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1. 发明申请

WO2008013377A9 CHEMICAL MECHANICAL POLISHING PADS COMPRISING LIQUID ORGANIC MATERIAL CORE ENCAPSULATED IN POLYMER SHELL AND METHODS FOR PRODUCING THE SAME 审中-公开
标题翻译：包含聚合物壳中的液体有机材料的化学机械抛光垫及其制造方法
公开(公告)号：WO2008013377A9
公开(公告)日：2008-11-20
申请号：PCT/KR2007003513
申请日：2007-07-20
申请人： SKC CO LTD , JUN SUNG-MIN , LIM JONG-SOO , BAE SEUNG-HUN , LEE JU-YEOL , PARK IN-HA
发明人： JUN SUNG-MIN , LIM JONG-SOO , BAE SEUNG-HUN , LEE JU-YEOL , PARK IN-HA
IPC分类号： B24D3/00
CPC分类号： B24B37/24 , B24D3/32
摘要： There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130 0C or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.
摘要翻译：提供了一种化学机械抛光（CMP）垫，其包括在聚合物基质中包封沸点和分解点为130℃以上的液体有机材料的聚合物壳的芯，所述CMP垫具有形成的开孔通过芯在其研磨表面上，以及制造CMP垫的方法。具有高硬度和高密度的CMP垫提高了晶片的抛光效率和平坦度，并且保持芯的均匀尺寸，从而制造具有高抛光效率和稳定的抛光性能的焊盘。

2. 发明申请

WO2006070960A1 COVERING COMPOSITE FOR FIRE RESISTANCE AND SOUND ABSORPTION 审中-公开
标题翻译：覆盖复合材料的耐火和声吸收
公开(公告)号：WO2006070960A1
公开(公告)日：2006-07-06
申请号：PCT/KR2004/003552
申请日：2004-12-31
申请人： KYUNG DONG CERATECH CO., LTD. , OH, Suk-Ho , RYOO, Gi-Hong , BAE, Seung-Hun
发明人： OH, Suk-Ho , RYOO, Gi-Hong , BAE, Seung-Hun
IPC分类号： C04B28/00 , C09D5/18 , C09K21/00
CPC分类号： C04B28/00 , C04B2111/00482 , C04B2111/00577 , C04B2111/285 , C04B2111/34 , C04B2111/52 , C09D5/18 , C09K21/14 , E04B1/944 , Y02W30/97 , C04B7/323 , C04B14/18 , C04B14/24 , C04B14/386 , C04B18/24 , C04B2103/20 , C04B2103/30 , C04B2103/44 , C04B2103/63 , C04B2103/69 , C04B14/16 , C04B14/202 , C04B16/0616 , C04B16/08 , C04B22/064 , C04B2103/40
摘要： The present invention relates to a fire-resistant and sound-absorbing covering composition which contains gypsum, cement and a porous lightweight aggregate and is either coated on the surface of a steel-frame structure in building so as to prevent reductions in the strength and yield strength of the steel-frame structure caused by high-temperature heat during a fire, or coated on the wall or ceiling of the wall so as to impart sound insulation. The composition comprises 3-50% by weight of a lightweight aggregate, 30-80% by weight of a binder, 2-30% by weight of a heat-absorbing and shrinkagereducing material, 2-20% by weight of a general or flame-retardant carbonizable sound-absorbing fiber, and 0.1-30% by weight of additives. Particularly, the composition is characterized by containing at least one selected from a calcium sulfoaluminate compound (CSA compound), quick lime and calcined alunite, as a heatabsorbing material for improving heat resistance and a shrinkage-reducing material capable of reducing shrinkage caused by drying. After spray coating, the composition does not show drying shrinkage, cracking and detachment. During a fire, the composition delays the transfer of heat to the steel frames, and microcracking in the composition is induced so as to prevent large cracks in the composition and the detachment of the composition.
摘要翻译：本发明涉及一种含有石膏，水泥和多孔轻质骨料的耐火和吸声覆盖组合物，并且涂覆在建筑物的钢框架结构的表面上，以防止强度和屈服的降低在火灾期间由高温热引起的钢框架结构的强度，或涂覆在壁的墙壁或天花板上以提供隔音。组合物包含3-50重量％的轻质骨料，30-80重量％的粘合剂，2-30重量％的吸热和收缩减少材料，2-20重量％的一般或火焰易燃的可碳化吸音纤维和0.1-30重量％的添加剂。特别地，该组合物的特征在于，含有选自硫磺铝酸钙化合物（CSA化合物），生石灰和煅烧的铝酸钠中的至少一种作为改善耐热性的耐热吸收材料和能够减少由干燥引起的收缩的收缩减少材料。喷涂后，该组合物不显示干燥收缩，开裂和脱离。在火灾期间，组合物延迟热转移到钢框架，并且引起组合物中的微裂纹，以防止组合物中的大的裂纹和组合物的脱离。

3. 发明申请

WO2008013377A1 CHEMICAL MECHANICAL POLISHING PADS COMPRISING LIQUID ORGANIC MATERIAL CORE ENCAPSULATED IN POLYMER SHELL AND METHODS FOR PRODUCING THE SAME 审中-公开
标题翻译：化学机械抛光垫，包括包封在聚合物外壳中的液态有机材料核心及其制造方法
公开(公告)号：WO2008013377A1
公开(公告)日：2008-01-31
申请号：PCT/KR2007/003513
申请日：2007-07-20
申请人： SKC CO., LTD. , JUN, Sung-Min , LIM, Jong-Soo , BAE, Seung-Hun , LEE, Ju-Yeol , PARK, In-Ha
发明人： JUN, Sung-Min , LIM, Jong-Soo , BAE, Seung-Hun , LEE, Ju-Yeol , PARK, In-Ha
IPC分类号： B24D3/00
CPC分类号： B24B37/24 , B24D3/32
摘要： There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130 0C or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.
摘要翻译：提供了一种化学机械抛光（CMP）垫，其包括在聚合物基质中封装沸点和分解点之一为130℃或更高的液体有机材料的聚合物壳的核心，所述CMP垫具有形成的开孔通过在其抛光表面上的芯体以及制造CMP垫的方法。具有高硬度和高密度的CMP垫提高了晶片的抛光效率和平坦度，并且保持了芯的均匀尺寸，从而产生具有高抛光效率和稳定抛光性能的垫。

4. 发明申请

WO2007018391A1 CHEMICAL MECHANICAL POLISHING APPARATUS 审中-公开
标题翻译：化学机械抛光装置
公开(公告)号：WO2007018391A1
公开(公告)日：2007-02-15
申请号：PCT/KR2006/003098
申请日：2006-08-07
申请人： BAE, Seung-Hun
发明人： BAE, Seung-Hun
IPC分类号： H01L21/304
CPC分类号： B24B37/042 , B24B49/16
摘要： Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure between the polishing pad and the wafer when the polishing pad is compressed onto the wafer, a support physical property controller to generate control signals corresponding to the contact pressure detected by the contact pressure sensor, a variable physical property support being adapted to come into close contact with the polishing pad and having physical properties varied in response to the control signals generated by the support physical property controller, and a rotational table to hold the variable physical property table.
摘要翻译：本文公开了一种化学机械抛光装置。该装置包括载体，用于保持晶片并能够提升，降低和旋转通过降低载体以抛光晶片而压缩在晶片上的抛光垫;接触压力传感器，用于检测抛光垫和所述晶片在所述抛光垫被压缩到所述晶片上时，支撑物理性能控制器，用于产生对应于由所述接触压力传感器检测到的接触压力的控制信号;可变物理性质支撑件适于与所述抛光垫紧密接触;以及具有响应于由支撑物理属性控制器产生的控制信号而变化的物理特性，以及用于保持可变物理属性表的旋转表。

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