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1. 发明申请

WO2022248027A1 PARAMETER TUNING FOR POWER PLANT CONTROLLERS 审中-公开
公开(公告)号：WO2022248027A1
公开(公告)日：2022-12-01
申请号：PCT/EP2021/063916
申请日：2021-05-25
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： DAS, Suranjana , M P, Vinod
IPC分类号： H02J3/38 , G05B13/04
摘要： A parameter tuning system (208), a power plant controller (PPC) (200), and a method employing the parameter tuning system (208) for tuning network parameters of two or more PPCs (200) deployable in power generation plant(s) (100), are provided. The parameter tuning system (208) obtains the network parameters from each of the two or more PPCs (200), determines tuning network parameters from the network parameters, based on tuning factor(s) associated with the power generation plant(s) (100), determines, from the two or more PPCs (200), a major PPC (200) for fine tuning, and fine tunes the major PPC (200) with the tuning network parameters.

2. 发明申请

WO2022180108A1 SWITCHING DEVICE FOR ELECTRIC POWER DISTRIBUTION 审中-公开
公开(公告)号：WO2022180108A1
公开(公告)日：2022-09-01
申请号：PCT/EP2022/054546
申请日：2022-02-23
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： CHIKHALE, Ravindra , JUNG, Wolfgang , SONAWANE, Mahesh , SUNDIKAR, Sagar
IPC分类号： H01H33/666 , H01H33/56 , H01H31/00 , H01H33/14 , H01H33/662 , H02B13/035 , H02B13/045
摘要： A switching device (100) for opening and closing a circuit is provided. The switching device comprises a bus-bar tank (110) having a first end (110a) and a first bushing (122) coupled to the first end of the bus-bar tank. The switching device also comprises a circuit- breaker tank (112) having a first end (112a). The switching device further comprises a stationary contact (126) supported by the first bushing. The switching device also comprises a circuit- breaker arrangement (130) arranged inside the circuit-breaker tank. Herein, a fastening arrangement (124) is adapted to establish physical connection between the first end of the circuit-breaker tank and the first bushing, to removably assemble the bus-bar tank and the circuit-breaker tank. Further, the circuit-breaker arrangement is adapted to extend into the first bushing, and to be disposed in contact with the stationary contact therein, when the bus-bar tank is assembled to the circuit-breaker tank.

3. 发明申请

WO2022180049A1 SWITCHING DEVICE FOR ELECTRIC POWER DISTRIBUTION 审中-公开
公开(公告)号：WO2022180049A1
公开(公告)日：2022-09-01
申请号：PCT/EP2022/054424
申请日：2022-02-22
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： BAVIKAR, Kapil , CHIKHALE, Ravindra , INAMDAR, Sharvari , SHINDE, Deepak , SONAWANE, Mahesh , TIVARE, Pradip
IPC分类号： H01H33/56 , H01H33/12 , H01H31/00 , H01H33/14 , H01H33/666 , H01H33/662 , H02B13/035 , H02B13/045
摘要： A switching device (100) for opening and closing a circuit is provided. The switching device comprises a bus-bar tank (110) and a circuit-breaker tank (112). The switching device also comprises a bushing (122) arranged between and coupling the bus-bar tank and the circuit- breaker tank. The switching device further comprises a stationary contact (126, 800) mounted to the bushing by a fixing arrangement (128). The stationary contact has a first end (126a) and a second end (126b), with the first end disposed in the bus-bar tank. The switching device further comprises a circuit-breaker arrangement (130) arranged inside the circuit-breaker tank. The circuit-breaker arrangement is adapted to be disposed in contact with the second end of the stationary contact. Herein, the stationary contact is at least partially accommodated inside the bushing, and the fixing arrangement is dielectrically shielded inside the bushing.

4. 发明申请

WO2021191368A1 SYSTEM AND METHOD FOR MANAGEMENT OF AN ASSET 审中-公开
公开(公告)号：WO2021191368A1
公开(公告)日：2021-09-30
申请号：PCT/EP2021/057783
申请日：2021-03-25
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： VENKATESWARAN, Somam Viswanathan , BHAMIDIPATI, Suryanarayana
IPC分类号： G06Q10/06 , G06Q10/00 , G06Q10/20
摘要： The present disclosure relates to a system (100) and method for management of an asset (105). The method comprises obtaining, by a processing unit (125), a fingerprint associated with at least one component of the asset (105) from a source (195). The fingerprint comprises a response of the component to a stimulus and a unique identifier associated with the component. The method further comprises identifying baseline data associated with the component from a distributed database. The method further comprises verifying the asset (105) based on the baseline data and the fingerprint associated with the component.

5. 发明申请

WO2018233840A1 OPTOELECTRONIC COMPONENT 审中-公开
公开(公告)号：WO2018233840A1
公开(公告)日：2018-12-27
申请号：PCT/EP2017/065452
申请日：2017-06-22
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： BEH, Sok Gek , SOONG, Chee Weng , ZAINORDIN, Mohd Fauzi , WONG, Teik Yee
IPC分类号： H01L25/16 , H01L33/60
CPC分类号： H01L25/167 , H01L33/60
摘要： The invention refers to an optoelectronic component with a housing comprising an insulating material, a first metallic lead frame and a second metallic lead frame. The housing comprises a first cavity and a second cavity, wherein a first surface of the first lead frame is located at a first bottom of the first cavity and wherein a second surface of the second lead frame is located at a second bottom of the second cavity. A dividing wall is located between the first cavity and the second cavity. An optoelectronic chip is located on the first surface. A flow barrier is located at the first surface of the first lead frame between the optoelectronic chip and the dividing wall. A first bond wire is connected to a first contact of the optoelectronic chip and to the second lead frame. An electrical element is located within the second cavity, wherein a second bond wire is connected to a second contact of the electrical element and to the first lead frame. The second cavity is at least partially filled with a matrix material containing reflecting particles. Apart of the first bottom of the first cavity between the flow barrier and the dividing wall is at least partially covered with the matrix material containing reflecting particles.

6. 发明申请

WO2018233839A1 OPTOELECTRONIC COMPONENT 审中-公开
公开(公告)号：WO2018233839A1
公开(公告)日：2018-12-27
申请号：PCT/EP2017/065447
申请日：2017-06-22
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： BEH, Sok Gek , WONG, Wing Yew , ZAINORDIN, Mohd Fauzi
IPC分类号： H01L25/16 , H01L33/48 , H01L33/50 , H01L33/58 , H01L33/62 , H01L33/00
CPC分类号： H01L25/167 , H01L33/486 , H01L33/50 , H01L33/52 , H01L33/62 , H01L2933/005 , H01L2933/0091
摘要： The invention relates to an optoelectronic component (100) with a housing (101) comprising an insulating material, wherein the housing (101) comprises a first cavity (102) and a second cavity (103) and a first lead frame (104) and a second lead frame (105). A first surface (106) of the first lead frame (104) is arranged within a first bottom (108) of the first cavity (102) and a second bottom (109) of the second cavity (103). A second surface (107) of the second lead frame (105) is arranged within the first bottom (108) of the first cavity (102) and the second bottom (109) of the second cavity (103). A dividing wall (110) is located between the first cavity (102) and the second cavity (103). An optoelectronic chip (120) is located within the first cavity (102), which is electrically connected to the first lead frame (104) and the second lead frame (105) in the first cavity (102). An electrical element (130) is located within the second cavity (103), which is electrically connected to the first lead frame (104) and the second lead frame (105) in the second cavity (103). The electrical element (130) is located on top of the second lead frame (105) and a bond wire connects the electrical element (130) with the first lead frame (104). The bond wire is located within the second cavity (103). The second cavity (103) is at least partially filled with a matrix material (150) containing reflecting particles in a way that the matrix material (150) fully covers the electrical element (130) and the bond wire.

7. 发明申请

WO2018202280A1 PRODUCTION OF A CHIP MODULE 审中-公开
公开(公告)号：WO2018202280A1
公开(公告)日：2018-11-08
申请号：PCT/EP2017/060411
申请日：2017-05-02
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： YIP, Heng Keong
IPC分类号： H01L25/075 , H01L33/48
摘要： The invention relates to a method for producing a chip module. The method comprises providing a carrier, arranging semiconductor chips on the carrier, applying an electrically insulating material on the carrier, and structuring the carrier such that the chip module is provided. The chip module com- prises separate carrier sections produced by the structuring of the carrier. The carrier sections of the chip module are connected by means of the electrically insulating material. The invention furthermore relates to a chip module.

8. 发明申请

WO2018162076A1 OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT 审中-公开
公开(公告)号：WO2018162076A1
公开(公告)日：2018-09-13
申请号：PCT/EP2017/055674
申请日：2017-03-10
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： LIM, Keng Chong , LEOW, Ting Qiao
IPC分类号： H01L33/00 , H01L33/50
CPC分类号： H01L33/505 , H01L33/508 , H01L2933/0041
摘要： An optoelectronic semiconductor component (10) comprises a carrier (100) having an upper side (110), and an optoelectronic semiconductor chip (200) arranged on the upper side (110) of the carrier (100). A radiation emission surface (210) of the optoelectronic semiconductor chip (200) faces away from the carrier (100). A first encapsulant (300) covers the radiation emission surface (210). A thickness of the first encapsulant (300) measured in a direction (211) perpendicular to the radiation emission surface (210) is larger above a centre (220) of the radiation emission surface (210) than above a margin (230) of the radiation emission surface (210). A second encapsulant (400) is arranged above the upper side (110) of the carrier (100) and covers the first encapsulant (300) at least partially. The first encapsulant (300) comprises a first concentration of embedded phosphor particles, and the second encapsulant (400) comprises a second concentration of embedded phosphor particles.

9. 发明申请

WO2018153464A1 SENSOR ELEMENT 审中-公开
公开(公告)号：WO2018153464A1
公开(公告)日：2018-08-30
申请号：PCT/EP2017/054234
申请日：2017-02-23
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： LIM, Choon Kim , LIM, Choo Kean , GO, Jeok Pheng
IPC分类号： H01L25/16
摘要： Sensor element with a light emitting semiconductor chip, wherein the semiconductor chip is arranged with a mounting face on a mounting face of a substrate, wherein the semi conductor chip has a smaller mounting face than the substrate, wherein a border area of the mounting face of the substrate circumvents the semiconductor chip, wherein on a bottom side of the semiconductor chip electrical contacts are arranged, wherein the substrate is transparent for the radiation of the semiconductor chip, wherein the bottom side of the semi conductor chip is arranged on a mounting side of a carrier, wherein the carrier comprises further electrical contacts on the mounting side, wherein the contacts of the semiconductor chip and the contacts of the carrier are connected, wherein between the mounting side of the carrier and the border area of the substrate a sealing member is arranged, wherein the sealing member seals a sealing area between the substrate and the carrier, wherein the semiconductor chip is arranged in the sealing area, wherein a recess is arranged in the mounting side of the carrier, wherein the recess is arranged beside the semiconductor chip and within the sealing area, wherein an optoelectronic sensor is arranged in the recess.

10. 发明申请

WO2018115264A1 LIGHT EMITTING UNIT 审中-公开
公开(公告)号：WO2018115264A1
公开(公告)日：2018-06-28
申请号：PCT/EP2017/084059
申请日：2017-12-21
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： LIN-LEFEBVRE, I-Hsin , STREITEL, Reinhard , KUNDALIYA, Darshan , GEBUHR, Tobias
IPC分类号： H01L33/50 , H01L33/00 , H01L33/54
CPC分类号： H01L33/508 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/16245 , H01L2224/48091 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
摘要： A light emitting unit includes a light emitting semiconductor chip and a wavelength converter for the light of the semiconductor chip. The wavelength converter has a substrate with a first surface. The first surface includes a rough surface with recesses. The wavelength converter has a conversion layer that is arranged on the first surface of the substrate. The conversion layer has luminescent materials. A connecting layer is arranged between the wavelength converter and a light emitting surface of the light emitting semiconductor chip.

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