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1. 发明申请

WO2017066702A1 WIRE BOND CLEANING METHOD AND WIRE BONDING RECOVERY PROCESS 审中-公开
标题翻译： WIRE BOND清洁方法和线接合回收工艺
公开(公告)号：WO2017066702A1
公开(公告)日：2017-04-20
申请号：PCT/US2016/057215
申请日：2016-10-14
申请人： SKYWORKS SOLUTIONS, INC.
发明人： GARING, Aldrin Quinones , CAMARGO, Miguel
IPC分类号： H01L23/00 , H01L23/495 , H01L21/48
CPC分类号： H01L24/98 , H01L21/02068 , H01L21/4835 , H01L23/4952 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/799 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48465 , H01L2224/49113 , H01L2224/78301 , H01L2224/85 , H01L2224/85011 , H01L2224/85013 , H01L2224/85019 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599
摘要： Methods, systems and devices are disclosed for performing a semiconductor processing operation. In some embodiments this includes configuring a wire bonding machine to perform customized movements with a capillary tool of the wire bonding machine, etching bulk contaminants over one or more locations of a semiconductor device with the capillary tool, and applying plasma to the semiconductor device to remove residual contaminants.
摘要翻译：公开了用于执行半导体处理操作的方法，系统和设备。在一些实施例中，这包括配置引线接合机器以利用引线接合机器的毛细管工具执行定制移动，利用毛细管工具在半导体器件的一个或多个位置上蚀刻散装污染物，并且将等离子体施加到半导体器件以去除残留的污染物。

2. 发明申请

WO2016053981A1 SHIELDED RADIO-FREQUENCY MODULE HAVING REDUCED AREA 审中-公开
标题翻译：具有减少区域的屏蔽无线电频率模块
公开(公告)号：WO2016053981A1
公开(公告)日：2016-04-07
申请号：PCT/US2015/052850
申请日：2015-09-29
申请人： SKYWORKS SOLUTIONS, INC.
发明人： CHEN, Howard E. , READ, Matthew Sean
IPC分类号： H01L23/48 , H01L23/06
CPC分类号： H01L23/552 , H01L23/66 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2223/6655 , H01L2224/04042 , H01L2224/05013 , H01L2224/06181 , H01L2224/45016 , H01L2224/48105 , H01L2224/48227 , H01L2924/00014 , H01L2924/1421 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2224/43 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： Shielded radio-frequency (RF) module having reduced area. In some embodiments, an RF module can include a packaging substrate configured to receive a plurality of components, and a plurality of shielding wirebonds implemented on the packaging substrate and configured to provide RF shielding functionality for one or more regions on the packaging substrate. The packaging substrate can include a first area associated with implementation of each shielding wirebond. The RF module can further include one or more devices mounted on the packaging substrate. The packaging substrate can further include a second area associated with mounting of each of the one or more devices. Each device can be mounted with respect to a corresponding shielding wirebond such that the second area associated with the device overlaps at least partially with the first area associated with the corresponding shielding wirebond.
摘要翻译：屏蔽射频（RF）模块具有减小的面积。在一些实施例中，RF模块可以包括被配置为接收多个组件的封装衬底以及在封装衬底上实现的并被配置为为封装衬底上的一个或多个区域提供RF屏蔽功能的多个屏蔽线扣。封装衬底可以包括与每个屏蔽引线键的实施相关联的第一区域。 RF模块还可以包括安装在封装衬底上的一个或多个器件。所述包装衬底还可以包括与所述一个或多个装置中的每一个的安装相关联的第二区域。每个装置可以相对于相应的屏蔽引线键安装，使得与该装置相关联的第二区域至少部分地与与相应的屏蔽引线键合的第一区域重叠。

3. 发明申请

WO2016196189A1 SHIELDED MODULE HAVING COMPRESSION OVERMOLD 审中-公开
标题翻译：具有压缩超模的屏蔽模块
公开(公告)号：WO2016196189A1
公开(公告)日：2016-12-08
申请号：PCT/US2016/034315
申请日：2016-05-26
申请人： SKYWORKS SOLUTIONS, INC.
发明人： NGUYEN, Hoang Mong , HERRERA, Luis Eduardo , GONZALEZ FLORES, Sergio Joaquin , READ, Matthew Sean , LOBIANCO, Anthony James , OSUNA, Heliodoro
IPC分类号： H01L23/552 , H01L23/66 , H01L21/56 , H01L23/00 , H01L23/49 , H01L23/31
CPC分类号： H01L23/552 , H01L21/56 , H01L21/561 , H01L21/566 , H01L23/293 , H01L23/3121 , H01L23/49 , H01L23/66 , H01L24/29 , H01L24/43 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/97 , H01L2924/00014 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2224/45099 , H01L2224/85
摘要： A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.
摘要翻译：公开了一种用于制造射频（RF）模块的方法，所述方法包括形成或提供包括封装基板和安装在其上的RF部件的第一组件，所述第一组件还包括一个或多个相对于 RF组件，并且在包装衬底上形成包覆模制，以基本上封装RF部件和一个或多个屏蔽线接头，通过压缩模制形成的包覆模制包括在具有垂直于...的部件的方向上减小熔融树脂的体积由包装基板限定的平面。

4. 发明申请

WO2018067578A1 DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE 审中-公开
标题翻译：具有凹陷结构的双面无线电频率包装
公开(公告)号：WO2018067578A1
公开(公告)日：2018-04-12
申请号：PCT/US2017/054953
申请日：2017-10-03
申请人： SKYWORKS SOLUTIONS, INC.
发明人： CHEN, Howard, E. , DARVEAUX, Robert, Francis , NGUYEN, Hoang, Mong
IPC分类号： H01L23/66 , H01L23/28 , H01L23/48 , H01L25/07
摘要： A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.
摘要翻译：披露了一种封装的射频设备，其包括被配置为接收一个或多个部件的封装衬底，该封装衬底包括第一侧和第二侧。可以在封装衬底的第一侧上实施屏蔽封装，屏蔽封装包括第一电路和第一包覆模制结构，屏蔽封装配置成为第一电路的至少一部分提供射频屏蔽。可以在封装衬底的第二侧上实施一组通孔连接，该组通孔连接在封装衬底的第二侧上限定安装体积。该装置可以包括在安装体积内实施的部件和基本上包封一个或多个部件或一组模具连接的第二包覆成型结构。

5. 发明申请

WO2016131034A2 USE OF BOOST SUPPLY FOR LOW BATTERY 2G BIAS SUPPORT 审中-公开
标题翻译：用于低电量2G偏置支持的增压电源
公开(公告)号：WO2016131034A2
公开(公告)日：2016-08-18
申请号：PCT/US2016/017925
申请日：2016-02-14
申请人： SKYWORKS SOLUTIONS, INC.
发明人： RIPLEY, David Steven
CPC分类号： H02M3/158 , H02M2001/0022 , H02M2001/008 , H02M2001/009
摘要： A voltage supply system is disclosed, comprising a boost converter configured to receive an input voltage and generate a first output voltage at a first output node, a low-voltage supply circuit configured to receive the input voltage and generate a second output voltage at a second output node, and a routing circuit configured to route the first output voltage of the boost converter to the second output node during a selected condition of the input voltage.
摘要翻译：公开了一种电压供应系统，包括：升压转换器，被配置为接收输入电压并且在第一输出节点处产生第一输出电压;低压供应电路，被配置为接收输入电压;以及在第二输出节点产生第二输出电压;以及路由电路，配置成在输入电压的选定状态期间将升压转换器的第一输出电压路由到第二输出节点。

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