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41. 发明申请

WO2007038037A1 FLEXIBLE ABRASIVE ARTICLE AND METHODS OF MAKING AND USING THE SAME 审中-公开
标题翻译：柔性磨料制品及其制造方法和使用方法
公开(公告)号：WO2007038037A1
公开(公告)日：2007-04-05
申请号：PCT/US2006/036160
申请日：2006-09-18
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： ANNEN, Michael, J. , KOEHNLE, Gregory, A. , SCHUTZ, James, W. , OWEN, Ian, R, , EVERAERTS, Albert, I.
IPC分类号： B24D11/00 , B24D3/32
CPC分类号： B24D11/001 , B24D3/32
摘要： Flexible abrasive article comprising a compressible backing having first and second opposed major surfaces; an elastic polyurethane film affixed to at least a portion of the first major surface of the compressible backing; an optional extensible tie layer affixed to at least a portion of the elastic polyurethane film; and an abrasive layer affixed to at least a portion of the optional extensible tie layer or elastic polyurethane film, the abrasive layer comprising abrasive particles and a binder. Methods of making and using the flexible abrasive article are also disclosed.
摘要翻译：柔性磨料制品包括具有第一和第二相对主表面的可压缩背衬; 弹性聚氨酯膜，固定在可压缩背衬的第一主表面的至少一部分上; 固定在所述弹性聚氨酯膜的至少一部分上的任选的可延伸粘结层; 以及粘附到所述任选的可延伸粘结层或弹性聚氨酯膜的至少一部分的研磨层，所述研磨层包含磨料颗粒和粘合剂。还公开了制造和使用柔性磨料制品的方法。

42. 发明申请

WO2006121080A1 球状樹脂粒子を含有する歯科用研磨材审中-公开
标题翻译：含有球形树脂颗粒的牙齿抛光剂
公开(公告)号：WO2006121080A1
公开(公告)日：2006-11-16
申请号：PCT/JP2006/309404
申请日：2006-05-10
申请人：株式会社松風 , 薗井秀次 , 浅尾修
发明人：薗井秀次 , 浅尾修
IPC分类号： A61C3/06 , B24D3/02 , B24D3/32
CPC分类号： A61C3/06 , B24D3/32
摘要：　本発明は、歯科用コンポジットレジン、陶材および歯科用修復物や歯牙を安価で簡便にしかも短時間で光沢研磨可能な研磨性に優れた歯科用研磨材を提供する。より詳しくは、本発明は、エラストマー系バインダーに研磨砥粒を配合した研磨部を有する歯科用研磨材であって、研磨部がさらに球状樹脂粒子を含有することを特徴とする歯科用研磨材を提供する。
摘要翻译：旨在提供一种牙科研磨剂，其显示出优异的研磨性能，通过该牙科研磨剂可以在短时间内经济地和方便地磨擦用于牙齿用的复合树脂，陶瓷材料，牙科修复材料和牙齿，以获得良好的光泽。更具体地说，具有研磨部的牙科研磨剂，其包含与弹性体类粘合剂混合的研磨颗粒，其特征在于，所述研磨部还含有球形树脂颗粒。

43. 发明申请

WO02028980A2 AGGLOMERATE ABRASIVE GRAIN AND A METHOD OF MAKING THE SAME 审中-公开
标题翻译：研磨磨粒及其制备方法
公开(公告)号：WO02028980A2
公开(公告)日：2002-04-11
申请号：PCT/US2001/042525
申请日：2001-10-05
IPC分类号： B24D3/00 , B24D3/06 , B24D3/32 , B24D18/00 , C04B28/00 , C04B35/00 , C04B35/10 , C04B35/111 , C04B35/44 , C04B35/622 , C04B35/63 , C09K3/14
CPC分类号： C04B35/00 , B24D3/04 , B24D3/06 , B24D18/00 , C04B35/1115 , C04B35/44 , C04B35/622 , C04B35/62815 , C04B35/62886 , C04B35/6303 , C04B35/6316 , C04B2235/3206 , C04B2235/3218 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3272 , C04B2235/3275 , C04B2235/443 , C04B2235/5427 , C04B2235/5472 , C04B2235/6021 , C04B2235/77 , C09K3/1409 , C09K3/1427 , C09K3/1436 , Y10T428/2982 , Y10T428/2991 , Y10T428/2993 , Y10T428/2996 , Y10T428/2998
摘要： Agglomerate abrasive grain is disclosed. The agglomerate abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes. A method of making agglomerate abrasive grain is also disclosed.
摘要翻译：公开了聚集磨料颗粒。附聚磨料颗粒可以结合到磨料产品中，例如涂覆磨料，粘结磨料，无纺布磨料和研磨刷。还公开了一种制造附聚磨料颗粒的方法。

44. 发明申请

WO02022309A1 POLISHING PAD COMPRISING PARTICULATE POLYMER AND CROSSLINKED POLYMER BINDER 审中-公开
标题翻译：包含聚合物和交联聚合物粘合剂的抛光垫
公开(公告)号：WO02022309A1
公开(公告)日：2002-03-21
申请号：PCT/US2001/028948
申请日：2001-09-14
IPC分类号： B24B37/24 , B24D3/32 , B24D13/12 , B24D13/14 , B24B37/04
CPC分类号： B24B37/24 , B24D3/32 , B24D13/12
摘要： A polishing pad (6) is described as comprising, (a) particulate polymer selected from particulate thermoplastic polymer (20) (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) crosslinked organic polymer binder (26) (e.g., crosslinked polyurethane binder and/or crosslinked polyepoxide binder), which binds the particulate polymer (20) together. The particulate polymer (20) and crosslinked organic polymer binder (26) are distributed substantially uniformly throughout the polishing pad (6), and the pad (6) has a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad (6). Polishing pad (6) assemblies are also described.
摘要翻译：抛光垫（6）被描述为包括：（a）选自颗粒状热塑性聚合物（20）（例如颗粒状热塑性聚氨酯），颗粒状交联聚合物（例如，颗粒状交联聚氨酯和/或颗粒状交联聚环氧化物）和混合物物; 和（b）将颗粒聚合物（20）结合在一起的交联的有机聚合物粘合剂（26）（例如，交联的聚氨酯粘合剂和/或交联的聚环氧化物粘合剂）。颗粒聚合物（20）和交联的有机聚合物粘合剂（26）基本均匀地分布在整个抛光垫（6）中，并且垫（6）的孔体积百分比为2体积％至50体积％关于所述抛光垫（6）的总体积。还描述了抛光垫（6）组件。

45. 发明申请

WO00064631A1 METHOD FOR GRINDING GLASS 审中-公开
标题翻译：研磨玻璃的方法
公开(公告)号：WO00064631A1
公开(公告)日：2000-11-02
申请号：PCT/US2000/010915
申请日：2000-04-21
IPC分类号： B24B7/24 , B24B21/00 , B24D3/32 , B24D3/34 , B24D11/00
CPC分类号： B24B7/241 , B24D3/32 , B24D3/346 , B24D11/001
摘要： A method of grinding a glass or other workpiece is described comprising the steps of: contacting a grinding layer (22) of a flexible abrasive article (10) with the surface of a glass workpiece, the grinding layer comprising abrasive grit dispersed in a bonding matrix (15), the matrix (15) attached to a flexible backing (12); and moving the grinding layer (22) of the flexible abrasive article (10) and the surface of the glass workpiece relative to one another at a velocity of at least about 16.5 meters per second to provide a final surface roughness Ra less than about 0.030 micrometer.
摘要翻译：描述了一种研磨玻璃或其它工件的方法，其包括以下步骤：将柔性磨料制品（10）的研磨层（22）与玻璃工件的表面接触，研磨层包括分散在粘合基质中的磨粒（15），所述基体（15）附接到柔性背衬（12）上; 以及以至少约16.5米/秒的速度相对于彼此移动所述柔性磨料制品（10）的研磨层（22）和所述玻璃工件的表面，以提供小于约0.030微米的最终表面粗糙度Ra 。

46. 发明申请

WO99055493A1 POLISHING GRINDING WHEEL AND SUBSTRATE POLISHING METHOD WITH THIS GRINDING WHEEL 审中-公开
标题翻译：抛光砂轮和抛光轮抛光方法
公开(公告)号：WO99055493A1
公开(公告)日：1999-11-04
申请号：PCT/JP1999/002270
申请日：1999-04-28
IPC分类号： B24B1/00 , B24B37/04 , B24B37/24 , B24B53/017 , B24D3/32 , H01L21/304
CPC分类号： B24B37/245 , B24B37/042 , B24B53/017 , B24D3/32 , H01L21/31053 , H01L21/3212
摘要： A grinding wheel capable of polishing only protruded parts and having a self-stop function so that the polishing is terminated automatically when irregularities have been eliminated by the polishing and a polishing method using the grinding wheel in the polishing of a semiconductor wafer having irregular patterns on its surface, the grinding wheel for polishing a substrate to flat- and mirror-shape comprising abrasive grains of 2 mu m or less in particle size and 90 % or more in purity, with an abrasive grain to binder composition ratio (volume ratio) of 1: 0.5 or more (the ratio of binder to abrasive grain is 0.5 or more to 1), and with an abrasive grain of 10 % or higher, a binder of 60 % or less, and pores of 10 to 40 %. A substrate polishing method wherein the substrate having a surface forming irregularities thereon is polished with a grinding wheel, comprising the steps of polishing, for a specified time, the polish surface of the substrate under the condition that liquid not containing abrasive grains is supplied to the polishing surface of the grinding wheel so as to eliminate the irregularities on the surface for smoothening and feeding abrasive grains to the smoothened polished surface of the substrate for further polishing the polished surface uniformly by a specified film thickness.
摘要翻译：一种能够仅抛光突出部分并且具有自动停止功能的研磨轮，使得当通过抛光消除不规则性时抛光被自动终止，以及在抛光具有不规则图案的半导体晶片的抛光方法的抛光方法其表面，用于将基板研磨成平面和镜面形状的砂轮，其包括粒度为20μm以下的磨粒，纯度为90％以上，磨粒与粘合剂组成比（体积比） 1：0.5以上（粘合剂与磨粒的比例为0.5以上1），磨粒为10％以上，粘合剂为60％以下，孔为10〜40％。一种衬底抛光方法，其中具有在其上形成凹凸的表面的衬底用研磨轮抛光，包括以下步骤：在不含磨料的液体被供应到所述衬底的条件下抛光所述衬底的抛光表面研磨砂轮的抛光表面，以消除表面上的凹凸，使磨粒平滑并将磨料颗粒送入基板的平滑抛光表面，以进一步抛光抛光表面指定的膜厚度。

47. 发明申请

WO99024218A1 MANUFACTURING A MEMORY DISK OR SEMICONDUCTOR DEVICE USING AN ABRASIVE POLISHING SYSTEM, AND POLISHING PAD 审中-公开
标题翻译：使用抛光抛光系统和抛光垫制造记忆盘或半导体器件
公开(公告)号：WO99024218A1
公开(公告)日：1999-05-20
申请号：PCT/US1998/023575
申请日：1998-11-05
IPC分类号： B24B37/26 , B24B41/047 , B24B53/00 , B24B53/007 , B24B53/017 , B24D3/28 , B24D3/32 , B24D3/34 , B24D13/10 , B24D13/14 , B29C70/58 , B29C70/66 , C08J5/14 , G11B23/00 , H01L21/304 , H01L21/306 , H01L21/3105 , B24B1/00
CPC分类号： H01L21/02024 , B24B37/26 , B24B41/047 , B24B53/00 , B24B53/017 , B24D3/28 , B24D3/32 , B24D3/34 , B24D13/10 , B29C70/58 , B29C70/66 , B29L2031/736 , G11B23/0021 , H01L21/30604 , H01L21/30625 , H01L21/31053
摘要： Method of manufacturing a memory disk or a semiconductor device using a polishing apparatus (100) having a substrate and a fixed abrasive pad (6), the fixed abrasive pad (6) having a three-dimensional fixed abrasive polishing layer having a plurality of protrusions (16) and recesses (14) between the protrusions (16) and a plurality of nanoasperities, the abrasive polishing layer comprising a plurality of particles (18), the average particle size multiplied by the particle's valley abrasion number is less than 300, the polishing layer further comprising a polishing surface.
摘要翻译：使用具有基板和固定研磨垫（6）的抛光装置（100）制造存储盘或半导体装置的方法，所述固定研磨垫（6）具有三维固定研磨抛光层，所述三维固定研磨抛光层具有多个突起（16）和所述突起（16）之间的凹部（14）和多个纳米级别，所述研磨抛光层包括多个颗粒（18），所述平均粒度乘以所述颗粒的谷磨耗数小于300，抛光层还包括抛光表面。

48. 发明申请

WO98047662A1 POLISHING PAD FOR A SEMICONDUCTOR SUBSTRATE 审中-公开
标题翻译：用于半导体衬底的抛光垫
公开(公告)号：WO98047662A1
公开(公告)日：1998-10-29
申请号：PCT/US1998/007908
申请日：1998-04-17
IPC分类号： B24B37/22 , B24B37/24 , B24B41/047 , B24D3/32 , B24D13/14 , H01L21/304 , B24B37/04
CPC分类号： B24B37/24 , B24B37/22 , B24B41/047 , B24D3/32
摘要： A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage.
摘要翻译：一种用于抛光半导体晶片的抛光垫，其包括具有合成树脂烧结颗粒的开孔多孔基材。多孔基材是均匀，连续且曲折的互连网络的毛细管通道。

49. 发明申请

WO2022034443A1 ABRASIVE ARTICLES AND METHOD OF MAKING THE SAME 审中-公开
公开(公告)号：WO2022034443A1
公开(公告)日：2022-02-17
申请号：PCT/IB2021/057167
申请日：2021-08-04
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： LIU, Yuyang , ZHANG, Jing , LI, Junting
IPC分类号： B24D3/28 , B24B55/06 , B24D3/32 , B24D11/00 , B24D11/02 , B24D18/00 , B24D3/00 , B24B37/22 , B24B37/24
摘要： An abrasive article comprises: a substrate comprising strands forming first void spaces between strands; a laminate joined to the substrate, wherein the laminate comprises a surface opposite to the substrate; a resin composition joined to the surface of the laminate. First and second portions of the surface of the laminate have respective first and second surface free energies that are different. Another abrasive article comprises: a substrate comprising strands forming first void spaces between strands; a laminate joined to the substrate, wherein the laminate comprises a first polymer and a second polymer; a resin composition joined to the laminate; In both embodiments, abrasive particles are joined to the resin composition, and a plurality of second void spaces extends through the laminate coinciding with first void spaces in the porous substrate. A method of making abrasive articles is also disclosed.

50. 发明申请

WO2019050365A1 다공성 폴리우레탄 연마패드 및 이의 제조방법 审中-公开
公开(公告)号：WO2019050365A1
公开(公告)日：2019-03-14
申请号：PCT/KR2018/010562
申请日：2018-09-10
申请人： 에스케이씨 주식회사
发明人： 서장원 , 한혁희 , 허혜영 , 류준성 , 권영필
IPC分类号： B24D3/32 , B24D18/00 , C08L75/04 , C08J9/04 , C08J9/00
摘要： 구현예는 반도체의 화학적 기계적 평탄화 공정에 사용되는 다공성 폴리우레탄 연마패드 및 이의 제조방법에 관한 것으로서, 상기 다공성 폴리우레탄 연마패드는 고상 발포제인 열팽창된 마이크로 캡슐 및 기상 발포제인 불활성 기체를 사용하여 포어의 크기 및 분포를 조절함으로써, 연마성능을 조절할 수 있다.

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