明人： CUMMINS, Timothy
IPC分类号： G01N27/22
CPC分类号： G01N27/223
摘要： A single chip wireless sensor (1) comprises a microcontroller (2) connected to a transmit/receive interface (3), which is coupled to a wireless antenna (4) by an L-C matching circuit. The sensor (1) senses gas or humidity and temperature. The device (1) is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process. A Low-K material (57) with an organic polymer component is spun onto the wafer to form a top layer incorporating also sensing electrodes (60). This material is cured at 300°C, which is much lower than CVD temperatures. The polyimide when cured becomes thermoset, and the lower mass- to-volume ratio resulting in K, its dielectric constant, reducing to 2.9. The thermoset dielectric, while not regarded as porous in the conventional sense, has sufficient free space volume to admit enough gas or humidity for sensing.
摘要翻译：单芯片无线传感器（1）包括连接到发射/接收接口（3）的微控制器（2），其通过L-C匹配电路耦合到无线天线（4）。传感器（1）感测气体或湿度和温度。器件（1）是在单个工艺中制造的集成芯片，其中电子器件和传感器部件都使用标准CMOS处理技术制造，其被应用于在集成过程中实现电子和感测部件。将具有有机聚合物组分的低K材料（57）旋转到晶片上以形成还具有感测电极（60）的顶层。该材料在300℃下固化，这远远低于CVD温度。固化时的聚酰亚胺变得热固化，并且导致K的较低的质量 - 体积比其介电常数降低到2.9。热固性电介质虽然在传统意义上不被认为是多孔的，但具有足够的自由空间体积以允许足够的气体或湿度用于感测。

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