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1. 发明申请

WO1997005561A1 MEDIUM PROCESSOR AND MEDIUM PROCESSING METHOD 审中-公开
标题翻译：中间处理器和中间处理方法
公开(公告)号：WO1997005561A1
公开(公告)日：1997-02-13
申请号：PCT/JP1996002150
申请日：1996-07-30
申请人： FUJITSU LIMITED , EGUCHI, Shinichi , KATSUMATA, Yutaka , CHIBA, Koichi , MATSUNO, Hideki , NAGANO, Yoshihiro , USHITA, Kazuhide , KAMATA, Hideo , MATSUHASHI, Tomohiro , INAOKA, Hideyuki , WATANABE, Eiichi , NAOI, Satoshi , SAKANE, Shunji , KOBARA, Katsutoshi , YAMAMOTO, Kazunori , WATANABE, Kazuhito , KIJIMA, Yoshiyuki , YAMAZAKI, Yoshinori , MACHIDA, Yasutaka
发明人： FUJITSU LIMITED
IPC分类号： G06K09/20
CPC分类号： G06K9/00469 , G06K9/00449 , G06K9/033
摘要： A device for processing a medium which is suitable for processing slips and documents in, for example, financial organs. A medium processing device (30) which recognizes information based on an image (19) read from a medium on which the information is recorded in an arbitrary format is provided with a means (2) which extracts the feature of the medium including the format from the image data (19) and specifies the position at which the information to be recognized is recorded from the feature and an image recognizing means (3) which recognizes the information by recognizing the image (19) at the position specified by the means (2). The device (30) processes documents and slips such as privately issued slips having various formats.
摘要翻译：用于处理适合于处理例如金融机构中的单据和文件的介质的装置。基于从其中以任意格式记录信息的介质读取的图像（19）识别信息的介质处理设备（30）提供了一种装置（2），其提取包括格式的介质的特征图像数据（19）并且指定从特征记录要识别的信息的位置和通过在由装置（2）指定的位置处识别图像（19）来识别信息的图像识别装置（3））。设备（30）处理诸如具有各种格式的私人签发的单据和单据。

2. 发明申请

WO1996028729A1 DEVICE FOR EVALUATING CLEANLINESS OF METAL AND METHOD THEREFOR 审中-公开
标题翻译：用于评估金属清洁度的装置及其方法
公开(公告)号：WO1996028729A1
公开(公告)日：1996-09-19
申请号：PCT/JP1996000650
申请日：1996-03-14
申请人： NIPPON STEEL CORPORATION , UMEZAWA, Kazushige , SUZUKI, Tokio , CHIBA, Koichi , UEMORI, Ryuji , TOH, Takehiko , KONDO, Hiroyuki , FUCHIGAMI, Katsuhiro , TAKEUCHI, Eiichi , WAKOH, Masamitsu , ONO, Akihiro
发明人： NIPPON STEEL CORPORATION
IPC分类号： G01N33/20
CPC分类号： G01N33/206 , G01N33/20 , Y10T436/20 , Y10T436/25375
摘要： In order to rapidly and inexpensively evaluate cleanliness of a metal with a good representativeness when an amount, composition and the like of non-metallic inclusion particles existent in a metal and leading to defective products are to be evaluated based on samples picket up during the manufacture of the metal, an amount of non-metallic inclusion is identified by levitation melting metallic pieces for a predetermined period of time by means of a cold crucible levitation melting device, discharging non-metallic inclusion particles existent in the metal to a melting body surface, and measuring or analyzing amounts of elements, which constitute the non-metallic inclusion particles, by subjecting a curved and non-flat surface of a sample after solidification to direct analysis, which is performed based on a fluorescent X-ray analyzing method using an energy dispersion type spectrometer, and other chemical or physical measurement.
摘要翻译：为了在金属中存在非金属夹杂物的量，组成等而导致不合格产品的情况下，以制造过程中加样的样品进行评价，为了快速且廉价地评价具有良好代表性的金属的清洁度的金属，通过冷坩埚悬浮熔融装置将熔融金属片悬浮熔融预定时间来鉴定非金属夹杂物的量，将金属中存在的非金属夹杂物颗粒排出到熔化体表面，并且通过使固化后的试样的弯曲和非平坦表面进行直接分析来测量或分析构成非金属夹杂物颗粒的量，这是基于使用能量的荧光X射线分析方法进行的分散型光谱仪等化学或物理测量。

3. 发明申请

WO1988005250A1 METHOD AND APPARATUS FOR SOLDERING ELECTRONIC COMPONENT 审中-公开
标题翻译：焊接电子元件的方法和装置
公开(公告)号：WO1988005250A1
公开(公告)日：1988-07-14
申请号：PCT/JP1987001049
申请日：1987-12-28
申请人： KABUSHIKI KAISHA TOSHIBA , CHIBA, Koichi
发明人： KABUSHIKI KAISHA TOSHIBA
IPC分类号： H05K03/34
CPC分类号： B23K26/10 , B23K1/0056 , B23K2101/42 , H05K3/3421 , H05K3/3494 , H05K13/0413 , H05K13/0465 , H05K2201/10689 , H05K2201/10984 , H05K2203/107 , Y02P70/613 , Y10T29/49131 , Y10T29/49144
摘要： Soldering method wherein a high-energy beam such as a laser beam is projected onto different lead terminal arrays of electronic components, the beam being projected in a scanning manner a plurality of times two-dimensionally and continuously. The invention further relates to a soldering apparatus comprising a mechanism for holding an electronic component by the tip thereof, a rotary drive mechanism (27) which turns said electronic component holding mechanism so that the position of the electronic component in the rotational direction is brought into agreement with a practical mounting position on the circuit board, holding unit-drive mechanisms (21, 22, 25) that move the electronic component-holding mechanism three-dimensionally, beam radiation mechanisms (41, 42) for irradiating the surface of the circuit board with high energy, beam radiation angle change mechanisms (53, 54) for changing the radiation angle of the high-energy beam emitted from the beam radiation mechanisms relative to the circuit board, and a beam scanning controller (47) which controls the beam radiation angle change mechanisms such that the high-energy beam scans a predetermined lead terminal array of the electronic components mounted on the circuit board a predetermined number of times. Using this apparatus, the soldering is effected under the conditions where the temperature rise near the lead terminals and the temperature distribution are uniformalized.
摘要翻译：其中将诸如激光束的高能量束投射到电子部件的不同引线端子阵列上的焊接方法，该束以二维连续的扫描方式多次投影。本发明还涉及一种焊接装置，其特征在于，包括用于通过其末端保持电子部件的机构，旋转驱动机构（27），其使所述电子部件保持机构转动，使得所述电子部件沿旋转方向的位置进入与电路板上的实际安装位置一致，保持用于三维地移动电子部件保持机构的保持单元驱动机构（21,22,25），用于照射电路表面的光束辐射机构（41,42）具有高能量的光束辐射角度变化机构（53,54），用于改变从光束辐射机构相对于电路板发射的高能束的辐射角;以及光束扫描控制器（47），其控制光束辐射角度改变机构，使得高能束扫描安装在电路蟒蛇上的电子部件的预定引线端子阵列 rd预定次数。使用该装置，在引线端子附近的温度升高和温度分布均匀化的条件下进行焊接。

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