会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 45. 发明申请
    • DISTRIBUTED PHYSICS BASED TRAINING SYSTEM AND METHODS
    • 基于分布式物理学的培训系统和方法
    • WO2007062260A2
    • 2007-05-31
    • PCT/US2006/045569
    • 2006-11-28
    • L-3 COMMUNICATIONS CORPORATIONFALASH, MarkPOLLAK, EytanCHEN, YushanWILLIAMS, Jon
    • FALASH, MarkPOLLAK, EytanCHEN, YushanWILLIAMS, Jon
    • G06T15/00
    • G09B9/00H04L67/38
    • A distributed simulation system is composed of simulator stations linked over a network that each renders real-time video imagery for its user from scene data stored in its data storage. The simulation stations are each connected with a physics farm that manages the virtual objects in the shared virtual environment based on their physical attribute data using physics engines, including an engine at each simulation station. The physics engines of the physics farm are assigned virtual objects so as to reduce the effects of latency, to ensure fair fight requirements of the system, and, where the simulation is of a vehicle, to accurately model the ownship of the user at the station. A synchronizer system is also provided that allows for action of simulated entities relying on localized closed loop controls to cause the entities to meet specific goal points at specified system time points.
    • 分布式仿真系统由通过网络链接的模拟站组成,每个模拟站通过存储在其数据存储器中的场景数据为用户提供实时视频图像。 模拟站各自与物理场连接,该物理场基于使用物理引擎(包括每个模拟站处的引擎)的物理属性数据来管理共享虚拟环境中的虚拟对象。 物理场的物理引擎被分配虚拟对象,以减少延迟的影响,以确保系统的公平对抗要求,以及在模拟车辆的情况下,准确地对车站用户进行建模 。 还提供了同步器系统,其允许依赖于本地化闭环控制的模拟实体的动作使得实体在指定的系统时间点满足特定的目标点。
    • 48. 发明申请
    • HIGH DENSITY PACKAGING OF ELECTRONIC COMPONENTS
    • 电子元件的高密度包装
    • WO2002080309A1
    • 2002-10-10
    • PCT/US2002/005594
    • 2002-02-25
    • L-3 COMMUNICATIONS CORPORATIONWATSON, Edwin, George
    • WATSON, Edwin, George
    • H01R12/28
    • H05K7/023H01L23/5387H01L25/105H01L2225/1005H01L2225/1029H01L2225/107H01L2924/0002H05K1/14H01L2924/00
    • Disclosed is an electronics packaging systems, which provides for a high density assembly of groups (2a, 2b, 2c, 2d) of similar solid state part packages. The system provides a novel method which includes the use of interconnect members (5) and crossover members (8) for interconnecting the signal paths, structurally assembling and supporting the parts (2a, 2b, 2c, 2d), and removing heat generated within the components (1). The system approach disclosed typically starts at the level of assembling pre-packaged parts (2a, 2b, 2c, 2d) into modules, and permeates through to the printed circuit board (6, 9) and box levels of assembly. The system is applicable, but not limited to, solid state memory device packaging, which typically consists of many similar parts interconnected in a matrix bus type configuration. The assembly of a building block of numerous memory components allows for the modular construction of large amounts of solid state memory.
    • 公开了一种电子封装系统,其提供类似固态部件封装的组(2a,2b,2c,2d)的高密度组装。 该系统提供了一种新颖的方法,其包括使用互连构件(5)和用于互连信号路径的交叉构件(8),结构地组装和支撑部件(2a,2b,2c,2d),以及去除在 组件(1)。 所公开的系统方法通常从将预包装部件(2a,2b,2c,2d)组装成模块的级别开始,并且渗透到印刷电路板(6,9)和箱体组装。 该系统适用于但不限于固态存储器件封装,其通常由以矩阵总线类型配置互连的许多类似部件组成。 许多存储器组件的构建块的组装允许大量固态存储器的模块化构造。