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    • 1. 发明申请
    • CYMBAL HOLDER WITH SLOTTED THREADS AND PLUNGER
    • 带有螺纹螺纹和柱塞的CYMBAL HOLDER
    • WO2015051315A2
    • 2015-04-09
    • PCT/US2014/059155
    • 2014-10-03
    • DRUM WORKSHOP, INC.
    • SIKRA, Richard, A.
    • G10D13/06
    • G10D13/065F16B39/32
    • A clutch for use in a hi-hat percussion assembly is disclosed. The clutch can included a threaded bolt that includes slots, and a nut that includes an indexing means such as a plunger. An elastic holding means can be used to exert pressure on the indexing means, such as when the indexing means is rigid, for example. The plunger can be configured to engage a slot upon rotation of the nut to lock the nut into place. While in a locked position, unwanted displacement of the nut, including rotational displacement that may be caused by forceful and rapid movements of a drummer, can be reduced, prevented, and/or eliminated. Using a force greater than that required to simply turn the nut while in an unlocked position, the nut can be rotated to disengage the plunger from the slot and return the nut to an unlocked position.
    • 公开了一种用于踩帽式打击乐器的离合器。 离合器可以包括一个包括槽的螺栓和一个包括一个分度装置如螺柱的螺母。 例如,当分度装置是刚性的时,可以使用弹性保持装置对分度装置施加压力。 柱塞可以构造成在螺母旋转时接合槽,以将螺母锁定到位。 在锁定位置时,可以减少,防止和/或消除螺母的不期望的位移,包括由鼓手的强力和快速运动引起的旋转位移。 使用大于在解锁位置简单旋转螺母所需的力,可以旋转螺母以使柱塞与槽脱离并将螺母返回到解锁位置。
    • 3. 发明申请
    • LAMP WITH REMOTE LED LIGHT SOURCE AND HEAT DISSIPATING ELEMENTS
    • 具有远程LED光源和散热元件的灯
    • WO2014039405A1
    • 2014-03-13
    • PCT/US2013/057712
    • 2013-08-30
    • CREE, INC.
    • PROGL, CurtATHALYE, PraneetNEGLEY, Gerald
    • F21V29/00F21K99/00F21V3/00F21V3/04F21V29/02F21Y101/02F21Y111/00
    • F21V29/51F21K9/232F21K9/64F21V3/04F21V15/02F21V29/006F21V29/506F21V29/507F21V29/58F21V29/67F21V29/77F21V29/89F21Y2107/40F21Y2115/10
    • LED based lamps (220) and bulbs are disclosed that comprise an elevating element (224) to arrange LEDs (226) above the lamp or bulb base. The elevating element (224) can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser (228) can be arranged in relation to the LEDs (226) so at least some light from the LEDs (226) passes through the diffuser (228) and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe (224) for the elevating elements, with heat from the LEDs (226) conducting through the heat pipe (224) to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements.
    • 公开了基于LED的灯(220)和灯泡,其包括用于在灯或灯泡基座上方布置LED(226)的升降元件(224)。 升降元件(224)可以至少部分地包括导热材料。 包括散热器结构,其中升降元件热耦合到散热器结构。 可以相对于LED(226)布置漫射器(228),使得来自LED(226)的至少一些光通过扩散器(228)并分散到期望的发射图案中。 一些灯和灯泡利用用于升降元件的热管(224),其中来自LED(226)的热量通过热管(224)传导到散热器结构,其中它可以在环境中消散。 LED灯可以包括其他特征以帮助热管理并产生期望的发射图案,例如内部透光和导热材料,以及具有不同散热片布置的散热器。
    • 4. 发明申请
    • LED PACKAGE WITH ENCAPSULANT HAVING PLANAR SURFACES
    • LED包装与具有平面表面的包装
    • WO2013188189A2
    • 2013-12-19
    • PCT/US2013/044277
    • 2013-06-05
    • CREE, INC.
    • LOWES, TheodoreTARSA, Eric, J.HEIKMAN, StenKELLER, BerndREIHERZER, JesseBENJAMIN, Hormoz
    • H01L33/54
    • H01L33/54F21V9/00H01L33/502H01L33/504H01L33/505H01L33/60H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/0002H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012
    • LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.
    • 公开了紧凑且有效地发光的LED封装,并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座,以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上,在LED上,并且在密封剂内反射的光将到达转化材料,其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时,反射光现在可以逃避密封剂,从而有效地发射和更宽的发射特征。 在某些实施例中,LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂,LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系,从而在不同应用中实现更大的灵活性。