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    • 10. 发明申请
    • WAFER BOND STRENGTH EVALUATION APPARATUS
    • WAFER BOND强度评估装置
    • WO2004072585A3
    • 2004-12-02
    • PCT/US2004003602
    • 2004-02-05
    • UNIV ARIZONAALFORD TERRY LMITAN MARTIN
    • ALFORD TERRY LMITAN MARTIN
    • G01N3/00G01N3/04G01N19/04G01N21/95G01L1/24G01N3/10
    • G01N3/04G01N19/04G01N21/9501G01N2203/0066G01N2203/0494
    • An apparatus and method for measuring bond strength of a bonded wafer that allows for more reliable and reproducible measurements, thereby allowing a better comparison of bond strengths of various wafers. A wafer receptacle (2) holds the bonded wafer (28) to be measured securely in place. A Z-axis adjustment device (10) with precision actuator is adjusted to align a blade with bond interface of the bonded wafer. An X-axis adjustment device (8) with precision actuator (18) connected to a spring is adjusted to introduce the blade into bond interface creating a crack, the length of which can be measured and used to determine bond strength. The stability and precision introduced by the Z-axis and X-axis adjustment devices also increase the reliability and reproducibility of the bond strength measurement.
    • 用于测量接合晶片的结合强度的装置和方法,其允许更可靠和可再现的测量,从而允许更好地比较各种晶片的结合强度。 晶片接收器(2)将要测量的接合晶片(28)牢固地保持就位。 调整具有精​​密致动器的Z轴调节装置(10)以使刀片与键合晶片的结合界面对齐。 调整连接到弹簧的具有精密致动器(18)的X轴调节装置(8),以将刀片引入接合界面,产生裂纹,其长度可以被测量并用于确定粘结强度。 Z轴和X轴调节装置引入的稳定性和精度也提高了粘结强度测量的可靠性和可重复性。