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71. 发明申请

WO2005076681A1 METHOD OF MANUFACTURING A CIRCUIT CARRIER AND THE USE OF THE METHOD 审中-公开
标题翻译：制造电路载体的方法和方法的使用
公开(公告)号：WO2005076681A1
公开(公告)日：2005-08-18
申请号：PCT/EP2005/000698
申请日：2005-01-20
申请人： ATOTECH DEUTSCHLAND GMBH , HOFMANN, Hannes, P.
发明人： HOFMANN, Hannes, P.
IPC分类号： H05K3/46
CPC分类号： H05K3/465 , H05K3/045 , H05K3/107 , H05K3/188 , H05K3/4661 , H05K2201/0323 , H05K2201/0329 , H05K2201/09036 , Y10T29/49155
摘要： A method of manufacturing a circuit carrier and the use of said method are proposed, said method comprising, after providing a printed circuit board (a), coating the circuit board on at least one side thereof with a dielectric (b), structuring the dielectric for producing trenches and vias therein using laser ablation (c) are performed. Next, a primer layer is deposited onto the dielectric, either onto the entire surface thereof or into the produced trenches and vias only (d). A metal layer is deposited onto the primer layer, with the trenches and vias being completely filled with metal for forming conductor structures therein (e). Finally, the excess metal and the primer layer are removed until the dielectric is exposed if the primer layer was deposited onto the entire surface thereof, with the conductor structures remaining intact (f).
摘要翻译：提出一种制造电路载体的方法和所述方法的使用，所述方法包括在提供印刷电路板（a）之后，在其至少一侧上用电介质（b）涂覆电路板，构造电介质用于使用激光烧蚀（c）来制造其中的沟槽和通孔。接下来，将底漆层沉积到电介质的整个表面上，或沉积到所制造的沟槽和通孔中（d）。金属层沉积在底漆层上，其中沟槽和通孔被完全填充金属，用于在其中形成导体结构（e）。最后，如果底漆层沉积在其整个表面上，导体结构保持完整（f），则去除多余的金属和底漆层直到电介质暴露。

72. 发明申请

WO2004021366A3 MIXTURES COMPRISING THIOPHENE/ANION DISPERSIONS AND CERTAIN ADDITIVES FOR PRODUCING COATINGS EXHIBITING IMPROVED CONDUCTIVITY, AND METHODS RELATED THERETO 审中-公开
标题翻译：包含噻吩/阴离子分散剂和某些添加剂的混合物，用于生产显示改进的电导率的涂料，以及与之相关的方法
公开(公告)号：WO2004021366A3
公开(公告)日：2004-06-03
申请号：PCT/US0301842
申请日：2003-01-21
申请人： ELECON INC , GO PIN , FREITAG DIETER , CONNELL JOHN W
发明人： GO PIN , FREITAG DIETER , CONNELL JOHN W
IPC分类号： H01B1/12 , H01L51/30 , H01L51/52 , H05K3/18 , C08L65/00
CPC分类号： H01B1/12 , H01B1/122 , H01G9/028 , H01L51/0037 , H01L51/5206 , H05K3/188 , Y02E10/549 , Y02P70/521
摘要： Disclosed are mixtures comprising aqueous thiophene/anion dispersions, such as polythiophene/polystyrene sulfonate aqueous dispersions, and additives, as well as coatings produced therefrom. Coatings produced from these mixtures yield significant improvements in electrical conductivity without the need for a high temperature treatment as compared to coatings produced from unmodified aqueous polythiophene dispersions (e.g., Baytron(R)P) and to coatings produced from state-of the-art aqueous polythiophene-additive mixtures. These conductivity improvements are achieved without detracting from the optical transparency of the coating. Because characteristics of volume resistivity of less than 6.6 ohm-cm and optical transmission greater than 80% are important for conductive coating applications, coatings produced from the mixtures of the present invention have significant advantages over coatings produced from the state-of-the-art mixtures in many applications. Also disclosed are a variety of substrates or articles of manufacture coated with the mixtures of the present invention for use in various applications where a combination of high electrical conductivity, -excellent optical transparency and low temperature processing are important, such as electronic and optoelectronic devices.
摘要翻译：公开了包含噻吩/阴离子水溶液的混合物，例如聚噻吩/聚苯乙烯磺酸盐水分散体和添加剂，以及由其制备的涂层。与由未改性的聚噻吩分散体（例如，P）制备的涂层相比，由这些混合物制备的涂层产生显着的导电性改进，而不需要高温处理，并且与现有技术水性聚噻吩 - 添加剂混合物。实现这些导电性改进而不会降低涂层的光学透明度。由于体积电阻率小于6.6欧姆 - 厘米，光学透射率大于80％的特性对于导电涂层应用很重要，因此本发明混合物制成的涂层具有优于现有技术的涂层的优点混合物在许多应用中。还公开了涂覆有本发明混合物的各种基材或制品，其用于各种应用中，其中高导电性，良好的光学透明性和低温加工的组合是重要的，例如电子和光电器件。

73. 发明申请

WO1991014805A1 PROCESS FOR PREPARING NONCONDUCTIVE SUBSTRATES 审中-公开
标题翻译：制备非导电基板的方法
公开(公告)号：WO1991014805A1
公开(公告)日：1991-10-03
申请号：PCT/US1991001457
申请日：1991-03-04
申请人： OLIN HUNT SUB III CORP.
发明人： OLIN HUNT SUB III CORP. , PENDLETON, Phillip
IPC分类号： C25D05/02
CPC分类号： C25D5/54 , H05K3/188 , H05K2201/0323
摘要： The present invention is directed to a unified permanganate desmearing/carbon black dispersion preplating operation whereby the neutralization treatment of the desmearing operation and the conditioning treatment of the preplating operation is combined into one step. Also this invention provides an even more economical and environmentally safe process for applying a conductive metal layer to the surfaces of nonconducting layers of printed wiring boards than presently known combined permanganate/electroless processes.
摘要翻译：本发明涉及一种高锰酸盐沉淀/炭黑分散预均衡操作，其中将去除操作的中和处理和预处理操作的调理处理组合成一个步骤。此外，本发明提供了一种甚至更经济和环境安全的方法，用于将导电金属层施加到印刷线路板的不导电层的表面上，而不是目前已知的组合式高锰酸盐/无电解方法。

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