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    • 62. 发明申请
    • INFRARED BOLOMETER
    • 红外测温仪
    • WO00037905A1
    • 2000-06-29
    • PCT/KR1998/000443
    • 1998-12-18
    • G01J1/02G01J5/02G01J5/20
    • G01J5/20
    • An inventive infrared bolometer (200) capable of structurally compensating for a slop of a post, which comprises: an active matrix level (110) including a substrate (112) and a pair of connecting terminals (114); a support level (120) provided with a pair of bridges (122) and a pair of conduction lines (124), whereby each of bridges (122) is provided with an anchor portion (122a), a leg portion (122b) and an elevated portion (122c), the anchor portion (122a) being affixed to the active matrix level (110) wherein the elevated portion (122c) of each of the bridges including an inner part (301) cantilevered from an outer part (302); an absorption level (130) including a bolometer element (132) surrounded by an absorber (131); and a pair of posts (140) positioned on top of the inner part (301) of the bridge (122), each of the posts (140) including an electrical conduit (142), wherein each ends of the bolometer element (132) is electrically connected to the respective terminal (114) through the respective conduit (142) and the respective conduction line (124).
    • 本发明的能够结构地补偿柱的斜率的红外测辐射热计(200),其包括:包括基板(112)和一对连接端子(114)的有源矩阵液位(110); 提供有一对桥(122)和一对导线(124)的支撑水平(120),由此每个桥梁(122)设置有锚定部分(122a),腿部部分(122b)和 所述锚定部分(122a)固定到所述有源矩阵水平面(110),其中每个所述桥梁的所述提升部分(122c)包括从外部部分(302)悬臂的内部部分(301); 包括由吸收器(131)包围的测辐射热计元件(132)的吸收水平(130); 和位于桥梁(122)的内部部分(301)的顶部上的一对柱(140),每个柱(140)包括电导管(142),其中测辐射热计元件(132)的每个端部 通过相应的管道(142)和相应的导线(124)电连接到相应的端子(114)。
    • 63. 发明申请
    • INFRARED SENSOR AND INFRARED SENSOR ARRAY COMPRISING THE SAME
    • 红外传感器和包含其的红外传感器阵列
    • WO00023774A1
    • 2000-04-27
    • PCT/JP1998/004709
    • 1998-10-19
    • G01J5/20G01J1/44
    • G01J5/20
    • An infrared sensor has a heat-insulating structure provided on a silicon substrate through an electrically insulating layer. To eliminate the influence of temperature variation of the whole infrared sensor on the output of a first thermal infrared sensing element provided in the infrared sensor and comprising resistors and diodes connected together, a second temperature sensing element for measuring the temperature of the whole infrared sensor is provided in the infrared sensor. The difference between the outputs of the first and second sensing elements is converted into a current change from a MOSFET as the gate-source voltage change of the MOSFET, and the current change is outputted as the variation of the charged/discharged electricity of the capacitance of a capacitor connected to the MOSFET. Thus, the noise in the output of the infrared sensor is suppressed, and the performance of the infrared sensor is improved. An infrared sensor array comprises such infrared sensors and, as occasion arises, sensors for temperature compensation as mentioned above, one for each column. Therefore, the noise of the signal from the sensor array is suppressed and the performances of the sensors are improved.
    • 红外线传感器具有通过电绝缘层设置在硅衬底上的绝热结构。 为了消除整个红外传感器的温度变化对设在红外传感器中的第一热红外线感测元件的输出的影响,包括连接在一起的电阻和二极管,用于测量整个红外传感器的温度的第二温度感测元件是 提供在红外传感器中。 第一和第二感测元件的输出之间的差异作为MOSFET的栅极 - 源极电压变化被转换为来自MOSFET的电流变化,并且电流变化作为电容的充电/放电电流的变化被输出 连接到MOSFET的电容器。 因此,抑制红外线传感器的输出的噪声,提高红外线传感器的性能。 一种红外传感器阵列包括这样的红外传感器,并且出于任何情况,出现用于温度补偿的传感器,如上所述,每一列一个。 因此,来自传感器阵列的信号的噪声被抑制,并且传感器的性能得到改善。
    • 68. 发明申请
    • DEVICE AND METHOD FOR MONITORING AN EMISSION TEMPERATURE OF A RADIATION EMITTING ELEMENT
    • WO2022234074A1
    • 2022-11-10
    • PCT/EP2022/062261
    • 2022-05-06
    • TRINAMIX GMBH
    • BAUMGARTNER, TobiasKULKARNI, SourabhOEGUEN, Celal Mohan
    • G01J5/00G01J5/04G01J5/06G01J5/0802G01J5/08G01J5/20
    • The present invention refers to a device (112) for monitoring an emission temperature of at least one radiation emitting element (114), a heating system (110) for heating at the least one radiation emitting element (114) to emit thermal radiation at an emission temperature, a method for monitoring an emission temperature of at least one radiation emitting element (114) and method for heating the at least one radiation emitting element (114) to emit thermal radiation at an emission temperature. Herein, the device (112) for monitoring an emission temperature of at least one radiation emitting element (114) comprises - at least one light source (125), wherein the light source is configured to emit optical radiation at least partially towards the at least one radiation emitting element (114); - at least one radiation sensitive element (126), wherein the at least one radiation sensitive element (126) has at least one sensor region (128), wherein the at least one sensor region (128) comprises at least one photosensitive material selected from at least one photoconductive material, wherein the at least one sensor region (128) is designated for generating at least one sensor signal depending on an intensity of the thermal radiation emitted by the at least one radiation emitting element (114) and received by the sensor region (128) within at least one wavelength range, wherein the sensor region (128) is further designated for generating at least one further sensor signal depending on an intensity of the optical radiation emitted by the at least one light source (125) and received by the sensor region (128) within at least one further wavelength range, wherein the at least one radiation sensitive element (126) is arranged in a manner that the thermal radiation travels through at least one transition material (116) prior to being received by the at least one radiation sensitive element (126), wherein at least one of the at least one light source (125) and the at least one radiation sensitive element (126) is arranged in a manner that the optical radiation travels through the at least one transition material (116) and impinges the at least one radiation emitting element (114) prior to being received by the at least one radiation sensitive element (126); and - at least one evaluation unit (138), wherein the at least one evaluation unit (138) is configured to determine the emission temperature of the at least one radiation emitting element (114) by using values for the intensity of the thermal radiation and the optical radiation.