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1. 发明申请

WO2004030854B1 SELECTIVE GAS KNIFE FOR WAVE SOLDERING 审中-公开
标题翻译：用于波浪焊接的选择性气体刀
公开(公告)号：WO2004030854B1
公开(公告)日：2004-09-23
申请号：PCT/US0330782
申请日：2003-09-29
申请人： SPEEDLINE TECHNOLOGIES INC , BECKER ERIC WAYNE , KIRBY KENNETH
发明人： BECKER ERIC WAYNE , KIRBY KENNETH
IPC分类号： B23K1/08 , B23K1/20 , B23K3/06 , B23K31/02 , B23K35/12
CPC分类号： B23K1/085 , B23K3/0653 , B23K3/08
摘要： Selective gas knives (24, 24', 24'') for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board (22). Both the temperature and flow rate of gas through a segment (28) of a gas knife can be independently controlled.
摘要翻译：用于波峰焊的选择性气刀（24,24'，24“）提供诸如印刷电路板（22）的基板上的特定位置处的目标气体流动。通过气刀的段（28）的气体的温度和流速都可以独立控制。

2. 发明申请

WO98053494A1 METHOD OF MANUFACTURING A PATTERNED ARRAY OF SOLDER BUMPS 审中-公开
标题翻译：制造焊枪图案阵列的方法
公开(公告)号：WO98053494A1
公开(公告)日：1998-11-26
申请号：PCT/US1998/009066
申请日：1998-05-04
IPC分类号： H01L21/60 , B23K35/12 , H01L21/48 , H01L21/68 , H05K3/04 , H05K3/34
CPC分类号： H01L21/6835 , H01L21/4814 , H01L21/4853 , H01L2224/11003 , H01L2224/1111 , H01L2224/16 , H01L2924/01004 , H01L2924/01025 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H05K3/041 , H05K3/3478 , H05K2201/10734 , H05K2203/0113 , H05K2203/0156 , H05K2203/033 , H05K2203/0338 , H05K2203/0405 , H05K2203/043
摘要： The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a pluraltiy of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.
摘要翻译：本发明涉及一种制造金属球阵列的方法。该方法包括在包括多个箔突起的金属箔上产生第一图案的步骤。该方法还包括在载体基板上产生第二图案的步骤。第二图案包括多个载体凹部，其被布置和构造成与第一图案的箔片突起对应。该方法还包括以下步骤：将金属箔和载体衬底放置在一起，使得金属箔的箔突起装配在载体衬底的载体凹槽内，并熔化金属箔，使得箔突起形成位于载体基板的载体凹部。本发明还涉及通过上述方法构造的金属球阵列。

3. 发明申请

WO2005045894A3 HIGH VOLUME MICROLAMINATION PRODUCTION OF DEVICES 审中-公开
标题翻译：高容量微生物装置生产
公开(公告)号：WO2005045894A3
公开(公告)日：2006-04-27
申请号：PCT/US2004035452
申请日：2004-10-25
申请人： UNIV ARD OF HIGHER EDUCATION O , PAUL BRIAN K , PLUESS CHRISTOPH , SHARMA NITIN , DOOLEN TONI L
发明人： PAUL BRIAN K , PLUESS CHRISTOPH , SHARMA NITIN , DOOLEN TONI L
IPC分类号： H01L20060101 , B21D39/00 , B23K31/02 , B23K35/12 , B32B31/00
CPC分类号： B32B37/10
摘要： Embodiments of a differential thermal expansion bonding device are described for the high volume bonding of laminae together to form a MECS device. One embodiment of the device comprises a frame, engager made of a solid, liquid or gas, preload with springs and platens. Other embodiments of a method for bonding laminae together to form a MECS device using surface mount technology (SMT) techniques are described, with one embodiment being directed towards conveyorized bonding. The method including providing laminae to be bonded that do not include a solder mask, microething at least a portion of at least one lamina, applying solder paste to a microetched portion, and bonding the laminae together using the solder paste. A method for continuously bonding laminae also is described, such as by using a conveyorized furnace for applying heat to a workpiece functionally associated with the bonding device. The method can include forced convective heating, cooling or both, using inert gas flush. A method and fixture for registering laminae compatible with the differential thermal expansion bonding device by using integral compliant features is also described.
摘要翻译：描述了差分热膨胀接合装置的实施例用于将层的高体积接合在一起以形成MECS装置。该装置的一个实施例包括由固体，液体或气体制成的框架，预加载有弹簧和压板。描述了使用表面贴装技术（SMT）技术将薄片粘合在一起以形成MECS装置的方法的其它实施例，一个实施例涉及传送带式粘接。该方法包括提供不包括焊接掩模的薄片，微孔至少一层薄片的至少一部分，将焊膏施加到微蚀刻部分，以及使用焊膏将薄片粘合在一起。还描述了用于连续粘合层的方法，例如通过使用传送炉来对与粘合装置功能相关的工件施加热量。该方法可以包括强制对流加热，冷却或两者均使用惰性气体冲洗。还描述了通过使用整体兼容特征来记录与差动热膨胀接合装置兼容的薄片的方法和夹具。

4. 发明申请

WO02013189A1 BONDING PAD OF SUSPENSION CIRCUIT 审中-公开
标题翻译：悬挂电路接头
公开(公告)号：WO02013189A1
公开(公告)日：2002-02-14
申请号：PCT/CN2000/000227
申请日：2000-08-09
IPC分类号： B23K35/12 , G11B5/127 , G11B5/48 , G11B5/60 , G11B15/64 , G11B17/32 , G11B21/08 , H05K3/34 , G11B5/53 , G11B5/49 , G11B5/52
CPC分类号： G11B5/4853 , G11B5/4826 , Y10T29/49025 , Y10T29/49144 , Y10T29/49169
摘要： A new type of suspension circuit electrical bonding pad is described for electrically and mechanically connecting process for the magnetic recording head. The new type of bonding pad will serve as the joint material as well as the joint interface. Thus there is no need to apply the conductive material in between the bonding pads and magnetic recording head terminals, consequently reducing the process leading time and simplifying the magnetic recording head assemble process.
摘要翻译：描述了一种用于磁记录头的电气和机械连接过程的新型悬挂电路电接合焊盘。新型接合垫将用作接头材料以及接头接口。因此，不需要将导电材料施加在接合焊盘和磁记录头端子之间，从而减少处理引导时间并简化磁记录头组装过程。

5. 发明申请

WO2004026517A3 SOLDER HIERARCHY FOR LEAD FREE SOLDER JOINT 审中-公开
标题翻译：用于无铅焊接接头的焊料层级
公开(公告)号：WO2004026517A3
公开(公告)日：2004-05-06
申请号：PCT/US0329092
申请日：2003-09-12
申请人： IBM
发明人： INTERRANTE MARIO , FARCOOQ MUKTA G , SABLINSKI WILLIAM EDWARD
IPC分类号： B23K1/00 , B23K35/14 , B23K35/26 , B23K101/40 , B23K101/42 , C22C13/00 , H05K3/34 , B23K31/02 , B23K35/12 , B23K35/34
CPC分类号： B23K1/0016 , B23K35/262 , B23K2201/36 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613
摘要： A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an intermetallic phase structure in the module side fillet during assembly. The intermetallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).
摘要翻译：用于电子元件的第二层焊接连接的无铅焊料层次结构，例如将电子模块（20）连接到电路板（120）。 SnCu或SnAg的非共晶焊料（60）浓度用于模块侧连接。这种非共晶焊料（60）含有足够的金属间化合物以提供模块侧连接，并具有稳健的二级装配和返工工艺。非共晶组合物（60）在组装期间在模块侧边角中提供金属间相结构。金属间相结构消除了第二级组装期间的倾斜和塌陷问题，并且通过提供更加粘性的接头允许从板（120）移除柱（100）而无需同时从模块（20）移除而帮助返工。

6. 发明申请

WO2003026833A1 BALL BUMPING MACHINE AND TECHNIQUES 审中-公开
标题翻译：防撞机和技术
公开(公告)号：WO2003026833A1
公开(公告)日：2003-04-03
申请号：PCT/US2002/030034
申请日：2002-09-20
申请人： SPHERETEK, LLC , MACKAY, John , MOLINARO, Tom
发明人： MACKAY, John , MOLINARO, Tom
IPC分类号： B23K35/12
CPC分类号： B23K35/0222 , B23K1/0016 , B23K3/0623 , B23K3/0638 , B23K3/087 , B23K35/0244 , B23K35/224 , B23K2201/40 , B23K2201/42 , H01L21/4853 , H01L24/11 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/3484 , H05K2201/10477 , H05K2203/0113 , H05K2203/0278 , H05K2203/0338 , H05K2203/043 , H05K2203/0557 , H05K2203/085 , H05K2203/1581 , H01L2924/00 , H01L2224/05599
摘要： A mask (1010, 1210) having cells (1034, 234) is disposed on a surface of a heater stage (1008, 1208), and is filled (printed) with solder paste (1202). A substrate (e.g., wafer 1006) is assembled to the opposite side of the mask, and the solder paste is reflowed, forming solder balls. The balls expand partially out of the mask, and contact and wet themselves to the metal pads on the substrate. The mask is separated from the substrate, either before or after cooling. A ball bumping machine (1000) has a mechanism (1018) for shuttling the mask (1010, 1012) to the heater stage (1008, 1016) for printing, means for assembling (1026) the heater stage to the mask holder (1020), shuttling the mask/heater stage to a chuck (1004, 1014) holding a substrate (e.g., wafer 1006), and means for assembling (1028) the chuck to the mask holder. The substrate is then shuttled to any position between inverted and non-inverted, for reflow. A method for printing the mask (1210) with solder paste (1202), using a print blade (1220) followed by a cleaning blade (1230) is described.
摘要翻译：具有电池（1034,234）的掩模（1010,1212）设置在加热器台（1008,1208）的表面上，并用焊膏（1202）填充（印刷）。将衬底（例如，晶片1006）组装到掩模的相对侧，并且焊膏被回流，形成焊球。球从面罩部分扩张，并将其自身接触并湿润到基底上的金属垫。在冷却之前或之后，将掩模与基材分离。球碰撞机（1000）具有用于将掩模（1010,1012）穿过加热器台（1008,1016）进行打印的机构（1018），用于将加热器台组装（1026）到面罩座（1020）的装置，将掩模/加热器台穿过保持基板（例如，晶片1006）的卡盘（1004,1014），以及用于将卡盘组装（1028）到掩模支架的装置。然后将衬底穿梭到倒置和非倒置之间的任何位置，以进行回流。描述了使用印刷刮刀（1220）和清洁刮板（1230）印刷具有焊膏（1202）的掩模（1210）的方法。

7. 发明申请

WO2010096420A1 BRAZED CLADDINGS FOR CAST IRON SUBSTRATES 审中-公开
标题翻译：用于铸铁衬底的划痕衬垫
公开(公告)号：WO2010096420A1
公开(公告)日：2010-08-26
申请号：PCT/US2010/024380
申请日：2010-02-17
申请人： KENNAMETAL INC. , PATEL, Vaishali Bhagwanbhai , FAUST, James Aaron
发明人： PATEL, Vaishali Bhagwanbhai , FAUST, James Aaron
IPC分类号： B05D1/12 , B23K35/12
CPC分类号： B23K1/0008 , B22F7/04 , B23K1/008 , B23K1/19 , B23K35/004 , B23K35/0238 , B23K35/0244 , B23K35/3046 , B23K35/3066 , B23K35/327 , B23K2201/34 , B23K2203/06 , B23K2203/18 , B23K2203/26 , C22C19/03 , C22C19/05 , C22C19/058 , C22C29/02 , C22C29/12 , C23C24/103 , C23C30/00 , Y10T428/12937
摘要： The present invention discloses abrasion resistant claddings for cast iron substrates comprising hard particles and nickel-based braze alloys. The cladding material can be brazed on cast iron substrates at lower temperatures than conventional cladding materials, providing highly increased abrasion resistance to the cast iron substrate materials without adversely affecting the physical properties and structural integrity of such substrates.
摘要翻译：本发明公开了用于包含硬质颗粒和镍基钎焊合金的铸铁基材的耐磨包层。包层材料可以在比常规包层材料低的温度下钎焊在铸铁基材上，为铸铁基材材料提供高度增加的耐磨性，而不会不利地影响这些基材的物理性能和结构完整性。

8. 发明申请

WO2004030854A3 SELECTIVE GAS KNIFE FOR WAVE SOLDERING 审中-公开
标题翻译：用于波峰焊的选择性气体刀具
公开(公告)号：WO2004030854A3
公开(公告)日：2004-08-05
申请号：PCT/US0330782
申请日：2003-09-29
申请人： SPEEDLINE TECHNOLOGIES INC , BECKER ERIC WAYNE , KIRBY KENNETH
发明人： BECKER ERIC WAYNE , KIRBY KENNETH
IPC分类号： B23K1/08 , B23K1/20 , B23K3/06 , B23K31/02 , B23K35/12
CPC分类号： B23K1/085 , B23K3/0653 , B23K3/08
摘要： Selective gas knives (24, 24', 24'') for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board (22). Both the temperature and flow rate of gas through a segment (28) of a gas knife can be independently controlled.
摘要翻译：用于波峰焊接的选择性气刀（24,24'，24“）在衬底（例如印刷电路板（22））上的特定位置处提供目标气流。通过气刀段（28）的气体的温度和流速可以独立控制。

9. 发明申请

WO99048642A1 METHODS AND APPARATUSES FOR FORMING SOLDER BALLS ON SUBSTRATES 审中-公开
标题翻译：在基材上形成焊接棒的方法和装置
公开(公告)号：WO99048642A1
公开(公告)日：1999-09-30
申请号：PCT/US1999/006213
申请日：1999-03-22
IPC分类号： B23K1/00 , B23K3/06 , B23K35/02 , B23K35/22 , H01L21/60 , H05K3/34 , B23K37/00 , B23K5/22 , B23K35/12 , B23K37/04
CPC分类号： B23K35/0244 , B23K3/0623 , B23K35/224 , B23K2201/40 , H01L2924/01042 , H01L2924/014 , H05K3/3484 , H05K2201/10477 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/0557
摘要： A mask (110; see also 160, 210, 260, 310, 408, 500, 702, 802, 904) having a plurality of openings (cells) is disposed on, or nearly on, the surface of a substrate (102), the openings (112) of the mask being aligned over a corresponding plurality of pads (104) on the substrate. The openings in the mask are filled with solder material (114). A pressure plate (120) is disposed over the mask to capture the solder material in the cells. Heat is directed at the mask (through the pressure plate) to reflow the solder. This is done in an inverted or partially inverted orientation. The stackup (assembly) of substrate/mask/pressure plate may be un-inverted prior to cooling. Mask configurations, methods of mounting the masks, and solder material compositions are described. The methods are robust, and are well suited to fine pitch as well as coarse pitch ball bumping of substrates.
摘要翻译：具有多个开口（单元）的掩模（110;也参见160,210,260,310,408,500,2002,802,904）设置在基板（102）的表面上或几乎在其上，掩模的开口（112）对准衬底上的对应的多个焊盘（104）。掩模中的开口填充有焊料（114）。压板（120）设置在掩模上以捕获电池中的焊料材料。热量指向面罩（通过压板）以回流焊料。这是以倒置或部分倒置的方向完成的。在冷却之前，可以将基板/掩模/压板的叠层（组件）未反转。描述掩模构造，安装掩模的方法和焊料材料组成。这些方法是坚固的，并且非常适合于细小的间距以及基底的粗沥青球碰撞。

10. 发明申请

WO2008097212A3 MULTIFUNCTIONAL REACTIVE COMPOSITE STRUCTURES FABRICATED FROM REACTIVE COMPOSITE MATERIALS 审中-公开
标题翻译：由反应性复合材料制成的多功能反应复合结构
公开(公告)号：WO2008097212A3
公开(公告)日：2009-01-08
申请号：PCT/US2006024438
申请日：2006-06-22
申请人： REACTIVE NANOTECHNOLOGIES INC , WEIHS TIMOTHY P , LUNKING DAVID M , HEIAN ELLEN M , XUN YUWEI , BOWMAN RICHARD , CATIG GARY , VAN HEERDEN DAVID , VALLIAPAN SOMASUNDARAM , KNIO OMAR , GRZYB JOSEPH
发明人： WEIHS TIMOTHY P , LUNKING DAVID M , HEIAN ELLEN M , XUN YUWEI , BOWMAN RICHARD , CATIG GARY , VAN HEERDEN DAVID , VALLIAPAN SOMASUNDARAM , KNIO OMAR , GRZYB JOSEPH
IPC分类号： B23K35/12 , B23K20/08 , B32B15/01
CPC分类号： C06C15/00 , F41J2/02 , F42B4/26 , F42B12/42
摘要： A reactive composite structure (RCS) having selected energetic and mechanical properties, and methods of making reactive composite structures (RCSs) enabling the construction of complex parts and components by machining and forming of reactive composite materials (RCMs) without compromising the energetic or mechanical properties of the resulting reactive composite structure (RCS).
摘要翻译：具有选择的能量和机械性能的反应性复合结构（RCS）以及制造反应性复合结构（RCS）的方法，其能够通过机械加工和形成反应性复合材料（RCM）来构建复杂部件和部件，而不损害能量或机械性能的所得反应性复合结构（RCS）。

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