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    • 6. 发明申请
    • TEST PADS, METHODS AND SYSTEMS FOR MEASURING PROPERTIES OF A WAFER, AND SYSTEMS AND METHODS FOR CONTROLLING DEPOSITION OF A CHARGE ON A WAFER FOR MEASUREMENT OF ONE OR MORE ELECTRICAL PROPERTIES OF THE WAFER
    • 用于测量波形特性的测试垫,方法和系统,以及用于控制在波形上沉积电荷以测量一个或更多个电流特性的系统和方法
    • WO2007022538A2
    • 2007-02-22
    • PCT/US2006/032822
    • 2006-08-21
    • KLA-TENCOR TECHNOLOGIES CORPORATIONSHI, JianouZHANG, XiafangPEI, ShiyouHUANG, Shu, ChunYEH, DennisRZEPIELA, Jeffrey, A.FENG, YipingKHAN, AhmadKAGAN, AlexanderEDELSTEIN, Sergio
    • SHI, JianouZHANG, XiafangPEI, ShiyouHUANG, Shu, ChunYEH, DennisRZEPIELA, Jeffrey, A.FENG, YipingKHAN, AhmadKAGAN, AlexanderEDELSTEIN, Sergio
    • G01R31/26
    • G01R31/2831G01R31/2856H01L22/34H01L2924/0002H01L2924/00
    • Test pads, methods, and systems for measuring properties of a wafer are provided. One test pad formed on a wafer includes a test structure configured such that one or more electrical properties of the test structure can be measured. The test pad also includes a conductive layer formed between the test structure and the wafer. The conductive layer prevents structures located under the test structure between the conductive layer and the wafer from affecting the one or more electrical properties of the test structure during measurement. One method for assessing plasma damage of a wafer includes measuring one or more electrical properties of a test structure formed on the wafer and determining an index characterizing the plasma damage of the test structure using the one or more electrical properties. In addition, systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.
    • 提供了用于测量晶片性能的测试垫,方法和系统。 形成在晶片上的一个测试焊盘包括测试结构,其被配置为使得可以测量测试结构的一个或多个电特性。 测试垫还包括在测试结构和晶片之间形成的导电层。 导电层防止在测量期间位于导电层和晶片之间的测试结构下方的结构影响测试结构的一个或多个电性能。 用于评估晶片的等离子体损伤的一种方法包括测量形成在晶片上的测试结构的一个或多个电特性,并使用一个或多个电性质确定表征测试结构的等离子体损伤的指标。 此外,提供了用于控制晶片上的电荷沉积以测量晶片的一个或多个电性能的系统和方法。 一个系统包括配置成将电荷沉积在晶片上的电晕源和配置成测量电晕源内的一个或多个条件的传感器。 该系统还包括配置为基于一个或多个条件来改变电晕源的一个或多个参数的控制子系统。 另一种系统包括电晕源,其被配置为在电荷沉积期间将电荷沉积在晶片上以及布置在电晕源的放电室内的气体混合物。 气体混合物改变沉积在晶片上的电荷的一个或多个参数。
    • 10. 发明申请
    • METHODS AND SYSTEMS FOR DYNAMIC RANGE EXPANSION
    • 动态范围扩展的方法与系统
    • WO2005068971A1
    • 2005-07-28
    • PCT/US2005/001866
    • 2005-01-13
    • LUMINEX CORPORATIONROTH, Wayne, D.
    • ROTH, Wayne, D.
    • G01N15/14
    • B82Y20/00B82Y10/00G01N15/14
    • Methods and systems for expanding the dynamic range of a system are provided. One method includes splitting fluorescent light emitted by a particle into multiple light paths having different intensities, detecting the fluorescent light in the multiple light paths with different channels to generate multiple signals, and determining which of the channels is operating in a linear range based on the multiple signals. The method also includes altering the signal generated by the channel operating in the linear rang to compensate for the different intensities. Another method includes illuminating a particle in multiple illumination zones with light having different intensities and separately detecting fluorescent light emitted by the particle while located in the multiple illumination zones to generate multiple signals. The method also includes determining which of the signals is located in a linear range and altering the signal located in the linear range to compensate for the different intensities.
    • 提供了扩展系统动态范围的方法和系统。 一种方法包括将由颗粒发射的荧光分成具有不同强度的多个光路,检测具有不同通道的多个光路中的荧光以产生多个信号,以及基于以下步骤确定哪个通道在线性范围内操作 多个信号。 该方法还包括改变由在线性范围中操作的通道产生的信号以补偿不同的强度。 另一种方法包括用具有不同强度的光照射多个照明区域中的颗粒,并分别检测位于多个照明区域中的颗粒发射的荧光,以产生多个信号。 该方法还包括确定哪个信号位于线性范围内并且改变位于线性范围内的信号以补偿不同的强度。