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    • 83. 发明申请
    • MINIATURIZED IMAGING DEVICE
    • 微型成像装置
    • WO2003081831A2
    • 2003-10-02
    • PCT/US2003/008312
    • 2003-03-18
    • SARCOS INVESTMENT LC
    • JACOBSEN, Stephen, C.DAVIS, Clark, C.MARKUS, David, T.MARCEAU, David, P.PENSEL, Ralph
    • H04L
    • A61B1/05
    • The present invention is drawn toward miniaturized imaging devices. In one embodiment, the device can include a utility guide (36) having at least one aperture (60) configured for supporting utilities, and an SSID (38) carried by the utility guide. The SSID can include an imaging array (48) on a top surface (72), and a conductive element (56) on a side surface (74), wherein the imaging array is electrically coupled to the conductive element. Further, a lens (40), such as a GRIN lens, can be optically coupled to the imaging array, and an umbilical (30), including a conductive line (32), can be carried by the at least one aperture. The conductive line can be electrically coupled to the conductive element on the side surface of the SSID. Alternatively, the device can include an SSID having, as an integral structure, an imaging array electrically coupled to a conductive pad, wherein the SSID further includes at least one utility aperture (82) passing therethrough. Further, a lens can be optically coupled to the imaging array, and an umbilical, including a conductive line carried by the at least one aperture, can be configured such that the conductive line is directly electrically coupled to the conductive pad. In another embodiment, electrical communication between a conductive line and an SSID can be through an adaptor (52) or connector block, which can optionally also support the lens.
    • 本发明涉及小型化成像装置。 在一个实施例中,设备可以包括具有配置用于支持实用程序的至少一个孔径(60)的实用程序引导件(36)和由该实用程序引导件承载的SSID(38)。 SSID可以包括在顶表面(72)上的成像阵列(48)和在侧表面(74)上的导电元件(56),其中成像阵列电耦合到导电元件。 此外,诸如GRIN透镜的透镜(40)可以光学耦合到成像阵列,并且包括导线(32)的脐带(30)可以由所述至少一个孔承载。 导电线可以电耦合到SSID的侧表面上的导电元件。 或者,该装置可以包括具有电耦合到导电垫的成像阵列作为整体结构的SSID,其中SSID还包括穿过其中的至少一个应用孔(82)。 此外,透镜可以光学耦合到成像阵列,并且包括由至少一个孔承载的导电线的脐带可以被配置为使得导线直接电耦合到导电垫。 在另一个实施例中,导线和SSID之间的电连通可以通过适配器(52)或连接器块,其可选地还可以支撑透镜。