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61. 发明申请

WO01043269A3 METHOD AND APPARATUS FOR MAKING AN ELECTRICAL DEVICE 审中-公开
标题翻译：制造电气设备的方法和装置
公开(公告)号：WO01043269A3
公开(公告)日：2001-11-01
申请号：PCT/US2000/042571
申请日：2000-12-06
IPC分类号： B23K1/012 , H05K3/34 , B23K31/00
CPC分类号： H05K3/3484 , B23K1/012 , B23K2201/42 , H05K3/3494 , H05K2203/0278 , H05K2203/043 , H05K2203/0557 , H05K2203/081 , H05K2203/086
摘要： The invention relates to a method and apparatus to use nitrogen, or any other inert gas, or a reducing gas as a process gas to reflow and planarize solder paste (14) in a single heating step. The inert gas may also be used to cool the solder paste (14) after reflowing. According to one method soldered paste (14) is printed onto the printed circuit board (10) with conventional methods employing a mask or stencil (16). A mesh, die, or mold element (20) having a plurality of openings therein is lowered onto the soldered paste (14) and the printed circuit board (10) is reflowed and planarized in a single heating step. Once the paste (14) is applied, the parts are reflowed and planarized in a single, brief, thermal excursion. The heated mesh (20) is lowered into the solder paste (14) causing the paste (14) to wick through the mesh (20) forming a meniscus. A hot gas knife is arranged to plane the meniscus of the solder paste (14) off of the mesh (20). An inert, nitrogen, or reducing gas is diffused through the knife to prevent oxidation.
摘要翻译：本发明涉及在单个加热步骤中使用氮气或任何其它惰性气体或还原气体作为工艺气体来回流和平坦化焊膏（14）的方法和装置。惰性气体也可用于在回流之后冷却焊膏（14）。根据一种方法，使用采用掩模或模板（16）的常规方法将焊膏（14）印刷到印刷电路板（10）上。在其中具有多个开口的网格，模具或模具元件（20）下降到焊接膏（14）上，并且印刷电路板（10）在单个加热步骤中被回流和平坦化。一旦施加了浆料（14），则部件在单个短暂的热偏移中回流和平坦化。加热的网状物（20）下降到焊料膏（14）中，使得糊料（14）芯穿通形成弯液面的网状物（20）。将热气刀布置成使焊膏（14）的弯月面离开网（20）。惰性，氮气或还原气体通过刀片扩散以防止氧化。

62. 发明申请

WO99048642A1 METHODS AND APPARATUSES FOR FORMING SOLDER BALLS ON SUBSTRATES 审中-公开
标题翻译：在基材上形成焊接棒的方法和装置
公开(公告)号：WO99048642A1
公开(公告)日：1999-09-30
申请号：PCT/US1999/006213
申请日：1999-03-22
IPC分类号： B23K1/00 , B23K3/06 , B23K35/02 , B23K35/22 , H01L21/60 , H05K3/34 , B23K37/00 , B23K5/22 , B23K35/12 , B23K37/04
CPC分类号： B23K35/0244 , B23K3/0623 , B23K35/224 , B23K2201/40 , H01L2924/01042 , H01L2924/014 , H05K3/3484 , H05K2201/10477 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/0557
摘要： A mask (110; see also 160, 210, 260, 310, 408, 500, 702, 802, 904) having a plurality of openings (cells) is disposed on, or nearly on, the surface of a substrate (102), the openings (112) of the mask being aligned over a corresponding plurality of pads (104) on the substrate. The openings in the mask are filled with solder material (114). A pressure plate (120) is disposed over the mask to capture the solder material in the cells. Heat is directed at the mask (through the pressure plate) to reflow the solder. This is done in an inverted or partially inverted orientation. The stackup (assembly) of substrate/mask/pressure plate may be un-inverted prior to cooling. Mask configurations, methods of mounting the masks, and solder material compositions are described. The methods are robust, and are well suited to fine pitch as well as coarse pitch ball bumping of substrates.
摘要翻译：具有多个开口（单元）的掩模（110;也参见160,210,260,310,408,500,2002,802,904）设置在基板（102）的表面上或几乎在其上，掩模的开口（112）对准衬底上的对应的多个焊盘（104）。掩模中的开口填充有焊料（114）。压板（120）设置在掩模上以捕获电池中的焊料材料。热量指向面罩（通过压板）以回流焊料。这是以倒置或部分倒置的方向完成的。在冷却之前，可以将基板/掩模/压板的叠层（组件）未反转。描述掩模构造，安装掩模的方法和焊料材料组成。这些方法是坚固的，并且非常适合于细小的间距以及基底的粗沥青球碰撞。

63. 发明申请

WO99017595A1 SOLDER BALL PLACEMENT WITH FLUX, TEMPLATE AND LASER TAG 审中-公开
标题翻译：带有流量，模板和激光标签的焊球
公开(公告)号：WO99017595A1
公开(公告)日：1999-04-08
申请号：PCT/SG1998/000056
申请日：1998-07-06
IPC分类号： H01L21/00 , H01L21/48 , H05K3/34
CPC分类号： H01L21/67144 , H01L21/4853 , H05K3/3478 , H05K3/3494 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/107
摘要： A system for solder ball (28) placement on BGA packaging comprising means for template alignment, means for solder ball placement and a laser head (36). A template (29) is aligned with connection pads located on the surface of the substrate with pre-applied flux. The aligned template allows accurate guiding of the balls onto the pads by the ball placement means. One ball is dropped into each hole (27) in the template directly onto the pad. The balls positioned on the pads are then exposed for a short time to a laser via the laser head to cause partial melting of the balls. This short exposure to laser results in a gentle attachment or tagging of the balls onto the pad of the substrate. Once the balls are tagged, they can be transferred to the reflow oven without being easily displaced.
摘要翻译：一种用于焊球（28）放置在BGA封装上的系统，包括用于模板对准的装置，用于焊球放置的装置和激光头（36）。模板（29）与预先施加的焊剂位于衬底表面上的连接焊盘对齐。对准的模板允许通过球放置装置将球准确地引导到垫上。一个球落在模板中的每个孔（27）中直接放在垫上。然后通过激光头将定位在焊盘上的滚珠短时间暴露于激光器以引起球的部分熔化。这种对激光的短时间曝光导致球的温和附着或标记到基底的垫上。一旦球被标记，它们可以被转移到回流炉而不容易地移位。

64. 发明申请

WO99017594A1 LASER REFLOW WITH TEMPLATE FOR SOLDER BALLS OF BGA PACKAGING 审中-公开
标题翻译：用BGA封装的焊接模块进行激光反射
公开(公告)号：WO99017594A1
公开(公告)日：1999-04-08
申请号：PCT/SG1998/000055
申请日：1998-07-06
IPC分类号： H01L21/00 , H01L21/48 , H05K3/34
CPC分类号： H01L21/67144 , H01L21/4853 , H05K3/3478 , H05K3/3494 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/107
摘要： A system of laser reflow with template on BGA packaging comprising means for template alignment, means for solder ball placement and a laser head (36). The template (29) is aligned with connection pads located on the surface of the substrate with pre-applied flux. The aligned template allows accurate guiding of the balls (28) onto the pads by the ball placement means. One ball is dropped into each hole (27) in the template directly onto the pads containing a layer of flux. The solder balls positioned on the pads are then exposed to a laser via the laser head, resulting in the rapid melting of the solder balls directly onto the substrate pads. The melted balls are then allowed to cool rapidly. This laser reflow with template method eliminates the use of the reflow oven, which is a bulky equipment involved in the packaging of BGA devices, while increasing the accuracy of the ball placement and alleviates the problem of ball bridging.
摘要翻译：一种在BGA封装上具有模板的激光回流系统，包括用于模板对准的装置，用于焊球放置的装置和激光头（36）。模板（29）与预先施加的焊剂位于衬底表面上的连接焊盘对齐。对准的模板允许通过球放置装置将球（28）精确地引导到垫上。将一个球落在模板中的每个孔（27）中直接放入含有一层焊剂的焊盘上。然后将位于焊盘上的焊球通过激光头暴露于激光，导致焊球迅速熔化到衬底焊盘上。然后使熔融的球快速冷却。这种使用模板法的激光回流消除了使用回流炉，这是一种涉及BGA器件封装的体积庞大的设备，同时提高了球放置的精度，并减轻了球桥接问题。

65. 发明申请

WO99017593A1 FLUXLESS LASER REFLOW WITH TEMPLATE FOR SOLDER BALLS OF BGA PACKAGING 审中-公开
标题翻译：无铅激光反射与BGA封装的焊接棒模板
公开(公告)号：WO99017593A1
公开(公告)日：1999-04-08
申请号：PCT/SG1998/000054
申请日：1998-07-06
IPC分类号： H01L21/00 , H01L21/48 , H05K3/34
CPC分类号： H01L21/67144 , H01L21/4853 , H05K3/3478 , H05K3/3494 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/107
摘要： A system of solder ball (28) placement and fluxless laser reflow on BGA packaging comprising means for template alignment, means for solder ball placement and a laser head. The template (29) is aligned with connection pads located on the surface of the substrate without flux. The aligned template allows accurate guiding of the balls onto the pads by the ball placement means. One ball is dropped into each hole (27) in the template directly onto the pads in the absence of flux. The solder balls positioned on the pads are then exposed to a laser via the laser head (36), resulting in the rapid melting of the solder balls directly onto the substrate pads. The melted balls are then allowed to cool rapidly. The present invention is preferably practiced on pads made from gold. The preferred condition for reflow is under nitrogen environment. Other types of pads composed of materials which are inert, do not oxidize readily in air and compatible with the solder ball reflow process are also compatible with the system according to the present invention.
摘要翻译： BGA封装上的焊球（28）放置和无通量激光回流系统，包括用于模板对准的装置，用于焊球放置的装置和激光头。模板（29）与位于基板表面上的连接焊盘对准，而没有焊剂。对准的模板允许通过球安置装置将球准确地引导到垫上。在没有焊剂的情况下，一个球在模板中的每个孔（27）中直接落入焊盘上。然后，位于焊盘上的焊球通过激光头（36）暴露于激光，导致焊球快速熔化到衬底焊盘上。然后使熔融的球快速冷却。本发明优选地在由金制成的垫上实施。回流的首选条件是在氮气环境下。由惰性的材料组成的其他类型的焊盘也与本发明的系统兼容，这些材料不易在空气中氧化并与焊球回流工艺相容。

66. 发明申请

WO98043307A3 SOLDERING GLOBULE ASSEMBLY DEVICE FOR BGA COMPONENTS 审中-公开
标题翻译： BGA组件的焊接全球装配装置
公开(公告)号：WO98043307A3
公开(公告)日：1998-12-23
申请号：PCT/DE1998/000734
申请日：1998-03-12
IPC分类号： H01L21/48 , H05K3/34 , H01L234/88
CPC分类号： H05K3/3478 , H01L21/4853 , H05K2203/0134 , H05K2203/041 , H05K2203/0557
摘要： The invention relates to a device for assembling soldering globules for BGA (Ball-Grid-Array) components which has a storage area for globules, an assembly grid, and a component positioning device. The assembly grid is designed with through-passages in such a way that the storage areas is connected with a component fitted in the positioning device, such that the soldering globules can be placed on the component.

67. 发明申请

WO1995026122A1 FOIL PRINTED CIRCUIT BOARDS AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：薄膜电路板和方法及其
公开(公告)号：WO1995026122A1
公开(公告)日：1995-09-28
申请号：PCT/CH1994000062
申请日：1994-03-23
申请人： DYCONEX PATENTE AG , MARTINELLI, Marco , SCHMIDT, Walter
发明人： DYCONEX PATENTE AG
IPC分类号： H05K03/00
CPC分类号： H05K3/4697 , H05K1/028 , H05K3/0041 , H05K3/4652 , H05K2201/0191 , H05K2203/0554 , H05K2203/0557 , H05K2203/1184
摘要： The invention concerns a multi-layer foil printed circuit board which comprises rigid areas (s) and flexible areas (f) and has more foil layers in the rigid areas than in the flexible areas. The foil printed circuit board is produced by removal of at least the outermost foil layer (1.2) or reduction of its thickness by etching at least on one side in the flexible areas (f) provided. By appropriate configuration of the etching mask, the flexible areas (f) can be made to merge continuously into rigid areas (s) as a result of less material being removed from the layers in the edge areas (u) than in the centre (z) of the flexible area (f), so that the flexible areas do not have any edge areas tending to kink. The flexible areas can be etched in the same step as the etching of the through-plating holes in the corresponding foil layer (1.2) or in a separating etching step.
摘要翻译：根据本发明的，多层薄膜电路板具有刚性的（一个或多个）和柔性的（F）部分，其中它包括在所述刚性区域Fohlinlagen比在柔性区域更多。本发明的膜的电路板是由在至少一侧产生是至少最箔层（1.2）中除去或通过在厚度减小蚀刻在所提供的柔性区域（F）。通过蚀刻掩模的适当的配置，可能的是，柔性区域（F）连续地在刚性区域（一个或多个）与过渡，其特征在于去除在边缘区域中的帘布层（U）的小于所述柔性区域的中心（Z）（ F），从而形成屈曲柔性部分的边缘区域没有倾向。柔性部分的蚀刻可以在相同的工艺步骤的通孔通过各自的箔片层（1.2）蚀刻或在单独的蚀刻步骤来执行。

68. 发明申请

WO1991012634A1 PROCESS FOR PRE-SOLDERING A SUBSTRATE 审中-公开
标题翻译：用于预先焊接衬底的工艺
公开(公告)号：WO1991012634A1
公开(公告)日：1991-08-22
申请号：PCT/EP1991000272
申请日：1991-02-12
申请人： ASEA BROWN BOVERI AKTIENGESELLSCHAFT , ABB-IXYS SEMICONDUCTOR GMBH , KROKOSZINSKI, Hans-Joachim , LANGER, Kurt , OETZMANN, Henning , NEIDIG, Arno
发明人： ASEA BROWN BOVERI AKTIENGESELLSCHAFT , ABB-IXYS SEMICONDUCTOR GMBH
IPC分类号： H01L49/00
CPC分类号： H05K3/3452 , H05K3/3468 , H05K2201/2081 , H05K2203/044 , H05K2203/0557 , H05K2203/104
摘要： The invention proposes a process for pre-soldering metal or metallised substrates using a flow-soldering installation in which the substrate is covered with a foil mask consisting preferably of a magnetic material, which adheres by magnetic attraction to the substrate during the soldering process and is galvanically chromium plated to prevent its being wetted.

69. 发明申请

WO1988001217A1 WAVE SOLDER FINGER SHIELD APPARATUS 审中-公开
标题翻译：波形手指指示器
公开(公告)号：WO1988001217A1
公开(公告)日：1988-02-25
申请号：PCT/US1987001949
申请日：1987-08-12
申请人： UNISYS CORPORATION
发明人： UNISYS CORPORATION , POPIELARSKI, Edward, John , THOMAS, Kenneth, Darhol
IPC分类号： B23K03/00
CPC分类号： H05K3/3452 , B23K3/0653 , B23K2101/42 , H05K1/117 , H05K3/3468 , H05K2203/0557
摘要： A set of titanium guide bars are shaped with inner angular finger shields to isolate designated underside edge areas of a printed circuit board being conveyed across a molten solder bath in a wave solder machine.

70. 发明申请

WO2016150912A1 VERFAHREN ZUR HERSTELLUNG EINER SCHALTUNG 审中-公开
标题翻译：一种用于生产电路
公开(公告)号：WO2016150912A1
公开(公告)日：2016-09-29
申请号：PCT/EP2016/056146
申请日：2016-03-21
申请人： SIVANTOS PTE. LTD. , BEYFUSS, Stefanie , KRAL, Holger , FREELS, Björn , KUHN, Johannes
发明人： BEYFUSS, Stefanie , KRAL, Holger , FREELS, Björn , KUHN, Johannes
IPC分类号： H05K3/28 , H01R25/00
CPC分类号： H05K3/341 , H04R25/00 , H04R25/60 , H05K3/0076 , H05K3/284 , H05K2201/09781 , H05K2201/0989 , H05K2201/10204 , H05K2201/1028 , H05K2203/0228 , H05K2203/0557 , H05K2203/107
摘要： Die Erfindung betrifft ein Verfahren (2) zur Herstellung einer Schaltung (4), insbesondere einer Hörhilfe (6), bei dem eine Leiterplatte (10) mit einem ersten Bereich (14) und mit einem zweiten Bereich (12), die mittels einer Grenze (18) getrennt sind, bereitgestellt wird. An der Leiterplatte (10) wird ein Bauteil (24) angebracht, wobei das Bauteil (24) auf der Grenze (18) positioniert wird. Der erste Bereich (14) wird mittels einer eine Kante (42) aufweisenden Maske (38) abgedeckt, wobei die Kante (42) auf dem Bauteil (24) positioniert wird, und die Leiterplatte (10) wird mit einer Beschichtung (46) versehen. Die Beschichtung (46) wird im Bereich des Bauteils (24) aufgetrennt, und die Maske (38) wird entfernt.
摘要翻译：本发明涉及一种方法，（2）用于制造电路（4），特别是助听器（6），其中一个电路板（10）通过的限制装置具有第一区域（14）和第二区域（12）（18）被分离，提供了一种。一个部件（24）安装在印刷电路板（10），其中上边界（18）的部件（24）被定位。所述第一区域（14）被覆盖有掩膜（38）的边缘（42）的装置，所述边缘（42）定位在所述部件（24）上，并且所述电路板（10）上设置有涂层（46），所述涂层（46）在部件（24）和所述掩模（38）被去除的区域中分离出来。

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