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1. 发明申请

WO2008115755A3 A TESTING METHOD USING A SCALABLE PARAMETRIC MEASUREMENT MACRO 审中-公开
标题翻译：使用可扩展参数测量的测试方法
公开(公告)号：WO2008115755A3
公开(公告)日：2009-01-08
申请号：PCT/US2008056792
申请日：2008-03-13
申请人： IBM , BICKFORD JEANNE P , GOSS JOHN R , HABIB NAZMUL , MCMAHON ROBERT J
发明人： BICKFORD JEANNE P , GOSS JOHN R , HABIB NAZMUL , MCMAHON ROBERT J
IPC分类号： G01R31/26
CPC分类号： G01R31/2894 , G01R31/2831 , G01R31/30
摘要： Disclosed are testing method embodiments in which, during post- manufacture testing, parametric measurements are taken from on-chip parametric measurement elements and used to optimize manufacturing in-line parametric control learning and/or to optimize product screening processes. Specifically, these post-manufacture parametric measurements can be used to disposition chips without shipping out non-conforming products, without discarding conforming products, and without requiring high cost functional tests. They can also be used to identify yield sensitivities to parametric variations from design and to provide feedback for manufacturing line improvements based on the yield sensitivities. Additionally, a historical database regarding the key parameters that are monitored at both the fabrication and post- fabrication levels can be used to predict future yield and, thereby, to preemptively improve the manufacturing line and/or also to update supply chain forecasts.
摘要翻译：公开了测试方法实施例，其中在后制造测试期间，参数测量取自片上参数测量元件，并用于优化制造在线参数控制学习和/或优化产品筛选过程。具体来说，这些后期制造参数测量可用于配置芯片，而不会丢弃不合格的产品，而不会丢弃符合要求的产品，并且不需要高成本的功能测试。它们也可以用于识别来自设计的参数变化的产量敏感性，并且基于产量灵敏度为制造线改进提供反馈。此外，关于在制造和制造后水平上监测的关键参数的历史数据库可用于预测未来产量，从而预先改进生产线和/或更新供应链预测。

2. 发明申请

WO2008115755A2 A TESTING METHOD USING A SCALABLE PARAMETRIC MEASUREMENT MACRO 审中-公开
标题翻译：使用可扩展参数测量的测试方法
公开(公告)号：WO2008115755A2
公开(公告)日：2008-09-25
申请号：PCT/US2008/056792
申请日：2008-03-13
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BICKFORD, Jeanne, P. , GOSS, John, R. , HABIB, Nazmul , MCMAHON, Robert, J.
发明人： BICKFORD, Jeanne, P. , GOSS, John, R. , HABIB, Nazmul , MCMAHON, Robert, J.
IPC分类号： G01R31/26
CPC分类号： G01R31/2894 , G01R31/2831 , G01R31/30
摘要： Disclosed are testing method embodiments in which, during post- manufacture testing, parametric measurements are taken from on-chip parametric measurement elements and used to optimize manufacturing in-line parametric control learning and/or to optimize product screening processes. Specifically, these post-manufacture parametric measurements can be used to disposition chips without shipping out non-conforming products, without discarding conforming products, and without requiring high cost functional tests. They can also be used to identify yield sensitivities to parametric variations from design and to provide feedback for manufacturing line improvements based on the yield sensitivities. Additionally, a historical database regarding the key parameters that are monitored at both the fabrication and post- fabrication levels can be used to predict future yield and, thereby, to preemptively improve the manufacturing line and/or also to update supply chain forecasts.
摘要翻译：公开了测试方法实施例，其中在后制造测试期间，参数测量取自片上参数测量元件，并用于优化制造在线参数控制学习和/或优化产品筛选过程。具体来说，这些后期制造参数测量可用于配置芯片，而不会丢弃不合格的产品，而不会丢弃符合要求的产品，并且不需要高成本的功能测试。它们也可以用于识别来自设计的参数变化的产量敏感性，并且基于产量灵敏度为制造线改进提供反馈。此外，关于在制造和制造后水平上监测的关键参数的历史数据库可用于预测未来产量，从而预先改进生产线和/或更新供应链预测。

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