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    • 51. 发明申请
    • GESTURE PRE-PROCESSING OF VIDEO STREAM USING A MARKERED REGION
    • 使用标记区域对视频流进行预处理
    • WO2014093347A1
    • 2014-06-19
    • PCT/US2013/074135
    • 2013-12-10
    • INTEL CORPORATIONBURR, Jeremy
    • BURR, Jeremy
    • G06T7/20G06F3/01
    • G06F3/017G06F3/0304G06K9/00228G06K9/00234G06K9/00355G06K9/00993G06K9/2054
    • Techniques are disclosed for processing a video stream to reduce platform power by employing a stepped and distributed pipeline process, wherein CPU-intensive processing is selectively performed. The techniques are particularly well-suited for hand-based navigational gesture processing. In one example case, for instance, the techniques are implemented in a computer system wherein initial threshold detection (image disturbance) and optionally user presence (hand image) processing components are proximate to or within the system's camera, and the camera is located in or proximate to the system's primary display. In some cases, image processing and communication of pixel information between various processing stages which lies outside a markered region is suppressed. In some embodiments, the markered region is aligned with, a mouse pad or designated desk area or a user input device such as a keyboard. Pixels evaluated by the system can be limited to a subset of the markered region.
    • 公开了用于处理视频流以降低平台功率的技术,其中采用阶梯式和分布式流水线处理,其中选择性地执行CPU密集型处理。 这些技术特别适用于基于手的导航手势处理。 在一个示例情况下,例如,这些技术在计算机系统中实现,其中初始阈值检测(图像干扰)和可选地用户存在(手图像)处理部件靠近或在系统的相机内,并且相机位于或 靠近系统的主显示。 在某些情况下,抑制位于标记区域之外的各处理级之间的像素信息的图像处理和通信。 在一些实施例中,标记区域与鼠标垫或指定的桌面区域或诸如键盘的用户输入设备对准。 由系统评估的像素可以限于标记区域的子集。
    • 53. 发明申请
    • SELF-ENCLOSED ASYMMETRIC INTERCONNECT STRUCTURES
    • 自封不对称互连结构
    • WO2013101204A1
    • 2013-07-04
    • PCT/US2011/068159
    • 2011-12-30
    • INTEL CORPORATIONBOYANOV, Boyan
    • BOYANOV, Boyan
    • H01L21/28
    • H01L23/522H01L21/768H01L21/76804H01L21/76829H01L21/76834H01L21/76849H01L21/76883H01L21/76897H01L23/5226H01L23/53295H01L2924/0002H01L2924/00
    • Techniques are disclosed that enable improved shorting margin between unlanded conductive interconnect features and neighboring conductive features. The techniques provided are particularly useful, for instance, when lithography registration errors cause neighboring conductive features to be physically closer than expected, but can also be used when such proximity is intentional. In some embodiments, the techniques can be implemented using a layer of electromigration management material (EMM) and one or more insulator layers, wherein the various layers are provisioned to enable a differential etch rate. In particular, the overall etch rate of materials above the target landing pad is faster than the overall etch rate of materials above the off-target landing pad, which results in a self-enclosed conductive interconnect feature having an asymmetric taper or profile. The differential etch rate may result, for example, from configuration of the EMM layer, or from accompanying insulator layers having different etch rates.
    • 公开了能够改善未上行的导电互连特征与相邻导电特征之间的短路裕度的技术。 所提供的技术特别有用,例如,当光刻注册误差导致相邻的导电特征物理上比预期的更近,但是当这种接近是有意的时也可以使用。 在一些实施例中,可以使用电迁移管理材料层(EMM)和一个或多个绝缘体层来实现这些技术,其中提供各种层以实现差分蚀刻速率。 特别地,目标着陆焊盘上方的材料的总体蚀刻速率比在靶外着陆焊盘上方的材料的总体蚀刻速度更快,这导致具有不对称锥度或轮廓的自封闭导电互连特征。 差分蚀刻速率可以由例如EMM层的构造或者具有不同蚀刻速率的伴随的绝缘体层产生。
    • 56. 发明申请
    • MACRO-TRANSISTOR DEVICES
    • 宏器件设备
    • WO2013074076A1
    • 2013-05-23
    • PCT/US2011/060652
    • 2011-11-14
    • INTEL CORPORATIONHYVONEN, SamiRIZK, Jad B.O'MAHONY, Frank
    • HYVONEN, SamiRIZK, Jad B.O'MAHONY, Frank
    • H01L27/00H01L21/768
    • H01L27/0886H01L27/088H01L27/1211H01L29/42376H01L29/66181H01L29/785H01L29/93H01L29/94H03L7/099
    • Macro-transistor structures are disclosed. In some cases, the macro-transistor structures have the same number of terminals and properties similar to long-channel transistors, but are suitable for analog circuits in deep submicron technologies deep-submicron process nodes. The macro-transistor structures can be implemented, for instance, with a plurality of transistors constructed and arranged in series, and with their gates tied together, generally referred to herein as a transistor stack. One or more of the serial transistors within the stack can be implemented with a plurality of parallel transistors and/or can have a threshold voltage different that is different from the threshold voltages of other transistors in the stack. Alternatively, or in addition, one or more of the serial transistors within the macro-transistor can be statically or dynamically controlled to tune the performance characteristics of the macro-transistor. The macro-transistors can be used in numerous circuits, such as varactors, VCOs, PLLs, and tunable circuits.
    • 公开了宏观晶体管结构。 在一些情况下,宏晶体管结构具有与长沟道晶体管类似的端子和性质相同的数量,但适用于深亚微米技术深亚微米工艺节点中的模拟电路。 宏晶体管结构可以例如通过串联构造和布置的多个晶体管实现,并且其栅极连接在一起,这里通常称为晶体管堆叠。 堆叠内的一个或多个串联晶体管可以用多个并联晶体管实现和/或可以具有不同于堆叠中其它晶体管的阈值电压的阈值电压。 或者或另外,宏晶体管内的一个或多个串联晶体管可以被静态或动态地控制,以调整宏晶体管的性能特性。 宏晶体管可用于许多电路,例如变容二极管,VCO,PLL和可调谐电路。
    • 57. 发明申请
    • ANTIFUSE ELEMENT UTILIZING NON-PLANAR TOPOLOGY
    • 使用非平面拓扑学的抗体元件
    • WO2013058746A1
    • 2013-04-25
    • PCT/US2011/056760
    • 2011-10-18
    • INTEL CORPORATIONHAFEZ, Walid M.JAN, Chia-HongTSAI, CurtisPARK, JoodongYEH, Jeng-Ya D.
    • HAFEZ, Walid M.JAN, Chia-HongTSAI, CurtisPARK, JoodongYEH, Jeng-Ya D.
    • H01L23/62H01L21/82H01L29/78
    • H01L27/11206H01L21/823821H01L23/5252H01L27/0924H01L29/7853H01L2924/0002H01L2924/00
    • Techniques for providing non-volatile antifuse memory elements and other antifuse links are disclosed herein. In some embodiments, the antifuse memory elements are configured with non-planar topology such as FinFET topology. In some such embodiments, the fin topology can be manipulated and used to effectively promote lower breakdown voltage transistors, by creating enhanced-emission sites which are suitable for use in lower voltage non-volatile antifuse memory elements. In one example embodiment, a semiconductor antifuse device is provided that includes a non-planar diffusion area having a fin configured with a tapered portion, a dielectric isolation layer on the fin including the tapered portion, and a gate material on the dielectric isolation layer. The tapered portion of the fin may be formed, for instance, by oxidation, etching, and/or ablation, and in some cases includes a base region and a thinned region, and the thinned region is at least 50% thinner than the base region.
    • 本文公开了用于提供非易失性反熔丝存储元件和其它反熔丝链路的技术。 在一些实施例中,反熔丝存储器元件被配置为非平面拓扑,例如FinFET拓扑。 在一些这样的实施例中,可以通过产生适合用于较低电压非易失性反熔丝存储器元件的增强发射位点来操纵翅片拓扑并用于有效地促进较低击穿电压晶体管。 在一个示例实施例中,提供了一种半导体反熔丝装置,其包括具有锥形部分的翅片的非平面扩散区域,在包括锥形部分的鳍片上的介电隔离层和介电隔离层上的栅极材料。 翅片的锥形部分可以例如通过氧化,蚀刻和/或烧蚀形成,并且在一些情况下包括基底区域和变薄区域,并且变薄区域比基底区域薄至少50% 。
    • 59. 发明申请
    • MULTIUSER DETECTION WITH TARGETED ERROR CORRECTION CODING
    • 多重检测与指定的错误修正编码
    • WO2005125137A2
    • 2005-12-29
    • PCT/US2004/026254
    • 2004-08-11
    • BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.MILLS, Diane, G.
    • MILLS, Diane, G.
    • H04L27/06
    • H04B1/7103H03M13/2957H03M13/37H03M13/63H04B1/7105H04L1/0048H04L1/005H04L1/0071H04L25/03171
    • An error correction decoding (ECC) processing scheme is disclosed that reduces computational complexity normally associated with multiuser detection (e.g., TurboMUD) solutions, without causing degradation in quality of service or decreasing the total throughput. Error correction decoding algorithms are applied only to portions of the estimates that were affected by the immediately previous MUD update process. Even though the MUD and/or ECC updating is targeted so as to reduce complexity of each iteration, all of the estimates are maintained and remain candidates for future updates. As such, there is no negative impact real-time or future performance. This targeting approach can be used in conjunction with many variations of MUD, including full-complexity or reduced complexity, and may include MUD with confidence ordering or voting, and other techniques for facilitating e fficient and effective MUD processing.
    • 公开了一种降低与多用户检测(例如,TurboMUD)解决方案通常相关联的计算复杂度的纠错解码(ECC)处理方案,而不会降低服务质量或降低总吞吐量。 误差校正解码算法仅适用于受即时MUD更新过程影响的估计部分。 即使MUD和/或ECC更新是针对性的,以减少每次迭代的复杂性,所有的估计都被维护,并且仍然是未来更新的候选者。 因此,实时或未来的表现没有负面影响。 这种目标方法可以与MUD的许多变体一起使用,包括完全复杂性或降低的复杂性,并且可以包括具有置信排序或投票的MUD以及用于促进有效和有效的MUD处理的其它技术。