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1. 发明申请

WO2005116671A3 INCREASE PRODUCTIVITY AT WAFER TEST USING PROBE RETEST DATA ANALYSIS 审中-公开
标题翻译：使用探针重复数据分析在波形测试中提高生产力
公开(公告)号：WO2005116671A3
公开(公告)日：2006-10-26
申请号：PCT/US2005019267
申请日：2005-05-25
申请人： IBM , BALCHIUNAS AKIKO F
发明人： BALCHIUNAS AKIKO F
IPC分类号： G01R31/26 , B07C5/344 , G01R27/28 , G01R31/00 , G01R31/14 , G01R31/28
CPC分类号： B07C5/344 , G01R31/2831
摘要： Disclosed is a method and system for wafer/probe testing of integrated circuit devices after manufacture. The invention begins by testing an initial group of devices (e.g., integrated circuit chips) to produce an initial failing group of devices that failed the testing. The devices in the initial failing group are identified by type of failure. Then, the invention retests the devices in the initial failing group to identify a retested passing group of devices that passed the retesting (100). Nest, the invention analyzes the devices in the retested passing group (102) which allows the invention to produce statistics regarding the likelihood that a failing device that failed the initial testing will pass the retesting according to the type of failure (104). Then, the invention evaluates these statistics to determine which types of failures have retest passing rates above a predetermined threshold (106, 108). From this, the invention produces a database comprising an optimized retest table listing the types of defects that are approved for retesting (112).
摘要翻译：公开了制造后的集成电路器件的晶片/探针测试的方法和系统。本发明通过测试初始的一组设备（例如，集成电路芯片）开始，以产生测试失败的初始故障组的设备。初始故障组中的设备由故障类型确定。然后，本发明重新测试初始故障组中的设备，以识别经过重新测试（100）的重新测试的通过的设备组。 Nest，本发明分析了重新测试的通过组（102）中的设备，其允许本发明产生关于根据故障类型而使初始测试失败的故障设备将通过重新测试的可能性的统计（104）。然后，本发明评估这些统计数据，以确定哪些类型的故障具有高于预定阈值（106,108）的重测通过率。由此，本发明产生一个数据库，该数据库包括列出被许可用于再测试的缺陷类型的优化重测表（112）。

2. 发明申请

WO2005116671A2 INCREASE PRODUCTIVITY AT WAFER TEST USING PROBE RETEST DATA ANALYSIS 审中-公开
标题翻译：使用探针重复数据分析在波形测试中提高生产力
公开(公告)号：WO2005116671A2
公开(公告)日：2005-12-08
申请号：PCT/US2005/019267
申请日：2005-05-25
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BALCHIUNAS, Akiko, F.
发明人： BALCHIUNAS, Akiko, F.
IPC分类号： G01R31/14
CPC分类号： B07C5/344 , G01R31/2831
摘要： Disclosed is a method and system for wafer/probe testing of integrated circuit devices after manufacture. The invention begins by testing an initial group of devices ( e.g., integrated circuit chips) to produce an initial failing group of devices that failed the testing. The devices in the initial failing group are identified by type of failure. Then, the invention retests the devices in the initial failing group to identify a retested passing group of devices that passed the retesting (100). Nest, the invention analyzes the devices in the retested passing group (102) which allows the invention to produce statistics regarding the likelihood that a failing device that failed the initial testing will pass the retesting according to the type of failure (104). Then, the invention evaluates these statistics to determine which types of failures have retest passing rates above a predetermined threshold (106, 108). From this, the invention produces a database comprising an optimized retest table listing the types of defects that are approved for retesting (112).
摘要翻译：公开了制造后的集成电路器件的晶片/探针测试的方法和系统。本发明通过测试初始的一组设备（例如，集成电路芯片）开始，以产生测试失败的初始故障组的设备。初始故障组中的设备由故障类型确定。然后，本发明重新测试初始故障组中的设备，以识别经过重新测试（100）的重新测试的通过的设备组。 Nest，本发明分析了重新测试的通过组（102）中的设备，其允许本发明产生关于根据故障类型而使初始测试失败的故障设备将通过重新测试的可能性的统计（104）。然后，本发明评估这些统计数据，以确定哪些类型的故障具有高于预定阈值（106,108）的重测通过率。由此，本发明产生一个数据库，该数据库包括列出被许可用于再测试的缺陷类型的优化重测表（112）。

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