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31. 发明申请

WO1994001599A1 METALLISATION OF PLASTICS 审中-公开
标题翻译：金属化塑料的
公开(公告)号：WO1994001599A1
公开(公告)日：1994-01-20
申请号：PCT/DE1993000599
申请日：1993-07-02
申请人： ATOTECH DEUTSCHLAND GMBH , BRANDES, Mariola , BRESSEL, Burkhard , MIDDEKE, Hermann-Josef , SCHREIER, Hans-Jürgen
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C23C18/22
CPC分类号： C23C18/22 , C23C18/26
摘要： The descrition relates to a process for metallising plastics in which the plastic surface is pretreated first in a solution of swelling agent containing compounds of general formula R1-(O-(CH2)n)m-OCO-R2 in which R1, R2 = CkH2k+1, n = 2 or 3 and k, m = 1, 2, 3 or 4, and then in a solution containing permanganate ions. In addition, there is an improved process for coating especially polymers with metal which provides better adhesion of the metal to the polymer substrate and a greater stability of the metal-polymer bond and reduced noble metal consumption in the catalysis/activation of the polymer surface.

32. 发明申请

WO1996028590A1 SOLUTION FOR USE IN THE ELECTROLYTIC DEPOSITION OF ZINC OR ZINC-ALLOY COATINGS 审中-公开
标题翻译：解锌或锌合金涂层的电解分离
公开(公告)号：WO1996028590A1
公开(公告)日：1996-09-19
申请号：PCT/EP1996001048
申请日：1996-03-11
申请人： ATOTECH DEUTSCHLAND GMBH , URRUTIA, Gonzalo, Desmaison , TORRE, Noceda, Santiago
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C25D03/22
CPC分类号： C25D3/22 , C25D3/565
摘要： The invention concerns an aqueous alkaline cyanide-free solution for use in the electrolytic deposition of lustrous and blister-free zinc or zinc-alloy coatings of uniform layer thickness on substrate surfaces. Electrolytic zinc- or zinc-alloy baths are used for depositing zinc or zinc-alloy coatings. The layers are partly decorative and for that reason the layers must have an even lustre across a wide current density range. However, sufficiently uniform layer thicknesses cannot be obtained on complex workpiece surfaces with sharp-edged structures and concave surface regions, and zinc and zinc-alloy layers deposited on such workpieces tend in addition to be more prone to blistering. These disadvantages are eliminated by a coating solution containing, in addition to the normal bath components, diallyl ammonium-sulphur dioxide copolymers of general structural formula (I) shown, and/or diallyldimethyl ammonium monomers.
摘要翻译：本发明涉及一种用于在衬底表面上有光泽，无气泡的锌或锌合金涂层具有均匀的层厚度的电解沉积含水碱性氰化物溶液。电解锌或锌合金浴被用于的锌涂层或它们的合金的沉积。该层先在这里见面，装饰物。因此，这些层必须是均匀的光泽，即使在宽的电流密度范围。然而，足够均匀的层厚度也是可能的上复杂形状的工件表面的锋利的结构和形成在另一凹表面区域。还通常具有这样的工件沉积锌及锌合金的层增加的趋势起泡。这些缺点可以避免用涂布液，包括在除了一般结构式（I）和/或二烯丙基二甲基单体的通常的浴组分烯丙基二氧化硫共聚物。

33. 发明申请

WO1995023999A1 AQUEOUS COMPOSITION FOR REMOVING POLYMER RESIST LAYERS FROM SUBSTRATE SURFACES AND ITS USE 审中-公开
标题翻译：用于聚合物的去除性水抗蚀剂组合物的基底表面及其应用层
公开(公告)号：WO1995023999A1
公开(公告)日：1995-09-08
申请号：PCT/EP1995000858
申请日：1995-03-06
申请人： ATOTECH DEUTSCHLAND GMBH , BARON, David, Thomas , SMITH, Michael, Leonhard , JOHAL, Kuldip, Singh
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： G03F07/32
CPC分类号： G03F7/425 , H01L21/31133
摘要： Aqueous compositions are disclosed for removing polymer resist layers from underlying surfaces, and the use of such compositions. Conventional aqueous solutions for removing polymer resist layers, for example from printed circuit cards, contain alkalinising agents, such as alkaline metal hydroxides or substituted ammonium hydroxides. Various additives are added to these solutions to prevent the composition from corroding the metallic surfaces of the printed circuit card. The removed resist material is substantially dissolved or suspended in the form of very small particles in the pickling composition. The disclosed pickling composition contains soluble silicates besides the alkalinising agents. Other additives are generally not required. These compositions remove the resists from the substrate surface in the form of large particles, so that their separation from the composition is possible without problems.
摘要翻译：本发明涉及一种用于去除聚合物抗蚀剂下层表面的层，并且使用这样的组合物的含水组合物。用于除去聚合的常规的水溶液抗蚀剂层，诸如印刷电路板，包括碱化剂，如碱金属或取代的铵的氢氧化物。为了防止对Mettallflächen电路板上的组合物的发作，这些解决方案的各种其它添加剂加入。所述光致抗蚀剂去除材料溶解在基本上脱除组合物或悬浮在非常小的颗粒在其中。根据本发明的汽提组合物另外含有除碱剂可溶性硅酸盐。其他添加剂通常不需要。用这些组合物，该抗蚀剂在从与基板面大的颗粒除去，从而使它们的去除可能是从组合物中容易。

34. 发明申请

WO1995023247A2 METHOD OF ELECTROLYTICALLY DEPOSITING METALS FROM ELECTROLYTES CONTAINING ORGANIC ADDITIVES 审中-公开
标题翻译：方法对于金属从电解质与PROZESSORGANIK电解分离
公开(公告)号：WO1995023247A2
公开(公告)日：1995-08-31
申请号：PCT/DE1995000297
申请日：1995-02-23
申请人： ATOTECH DEUTSCHLAND GMBH , SCHNEIDER, Reinhard
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C25D21/06
CPC分类号： C25D21/14 , H05K3/241
摘要： The invention concerns a method of electrolytically depositing metals from electrolytes containing organic additives designed to give particular physical properties. Such additives are continuously lost during galvanization, resulting in the formation of decomposition products which spread throughout the whole galvanization plant and are thus deposited on the articles being galvanized. The aim of the invention is therefore to avoid defects in the deposited layers caused by organic residues, thus ensuring continuous deposition of the metal and uniform quality of the metal layers produced. This aim is achieved by physically limiting the organic additives to that part of the electrolyte in which they are relevant. The electrolyte is cycled through a filter in order to keep it free of organic additives. Topping up with organic additives is carried out as a function of additive losses immediately outside that part of the electrolyte in which the additives are relevant.
摘要翻译：本发明涉及一种用于从含电解质的金属的电解沉积的方法，以达到一定的物理性质，Prozessorganik的加法。这类添加剂在电镀期间受到恒定的消耗，形成从分解产物，其沉积在整个电镀，从而也对被处理材料的添加剂。因此，本发明是基于所述问题通过Organikrückstände以避免所沉积的层的相关的质量缺陷和以这种方式实现的金属层相同的质量连续的金属沉积。这是通过空间限制Prozessorganik的在电镀系统，其中，它是相关于该过程的电解质区域中的浓度来实现。再循环电解液是由自由Prozessorganik的过滤器举行。重新加入Prozessorganik的发生在依赖消费立即过程相关的范围之前。

35. 发明申请

WO1995018251A1 PROCESS AND DEVICE FOR ELECTROLYTIC PRECIPITATION OF METALLIC LAYERS 审中-公开
标题翻译：方法和装置的金属层电解分离
公开(公告)号：WO1995018251A1
公开(公告)日：1995-07-06
申请号：PCT/DE1994001542
申请日：1994-12-23
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER, Helga +hf , FROMME, Petra +hf , KAFTANSKI, Silke +hf , SCHUMACHER, Rolf , DAHMS, Wolfgang , SCHNEIDER, Reinhard
发明人： ATOTECH DEUTSCHLAND GMBH , MEYER, Helga +hf , FROMME, Petra +hf , KAFTANSKI, Silke +hf , MEYER, Walter +di
IPC分类号： C25D21/14
CPC分类号： C25D21/14 , Y10S205/92
摘要： No soluble anodes are used in the electrolytic precipitation of uniform metallic layers having determined physico-mechanical properties, in particular copper layers, as the geometric form of soluble anodes is modified by precipitation and the field line distribution in the electrolytic cells continuously changes. In order to solve the resulting problems, a process is disclosed according to which compounds of a redox system added to the precipitation solution are reacted during precipitation at the insoluble anodes. The resulting compounds draw new metal ions out of part of the reservoir that contains the metal to be precipitated in order to replace the metal ions precipitated from the solution. A process is thus disclosed in which the additive compounds are not destroyed, contrary to the state of the art.
摘要翻译：对于具有某些物理机械性能的电沉积均匀的金属层，尤其是铜，不可溶性阳极使用，因为它们的几何形状通过沉积改变，因此，磁力线分布的变化连续地在电解池中。为了解决在这方面的问题而产生的问题，一种方法已经被提出，其中，实现所述沉积氧化还原体系的不溶性阳极连接的沉积过程中加入。从金属的一部分释放的所得化合物至贮存器，以补充通过再次沉积金属离子萃取该溶液包含新的金属离子。本发明公开了一种方法，其中，添加剂化合物不被破坏，与现有技术不同。

36. 发明申请

WO1995004103A1 PROCESS FOR TREATING PLASTIC SURFACES AND SWELLING SOLUTION 审中-公开
标题翻译：了治疗塑料表面及ANQUELL解决方案
公开(公告)号：WO1995004103A1
公开(公告)日：1995-02-09
申请号：PCT/DE1994000877
申请日：1994-07-22
申请人： ATOTECH DEUTSCHLAND GMBH , SCHÄFER, Claus , MIDDEKE, Hermann-Josef
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C08J07/02
CPC分类号： H05K9/0084 , C08J7/02 , C23C18/208 , C23C18/24 , C23C18/30 , C25D5/56 , H05K3/381 , H05K2203/122
摘要： A process is disclosed for treating polymer-containing workpiece surfaces, as well as an aqueous non-ageing solution. In order to carry out the process, a solution is used that contains besides swelling agents, alkalising agents and basic salts, at least one supplementary solubilizing agent for the swelling agent contained in the solution, selected from the group of the organic compounds having the general formula: HO-A(OH)-R, in which A stands for a branched or non-branched alkylene chain, R for a branched or non-branched alkyl group or hydrogen, and A and R contain together at least three carbon atoms. This process and swelling solution may be used for metallizing polymers.
摘要翻译：本发明涉及一种用于处理含有的工件表面和含水非老化溶液聚合物的方法。在该方法中，溶液被用于其额外包含用于除了那些所使用的溶液中的溶胀剂的至少一种增溶剂溶胀溶胀选自具有以下通式的有机化合物的选择剂，碱化和碱性盐：HO-A（OH） -R，其中a是一个直链或支链的亚烷基，R是支链或无支链的烷基或氢，和a和R一起含有至少三个碳原子。方法和Anquell溶液可用于聚合物的金属化。

37. 发明申请

WO1993025345A2 PROCESS AND DEVICE FOR COOLING MICRO-DRILLS 审中-公开
标题翻译：方法和设备冷却微型钻头
公开(公告)号：WO1993025345A2
公开(公告)日：1993-12-23
申请号：PCT/DE1993000511
申请日：1993-06-07
申请人： ATOTECH DEUTSCHLAND GMBH , ZÜST, Harry , STRIEDIECK, Walter , PREUSSLER, Norbert , KNAFF, Jean-Claude
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： B23Q11/10
CPC分类号： H05K3/0047 , B23Q11/006 , B23Q11/1076 , C10M135/08 , C10M135/10 , C10M145/36 , C10M173/02 , C10M2201/02 , C10M2209/104 , C10M2209/108 , C10M2219/04 , C10M2219/042 , C10M2219/044 , C10N2240/40 , C10N2250/02 , H05K2203/082 , H05K2203/1121 , H05K2203/127
摘要： The invention concerns a process and a device for cooling micro-drills (1) used in boring machines for producing micro-bores in printed circuit boards (5), as well as for removing the waste material from the close neighbourhood of the bore. A cooling fluid from a supply line (11) flows against the micro-drill (1). The cooling fluid is accelerated by a gas under pressure. The thus projected cooling fluid jet cools down and lubricates the micro-borer (1), substantially increasing its service life.

38. 发明申请

WO1993017153A1 PROCESS FOR METALLIZING NON-CONDUCTING SURFACES, AND THE USE OF HYDROXYMETHYL SULPHINIC ACID IN THAT PROCESS 审中-公开
标题翻译：金属化非导电表面的方法，以及在该方法中羟基甲基硫酸的使用
公开(公告)号：WO1993017153A1
公开(公告)日：1993-09-02
申请号：PCT/DE1993000153
申请日：1993-02-17
申请人： ATOTECH DEUTSCHLAND GMBH , STAMP, Lutz , ZETTELMEYER-DECKER, Elisabeth , TIEMANN, Norbert
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C25D05/54
CPC分类号： C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0329 , H05K2203/0716 , H05K2203/0796 , H05K2203/122
摘要： The invention concerns a process for metallizing non-conducting surfaces, characterized by the following steps: a) caustic cleaning, where appropriate, b) conditionning using a chelate former and/or a cationic surface-active substance, c) caustic cleaning, where appropriate, d) treatment with a pre-dip solution, where appropriate, e) treatment with a colloidal acidic solution of a precious metal which is stabilized with an organic polymer, f) where appropriate, treatment with a solution containing one or more sulphur compounds, g) galvanic metallization.

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