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51. 发明申请

WO2020101856A2 3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM 审中-公开
公开(公告)号：WO2020101856A2
公开(公告)日：2020-05-22
申请号：PCT/US2019/057757
申请日：2019-10-24
申请人： CORNING INCORPORATED
发明人： KIM, Hoon , MAZUMDER, Prantik , REZIKYAN, Aram , VADDI, Rajesh
IPC分类号： C23C18/18 , C23C18/16 , C23C16/00
摘要： In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO x ) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

52. 发明申请

WO2020068436A1 METHODS FOR INCREASING ADHESION BETWEEN METALLIC FILMS AND GLASS SURFACES AND ARTICLES MADE THEREFROM 审中-公开
公开(公告)号：WO2020068436A1
公开(公告)日：2020-04-02
申请号：PCT/US2019/050731
申请日：2019-09-12
申请人： CORNING INCORPORATED
发明人： BOOKBINDER, Dana Craig , GU, Yunfeng , MAZUMDER, Prantik , VADDI, Rajesh
IPC分类号： C23C18/12 , C23C18/18 , C23C18/16 , C25D5/54 , C03C17/25 , C03C17/27 , C03C17/34 , C03C17/36 , C25D7/12
摘要： Methods of plating a metal on a substrate including coating a nanoporous metal-oxide layer on a surface of the substrate prior to metal plating. Methods may include coating a surface of the substrate with a slurry including colloidal metal-oxide precursor particles and aluminum oxide particles. After coating, the slurry may be calcinated on the surface of the substrate to form a nanoporous metal-oxide layer on the surface. Then, a metallic film may be plated on the nanoporous metal-oxide layer. The metallic film may be plated by an electroless plating method and/or an electroplating method. Articles, such as electronic interposers, may be made using the methods of plating a metal described herein.

53. 发明申请

WO2019204557A1 3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM 审中-公开
公开(公告)号：WO2019204557A1
公开(公告)日：2019-10-24
申请号：PCT/US2019/028039
申请日：2019-04-18
申请人： CORNING INCORPORATED
发明人： BOOKBINDER, Dana Craig , GU, Yunfeng , MAZUMDER, Prantik , VADDI, Rajesh
IPC分类号： C03C23/00 , C03C15/00 , C03C17/10
摘要： In some embodiments, a method comprises leaching a surface of a glass or glass ceramic substrate to form a leached layer. The glass or glass ceramic substrate comprises a multi-component material. The material has a bulk composition, in mol% on an oxide basis: 51% to 90% SiO 2 ; 10% to 49% total of minority components RO x . Leaching comprises selectively removing components RO x of the glass or glass ceramic substrate preferentially to removal of SiO 2 . In the leached layer, the RO x concentration is 50% or less than the RO x concentration of the bulk composition.

54. 发明申请

WO2019099826A1 DIRECT GRAPHENE TRANSFER AND GRAPHENE-BASED DEVICES 审中-公开
公开(公告)号：WO2019099826A1
公开(公告)日：2019-05-23
申请号：PCT/US2018/061518
申请日：2018-11-16
申请人： CORNING INCORPORATED , INSTITUTE OF PHOTONICS SCIENCES
发明人： ARLIGUIE, Therese Francoise , CHANG, Theresa , MARTIN-FRANCES, Miriam Marchena , MAZUMDER, Prantik , PRUNERI, Valerio , WAGNER, Frederic Christian
IPC分类号： C01B32/194
CPC分类号： C01B32/194 , C01B2204/22
摘要： A method of forming a functionalized device substrate is provided that includes the steps of: forming a graphene layer on a growth substrate; applying a polyimide layer to a glass, glass-ceramic or ceramic substrate, wherein a coupling agent couples the polyimide layer to the said substrate; coupling the polyimide layer to the graphene layer on the growth substrate; and peeling the growth substrate from the graphene layer.

55. 发明申请

WO2018038961A1 ARTICLES OF CONTROLLABLY BONDED SHEETS AND METHODS FOR MAKING SAME 审中-公开
标题翻译：可控结合片材的制品及其制造方法
公开(公告)号：WO2018038961A1
公开(公告)日：2018-03-01
申请号：PCT/US2017/046836
申请日：2017-08-15
申请人： CORNING INCORPORATED
发明人： BELLMAN, Robert Alan , FENG, Jiangwei , MAZUMDER, Prantik
IPC分类号： B32B27/00 , B32B27/28 , B32B37/24
摘要： Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example an aromatic polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the thin sheet, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature processing while preventing a permanent bond during high temperature processing.
摘要翻译：本文描述了制造包括薄片和载体的制品（例如玻璃制品）的制品和方法，其中薄片和载体例如使用改性（涂层）层粘合在一起，例如芳族聚合物涂层以及可以施加在薄片，载体或两者上的相关沉积方法和惰性气体处理以控制薄片和载体之间的范德华力，氢和共价键。改性层将薄片和载体粘合在一起，具有足够的粘合强度以防止在高温加工期间薄片和载体的分层，同时防止高温加工期间的永久粘合。

56. 发明申请

WO2015157202A1 DEVICE MODIFIED SUBSTRATE ARTICLE AND METHODS FOR MAKING 审中-公开
标题翻译：装置修改的基材制品和制造方法
公开(公告)号：WO2015157202A1
公开(公告)日：2015-10-15
申请号：PCT/US2015/024600
申请日：2015-04-07
申请人： CORNING INCORPORATED
发明人： ADIB, Kaveh , BELLMAN, Robert Alan , MANLEY, Robert George , MAZUMDER, Prantik
IPC分类号： B32B7/06 , B32B17/06 , C03C17/245
CPC分类号： B32B7/06 , B32B17/06 , C03C15/00 , C03C23/006 , C03C2218/355
摘要： A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.
摘要翻译：一种制造具有支撑在玻璃载体基板上的装置改性基板的装置基板制品的方法，包括：处理装置基板的第一表面的至少一部分，玻璃载体的第一表面的至少一部分，或其组合，其中所述处理产生具有硅的表面; 氧; 碳; 和氟量; 和金属与氟的比率; 使经处理的表面与未处理或类似处理的对应装置基板或玻璃载体基板接触以形成由与玻璃载体基板结合的装置基板组成的层压体; 通过至少一种器件表面改性处理来修饰层压体的器件衬底的非结合的第二表面的至少一部分; 以及将具有装置改性的第二表面的装置基板与玻璃载体基板分离。

57. 发明申请

WO2015113020A1 ARTICLES AND METHODS FOR CONTROLLED BONDING OF POLYMER SURFACES WITH CARRIERS 审中-公开
标题翻译：聚合物表面与载体的控制结合的文章和方法
公开(公告)号：WO2015113020A1
公开(公告)日：2015-07-30
申请号：PCT/US2015/013012
申请日：2015-01-27
申请人： CORNING INCORPORATED
发明人： BELLMAN, Robert Alan , MANLEY, Robert George , MAZUMDER, Prantik , SIMONTON, Kristi Lynn
IPC分类号： H01L21/58 , H01L51/56
CPC分类号： H01L51/0545 , H01L27/1218 , H01L27/1266 , H01L29/78603 , H01L51/003 , H01L51/0097 , H01L51/052 , Y02E10/549
摘要： A substrate having a polymer bonding surface with a first surface energy, a carrier having a glass bonding surface with a second surface energy, and a plasma-polymerized surface modification layer releasably bonding the polymer bonding surface to the glass bonding surface. The plasma polymerized layer may be formed so as to decrease the surface energy of the glass bonding surface prior to bonding. And the substrate may by non-destructively debonded from the carrier after being subjected to a one hour vacuum anneal in an environment having a temperature of 120°C.
摘要翻译：具有具有第一表面能的聚合物接合面的基板，具有第二表面能的玻璃接合面的载体和将聚合物接合面可剥离地接合到玻璃接合面的等离子体聚合表面改性层。可以形成等离子体聚合层，以便在结合之前降低玻璃粘合表面的表面能。并且，在温度为120℃的环境中进行1小时的真空退火后，基板可以与载体非破坏性地脱粘。

58. 发明申请

WO2003048409A1 APPARATUS FOR DEPOSITING A PLASMA CHEMICAL VAPOR DEPOSITION COATING ON THE INSIDE OF AN OPTICAL FIBER PREFORM 审中-公开
标题翻译：用于沉积光学纤维预制件内部的等离子体化学气相沉积涂料的装置
公开(公告)号：WO2003048409A1
公开(公告)日：2003-06-12
申请号：PCT/US2002/034479
申请日：2002-10-31
申请人： CORNING INCORPORATED
发明人： HOUSE, Keith L , KHANNA, Samir , LANE, Barton, G., III , MAZUMDER, Prantik
IPC分类号： C23C16/00
CPC分类号： H05B6/701 , C03B37/0183 , C03C17/004 , C23C16/045 , C23C16/511 , H01J37/32192 , H05B6/806
摘要： This present invention is directed to an apparatus for depositing a plasma chemical vapor deposition (PCVD) coating on the inside of a preform used for the drawing of optical fibers. This invention further relates to a novel microwave applicator design used in the apparatus; preferably allowing for a more intense, circumferentially symmetric plasma about the longitudinal axis of the preform, under normal operating conditions; resulting in a more uniform coating and a reduced applicator length, and a method for making the coated preform.
摘要翻译：本发明涉及一种用于在用于拉制光纤的预成型件内部沉积等离子体化学气相沉积（PCVD）涂层的装置。本发明还涉及在该装置中使用的新颖的微波施加器设计; 优选地在正常操作条件下允许围绕预成型件的纵向轴线的更强烈的周向对称等离子体; 导致更均匀的涂层和减少的施加器长度，以及制造涂覆的预成型件的方法。

59. 发明申请

WO2020081306A1 GRAPHENE DOPING BY THERMAL POLING 审中-公开
公开(公告)号：WO2020081306A1
公开(公告)日：2020-04-23
申请号：PCT/US2019/055288
申请日：2019-10-09
申请人： CORNING INCORPORATED , THE INSTITUTE OF PHOTONIC SCIENCES
发明人： MARCHENA MARTIN-FRANCES, Miriam , MAZUMDER, Prantik , PRUNERI, Valerio
IPC分类号： C01B32/194 , B82Y30/00 , H01L31/0392 , C03C21/00 , C03C23/00 , G02F1/355
摘要： A method of forming a graphene device includes: providing a glass substrate with a blocking layer disposed thereon to form a stack; providing a first electrode and a second electrode; increasing the temperature of the stack to at least 100°C; applying an external electric field (V P ) to the first electrode such that at least one metal ion of the glass substrate migrates toward the first electrode to create a depletion region in the glass substrate adjacent the second electrode; decreasing the temperature of the stack to room temperature while applying the external electric field to the first electrode; and after reaching room temperature, setting the external electric field to zero to create a frozen voltage region adjacent the second electrode.

60. 发明申请

WO2019226444A1 METHODS OF INCREASING ADHESION BETWEEN A CONDUCTIVE METAL AND AN OXIDE SUBSTRATE AND ARTICLES MADE THEREFROM 审中-公开
公开(公告)号：WO2019226444A1
公开(公告)日：2019-11-28
申请号：PCT/US2019/032578
申请日：2019-05-16
申请人： CORNING INCORPORATED
发明人： BROWN, Philip Simon , GU, Yunfeng , KANUNGO, Mandakini , MAZUMDER, Prantik , VADDI, Rajesh
IPC分类号： C03C17/36 , C03C17/40
摘要： A method for bonding a conductive metal to an oxide substrate includes applying a porous coating to a surface of the oxide substrate, the porous coating including a porous oxide and catalyst nanoparticles dispersed therein, and depositing a conductive metal onto the porous coating. A portion of the conductive metal may be deposited within the pores of the porous coating to couple the conductive metal to the porous coating. Articles are also disclosed that include the oxide substrate, the porous coating coupled to a surface of the oxide substrate, and the conductive metal coupled to the porous coating. The porous coating may include a porous oxide and catalyst nanoparticles dispersed within the metal oxide. A portion of the conductive metal may be deposited within the pores of the porous coating to interlock the conductive metal to the porous coating.

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